JP2017504959A - 光学式センサ組立体および光学式センサ組立体の製造方法 - Google Patents
光学式センサ組立体および光学式センサ組立体の製造方法 Download PDFInfo
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Abstract
Description
11 : メタライジング接続パターン
13 : 側壁絶縁部
14 : さらなる金属層
16 : さらなるハンドリングウェーハ
19 : さらなるコンタクト領域
2 : 第2の層
21 : 貫通シリコンビア(TSV)接続部
22 : 第2の光バリア
23 : 主表面
24 : 他の主表面
25 : バンプ
26 : ボンディングワイヤ
27 : マイクロバンプ
3 : モールド層
31 : 第1の開口部
32 : 第2の開口部
33 : 第1の光バリア
35 : 側壁
4 : カバー層
41 : 光学素子
5 : 別の主表面
6 : さらなるハンドリングウェーハ
7 : 誘電体層
8 : さらなる誘電体層
9 : コンタクト領域
IC : ドライバ回路
LED : 発光デバイス
PD : 光検出器
Claims (14)
- 光学式センサ組立体、具体的には3次元の集積回路を備えた光学式近接センサ組立体であって、
発光デバイス(LED)を備える第1の層(1)と、光検出器(PD)を備える第2の層(2)と、当該発光デバイス(LED)および当該光検出器(PD)に電気的に接続され、当該発光デバイス(LED)および当該光検出デバイス(PD)の動作を制御するように構成されたドライバ回路(IC)とを備え、前記第2の層(2)は、基板に組み込まれた複数のシリコン貫通ビアを備える第2の光バリア(22)を備え、
前記発光デバイス(LED)と前記光検出器(PD)との間に、直接前記発光デバイス(LED)から前記光検出器(PD)に伝送される光を遮断するように構成されている第1の光バリア(33)を備えるモールド層(3)を備える、
ことを特徴とする光学式センサ組立体。 - 前記モールド層(3)は、光学的に不透明な材料から成っていることを特徴とする、請求項1に記載の光学式センサ組立体。
- 前記モールド層(3)は、ウェーハレベルモールド構造を備えることを特徴とする、請求項1または2に記載の光学式センサ組立体。
- 前記モールド層は、少なくとも部分的に前記第2の層(2)の主表面(23)に結合され、前記発光デバイス(LED)からの光が前記第1の開口部(31)を通って放出され得るように、前記第1の層(1)が取り付けられている第1の開口部(31)を備えることを特徴とする、請求項1乃至3のいずれか1項に記載の光学式センサ組立体。
- 前記モールド層(3)は、光が前記光検出器(PD)に到達し得るように、前記光検出器(PD)が取り付けられている第2の開口部(32)を備えることを特徴とする、請求項4に記載の光学式センサ組立体。
- 前記第2の層(2)は、前記光検出器(PD)および前記ドライバ回路(IC)が集積されている基板を備えることを特徴とする、請求項1乃至5のいずれか1項に記載の光学式センサ組立体。
- 前記基板は、特に再配線層または埋め込まれたウェーハレベルボールグリッドアレイに接続された、能動的なインタポーザを備えることを特徴とする、請求項6に記載の光学式センサ組立体。
- 前記発光デバイス(LED)は、メタライジング接続パターン(11)、ボンディングワイヤ(26)、または再配線層を用いて、前記第2の層(2)に電気的に接続されていることを特徴とする、請求項1乃至7のいずれか1項に記載の光学式センサ組立体。
- 前記第1の層(1)は、前記第2の層(2)の主表面(23)に積層されているか、または
前記第1の層(1)は、前記第2の層(2)に形成された沈下部に埋設されているか、または
前記第1の層(1)は、前記第2の層(2)の主表面(23)の反対側の他の主表面(24)に積層され、前記開口部(31)は、前記第2の層(2)を貫通して延伸している、
ことを特徴とする、請求項請求項1乃至8のいずれか1項に記載の光学式センサ組立体。 - 前記光検出器(PD)および/または前記発光デバイス(LED)は、光学素子(41)によって覆われており、当該光学素子(41)はレンズおよび/またはゾーンプレートであり、特にナノインプリントされたレンズであることを特徴とする、請求項1乃至9のいずれか1項に記載の光学式センサ組立体。
- 光学式センサ組立体を製造する方法、特に光学式近接センサ組立体を製造する方法であって、
発光デバイス(LED)を第1の層(1)に組み込むステップと、
光検出器(PD)およびドライバ回路(IC)を第2の層(2)に集積するステップであって、当該第2の層(2)が、基板に組み込まれた複数のシリコン貫通ビアを備える第2の光バリア(22)を備えるステップと、
前記発光デバイス(LED)を前記ドライバ回路(IC)および前記光検出器(PD)に電気的に接続するステップと、
前記発光デバイス(LED)と前記光検出器(PD)との間に、直接前記発光デバイス(LED)から前記光検出器(PD)に伝送される光を遮断するように構成されている第1の光バリア(33)を備えるモールド層(3)をモールドするモールドステップと、
前記第1の層(1)、前記第2の層(2)、および前記モールド層(3)を3次元的な集積回路に組み込むステップと、
を備えることを特徴とする方法。 - 前記モールドステップは、特に光学的に不透明な材料を用いたウェーハレベルのモールドを含むことを特徴とする、請求項11に記載の方法。
- 前記第1の層(1)は、前記第2の層(2)上に積層され、特にダイのウェーハへの積層(die-to-wafer stacking)を用いて積層され、前記第1の層(1)は、メタライジング接続パターン(11)、ボンディングワイヤ(26)、または再配線層を用いて、特に複数の貫通シリコンビアを用いたメタライジング接続パターンを用いて、前記第2の層(2)に電気的に接続されているか、または、
前記第1の層は、前記第2の層(2)に形成された凹部へ埋設されている、
