TW201613009A - Semiconductor manufacturing device and method for manufacturing semiconductor device - Google Patents

Semiconductor manufacturing device and method for manufacturing semiconductor device

Info

Publication number
TW201613009A
TW201613009A TW104106094A TW104106094A TW201613009A TW 201613009 A TW201613009 A TW 201613009A TW 104106094 A TW104106094 A TW 104106094A TW 104106094 A TW104106094 A TW 104106094A TW 201613009 A TW201613009 A TW 201613009A
Authority
TW
Taiwan
Prior art keywords
ring
expanded sheet
semiconductor
manufacturing
adhesive layer
Prior art date
Application number
TW104106094A
Other languages
Chinese (zh)
Other versions
TWI579948B (en
Inventor
Tsutomu Fujita
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of TW201613009A publication Critical patent/TW201613009A/en
Application granted granted Critical
Publication of TWI579948B publication Critical patent/TWI579948B/en

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  • Dicing (AREA)

Abstract

One embodiment of the present invention is to suppress generation of undivided regions, while dividing an adhesive layer by extending an expanded sheet wherein a plurality of semiconductor parts are attached to the expanded sheet with the adhesive layer in between. The semiconductor manufacturing device of the embodiment includes: a second ring for pressing and connecting a processed object to an expanded sheet, in which the processed object includes a first ring, the expanded sheet fixed by the first ring, and a plurality of semiconductor parts that are attached to the expanded sheet with an adhesive layer in between and divided from each other; a third ring for pressing the first ring; and a driving mechanism for lifting at least one of the processed object and the second ring, so as to make a height difference between the first ring and the second ring to extend the expanded sheet. An outer periphery of the second ring or an inner periphery of the third ring is formed as follows: in contrast to a width of a first direction, a width of a second direction orthogonal to the first direction is smaller.
TW104106094A 2014-09-17 2015-02-25 Semiconductor manufacturing apparatus and manufacturing method of semiconductor device TWI579948B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014188530A JP6270671B2 (en) 2014-09-17 2014-09-17 Semiconductor manufacturing apparatus and semiconductor device manufacturing method

Publications (2)

Publication Number Publication Date
TW201613009A true TW201613009A (en) 2016-04-01
TWI579948B TWI579948B (en) 2017-04-21

Family

ID=55796148

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104106094A TWI579948B (en) 2014-09-17 2015-02-25 Semiconductor manufacturing apparatus and manufacturing method of semiconductor device

Country Status (3)

Country Link
JP (1) JP6270671B2 (en)
CN (1) CN105990187B (en)
TW (1) TWI579948B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6945152B2 (en) * 2016-10-28 2021-10-06 株式会社東京精密 Work splitting device
JP6820494B2 (en) * 2016-10-28 2021-01-27 株式会社東京精密 Work dividing device and work dividing method
JP6759524B2 (en) * 2016-10-28 2020-09-23 株式会社東京精密 Work dividing device and work dividing method
WO2018079536A1 (en) * 2016-10-28 2018-05-03 株式会社東京精密 Workpiece dividing device and workpiece dividing method
JP6896990B2 (en) * 2017-03-27 2021-06-30 株式会社東京精密 Work division method
JP7284439B2 (en) * 2018-01-11 2023-05-31 株式会社東京精密 Work dividing device and work dividing method
JP7110540B2 (en) * 2018-01-11 2022-08-02 株式会社東京精密 Work dividing device and work dividing method
JP2020072139A (en) * 2018-10-30 2020-05-07 株式会社ディスコ Extension method of wafer and extension device of wafer
JP7221649B2 (en) * 2018-10-30 2023-02-14 株式会社ディスコ Wafer expansion method and wafer expansion device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3017827B2 (en) * 1991-03-26 2000-03-13 沖電気工業株式会社 Wafer ring holding mechanism in die bonding equipment
JPH09190988A (en) * 1996-01-11 1997-07-22 Toshiba Mechatronics Kk Sheet expanding device
JPH11233458A (en) * 1998-02-18 1999-08-27 Hitachi Ltd Manufacture of semiconductor element and semiconductor wafer used therein
US7005317B2 (en) * 2003-10-27 2006-02-28 Intel Corporation Controlled fracture substrate singulation
JP2006310691A (en) * 2005-05-02 2006-11-09 Hugle Electronics Inc Foldaway film sheet extension method and expander therefor
JP4714950B2 (en) * 2005-11-18 2011-07-06 株式会社東京精密 Expanding ring and substrate dividing method using the expanding ring
JP2007250598A (en) * 2006-03-14 2007-09-27 Renesas Technology Corp Process for manufacturing semiconductor device
JP2010219267A (en) * 2009-03-17 2010-09-30 Toshiba Corp Manufacturing method for semiconductor device
JP2010275509A (en) * 2009-06-01 2010-12-09 Furukawa Electric Co Ltd:The Tacky adhesive film and tape for processing semiconductor wafer
JP4976522B2 (en) * 2010-04-16 2012-07-18 日東電工株式会社 Thermosetting die bond film, dicing die bond film, and semiconductor device manufacturing method
JP2012243970A (en) * 2011-05-20 2012-12-10 Ngk Spark Plug Co Ltd Method for transferring unit piece of ceramic wiring substrate and transfer device therefor
JP6055369B2 (en) * 2012-09-28 2016-12-27 株式会社東芝 Semiconductor device manufacturing apparatus and semiconductor device manufacturing method
CN108807253B (en) * 2012-12-26 2023-05-02 株式会社力森诺科 Expansion method, semiconductor device manufacturing method, and semiconductor device

Also Published As

Publication number Publication date
TWI579948B (en) 2017-04-21
CN105990187B (en) 2019-02-15
CN105990187A (en) 2016-10-05
JP6270671B2 (en) 2018-01-31
JP2016063016A (en) 2016-04-25

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