ことを特徴とする、請求項11または12に記載の方法。 - さらに、前記モールド層(3)を少なくとも部分的に前記第2の層(2)の主表面(23)に結合するステップと、第1の開口部(31)を、前記発光デバイス(LED)からの光が当該第1の開口部(31)を通って放出されるように、前記第1の層(1)が取り付けられている前記モールド層(3)に設けるステップと、および/または、
光が前記光検出器(PD)の到達して検出され得るように、前記光検出器(PD)が取り付けられる第2の開口部(32)を設けるステップと、
を備えることを特徴とする、請求項11乃至13のいずれか1項に記載の方法。
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020068264A (ja) * | 2018-10-23 | 2020-04-30 | 旭化成エレクトロニクス株式会社 | 光デバイス |
JP2020537818A (ja) * | 2017-10-18 | 2020-12-24 | オスラム オーエルイーディー ゲゼルシャフト ミット ベシュレンクテル ハフツングOSRAM OLED GmbH | 半導体デバイス |
US11293966B2 (en) | 2019-05-31 | 2022-04-05 | Advantest Corporation | Test apparatus for determining pass or fail of LEDs, test method and computer-readable medium |
WO2022132042A1 (en) * | 2020-12-14 | 2022-06-23 | Ams Sensors Singapore Pte. Ltd. | Wafer-level manufacture of optical packages |
US11788885B2 (en) | 2021-02-26 | 2023-10-17 | Advantest Corporation | Test apparatus, test method, and computer-readable storage medium |
US11800619B2 (en) | 2021-01-21 | 2023-10-24 | Advantest Corporation | Test apparatus, test method, and computer-readable storage medium |
WO2024029086A1 (ja) * | 2022-08-05 | 2024-02-08 | 株式会社レゾナック | 電子部品装置及び電子部品装置の製造方法 |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6221582B2 (ja) * | 2013-09-30 | 2017-11-01 | セイコーエプソン株式会社 | 超音波デバイスおよびプローブ並びに電子機器および超音波画像装置 |
US9305967B1 (en) * | 2015-04-16 | 2016-04-05 | Intersil Americas LLC | Wafer Level optoelectronic device packages and methods for making the same |
EP3121853B1 (en) | 2015-07-23 | 2022-01-19 | ams AG | Method of producing an optical sensor at wafer-level and optical sensor |
US10061057B2 (en) * | 2015-08-21 | 2018-08-28 | Stmicroelectronics (Research & Development) Limited | Molded range and proximity sensor with optical resin lens |
US11069667B2 (en) * | 2016-03-31 | 2021-07-20 | Stmicroelectronics Pte Ltd | Wafer level proximity sensor |
US11226402B2 (en) * | 2016-06-09 | 2022-01-18 | Ams Sensors Singapore Pte. Ltd. | Optical ranging systems including optical cross-talk reducing features |
US9911890B2 (en) * | 2016-06-30 | 2018-03-06 | Stmicroelectronics Pte Ltd | Optical sensor package including a cavity formed in an image sensor die |
WO2018089795A1 (en) | 2016-11-10 | 2018-05-17 | Qoravita LLC | System and method for applying a low frequency magnetic field to biological tissues |
EP3340296B1 (en) * | 2016-12-20 | 2019-10-02 | Melexis Technologies NV | Light emitting diode device |
US10276764B2 (en) * | 2016-12-21 | 2019-04-30 | Glo Ab | Micro-lensed light emitting device |
DE102017110216B4 (de) * | 2017-05-11 | 2023-03-09 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Sensormodul und Verfahren zur Herstellung eines optoelektronischen Sensormoduls |
CN107329589B (zh) * | 2017-06-29 | 2020-03-27 | 努比亚技术有限公司 | 一种功能按键的控制装置 |
DE102017124815B4 (de) * | 2017-06-30 | 2019-10-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photonisches Package und Verfahren zu dessen Bildung |
US10267988B2 (en) | 2017-06-30 | 2019-04-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photonic package and method forming same |
US10461744B2 (en) | 2017-09-21 | 2019-10-29 | Google Llc | Proximity sensor connection mechanism |
EP3470872B1 (en) * | 2017-10-11 | 2021-09-08 | Melexis Technologies NV | Sensor device |
CN108226955B (zh) * | 2017-12-26 | 2020-04-14 | 杭州艾米机器人有限公司 | 红外阵列接近传感器 |
TWI672786B (zh) * | 2017-12-28 | 2019-09-21 | 英屬開曼群島商鳳凰先驅股份有限公司 | 電子封裝件及其製法 |
DE102018100946A1 (de) * | 2018-01-17 | 2019-07-18 | Osram Opto Semiconductors Gmbh | Bauteil und verfahren zur herstellung eines bauteils |
TWI757588B (zh) * | 2018-03-05 | 2022-03-11 | 精材科技股份有限公司 | 晶片封裝體及其製造方法 |
US11143551B2 (en) * | 2018-05-18 | 2021-10-12 | Hana Microelectronics, Inc. | Proximity sensor with infrared ink coating |
FR3081256B1 (fr) | 2018-05-18 | 2020-07-31 | St Microelectronics Grenoble 2 | Circuit d'emission/reception optique |
FR3081257B1 (fr) | 2018-05-18 | 2020-07-31 | St Microelectronics Grenoble 2 | Circuit d'emission/reception optique |
EP3620813A1 (en) * | 2018-09-04 | 2020-03-11 | ams AG | Optical sensor arrangement, device and method of manufacturing an optical sensor arrangement |
US11520074B2 (en) | 2018-09-14 | 2022-12-06 | Hana Microelectronics, Inc. | Proximity sensor with light blocking barrier comprising a gap having a cross-section with parallel walls between emitter and detector |
US11244937B2 (en) * | 2018-10-09 | 2022-02-08 | Industrial Technology Research Institute | Spliced display with LED modules disposed on transparent substrate |
TWI680593B (zh) * | 2018-10-12 | 2019-12-21 | 欣興電子股份有限公司 | 發光元件封裝結構及其製造方法 |
DE102018218166A1 (de) * | 2018-10-24 | 2020-04-30 | Osram Gmbh | Abstandsmesseinheit |
DE102018127627B4 (de) * | 2018-11-06 | 2020-08-20 | Sick Ag | Optoelektronische Sensorvorrichtung |
US11567198B2 (en) | 2019-03-25 | 2023-01-31 | Hana Microelectronics Inc. | Proximity sensor with light inhibiting barrier comprising a gap having a cross-section with parallel walls substantially perpendicular to the top surface of an optically transmissive material |
US11662435B2 (en) * | 2019-04-04 | 2023-05-30 | Liturex (Guangzhou) Co. Ltd | Chip scale integrated scanning LiDAR sensor |
US11383970B2 (en) * | 2019-07-09 | 2022-07-12 | Amkor Technology Singapore Holding Pte. Ltd. | Semiconductor devices and related methods |
US11262966B2 (en) | 2019-09-27 | 2022-03-01 | Apple Inc. | Electromagnetic band gap structures |
US11862749B2 (en) * | 2019-12-06 | 2024-01-02 | Adesto Technologies Corporation | Integrated module assembly for optical integrated circuits |
US11594663B2 (en) | 2019-12-20 | 2023-02-28 | Nanosys, Inc. | Light emitting diode device containing a micro lens array and method of making the same |
US11828944B1 (en) * | 2020-04-09 | 2023-11-28 | Apple Inc. | Head-mounted device with optical module illumination systems |
DE102021104189A1 (de) | 2021-02-22 | 2022-08-25 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Sensorvorrichtung |
WO2023003514A1 (en) * | 2021-07-23 | 2023-01-26 | Ams-Osram Asia Pacific Pte. Ltd. | Sensor package and method of manufacturing a sensor package |
WO2023180021A1 (en) * | 2022-03-21 | 2023-09-28 | Sony Semiconductor Solutions Corporation | Time-of-flight system and method |
DE102022124732A1 (de) * | 2022-09-26 | 2024-03-28 | Ams-Osram International Gmbh | Verfahren zur herstellung eines optoelektronischen bauteils und optoelektronisches bauteil |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63102379A (ja) * | 1986-09-30 | 1988-05-07 | シーメンス、アクチエンゲゼルシヤフト | 反射光障壁およびその製造方法 |
JPH07312443A (ja) * | 1994-03-23 | 1995-11-28 | Nippondenso Co Ltd | 半導体装置 |
JP2002170984A (ja) * | 2000-12-04 | 2002-06-14 | Sumitomo Electric Ind Ltd | 光通信装置 |
JP2006203111A (ja) * | 2005-01-24 | 2006-08-03 | Hosiden Corp | 物体検出センサ |
JP2007199328A (ja) * | 2006-01-26 | 2007-08-09 | Fuji Xerox Co Ltd | 光接続装置 |
JP2010034189A (ja) * | 2008-07-28 | 2010-02-12 | Sharp Corp | 光学式近接センサ及びその製造方法並びに当該光学式近接センサを搭載した電子機器 |
US8212202B2 (en) * | 2009-01-08 | 2012-07-03 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Reflective optical encoder package and method |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19859669A1 (de) * | 1998-12-23 | 2000-06-29 | Heidenhain Gmbh Dr Johannes | Integrierter optoelektronischer Sensor und Verfahren zu dessen Herstellung |
JP2001024150A (ja) | 1999-07-06 | 2001-01-26 | Sony Corp | 半導体装置 |
DE10309747B4 (de) * | 2002-03-07 | 2011-11-24 | CiS Institut für Mikrosensorik gGmbH | Auflichtsensor und Verfahren zu seiner Herstellung |
DE10352741B4 (de) | 2003-11-12 | 2012-08-16 | Austriamicrosystems Ag | Strahlungsdetektierendes optoelektronisches Bauelement, Verfahren zu dessen Herstellung und Verwendung |
JP4252019B2 (ja) | 2004-09-01 | 2009-04-08 | 三洋電機株式会社 | 回路装置およびその製造方法 |
JP4061409B2 (ja) * | 2004-11-09 | 2008-03-19 | 国立大学法人九州大学 | センサ部及び生体センサ |
KR100721353B1 (ko) | 2005-07-08 | 2007-05-25 | 삼성전자주식회사 | 칩 삽입형 매개기판의 구조와 제조 방법, 이를 이용한 이종칩의 웨이퍼 레벨 적층 구조 및 패키지 구조 |
JP2007027621A (ja) * | 2005-07-21 | 2007-02-01 | Rohm Co Ltd | 面実装型フォトインタラプタとその製造方法 |
JP4871344B2 (ja) * | 2008-11-25 | 2012-02-08 | 株式会社東芝 | 発光装置及びその製造方法 |
US7838337B2 (en) | 2008-12-01 | 2010-11-23 | Stats Chippac, Ltd. | Semiconductor device and method of forming an interposer package with through silicon vias |
US8097964B2 (en) | 2008-12-29 | 2012-01-17 | Texas Instruments Incorporated | IC having TSV arrays with reduced TSV induced stress |
US8324602B2 (en) | 2009-04-14 | 2012-12-04 | Intersil Americas Inc. | Optical sensors that reduce specular reflections |
US8779361B2 (en) * | 2009-06-30 | 2014-07-15 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Optical proximity sensor package with molded infrared light rejection barrier and infrared pass components |
US8587129B2 (en) | 2009-07-31 | 2013-11-19 | Stats Chippac Ltd. | Integrated circuit packaging system with through silicon via base and method of manufacture thereof |
US20110089531A1 (en) | 2009-10-16 | 2011-04-21 | Teledyne Scientific & Imaging, Llc | Interposer Based Monolithic Microwave Integrate Circuit (iMMIC) |
US20110186960A1 (en) | 2010-02-03 | 2011-08-04 | Albert Wu | Techniques and configurations for recessed semiconductor substrates |
US8492720B2 (en) | 2010-06-08 | 2013-07-23 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Small low-profile optical proximity sensor |
US8518746B2 (en) | 2010-09-02 | 2013-08-27 | Stats Chippac, Ltd. | Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die |
US8928159B2 (en) | 2010-09-02 | 2015-01-06 | Taiwan Semiconductor Manufacturing & Company, Ltd. | Alignment marks in substrate having through-substrate via (TSV) |
TWI434387B (zh) | 2010-10-11 | 2014-04-11 | Advanced Semiconductor Eng | 具有穿導孔之半導體裝置及具有穿導孔之半導體裝置之封裝結構及其製造方法 |
US9398694B2 (en) | 2011-01-18 | 2016-07-19 | Sony Corporation | Method of manufacturing a package for embedding one or more electronic components |
FR2973573A1 (fr) | 2011-04-01 | 2012-10-05 | St Microelectronics Grenoble 2 | Boitier semi-conducteur comprenant un dispositif semi-conducteur optique |
JP5399525B2 (ja) * | 2011-06-29 | 2014-01-29 | シャープ株式会社 | 光学式測距装置および電子機器 |
FR2977714B1 (fr) * | 2011-07-08 | 2013-07-26 | St Microelectronics Grenoble 2 | Boitier electronique optique |
US9385058B1 (en) | 2012-12-29 | 2016-07-05 | Monolithic 3D Inc. | Semiconductor device and structure |
US9525094B2 (en) * | 2015-03-27 | 2016-12-20 | Stmicroelectronics (Grenoble 2) Sas | Proximity and ranging sensor |
-
2013
- 2013-12-20 EP EP13199086.3A patent/EP2881753B1/en active Active
-
2014
- 2014-12-03 JP JP2016536703A patent/JP6466943B2/ja active Active
- 2014-12-03 US US15/101,893 patent/US9684074B2/en active Active
- 2014-12-03 CN CN201480065588.7A patent/CN105793727B/zh active Active
- 2014-12-03 WO PCT/EP2014/076420 patent/WO2015082549A1/en active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63102379A (ja) * | 1986-09-30 | 1988-05-07 | シーメンス、アクチエンゲゼルシヤフト | 反射光障壁およびその製造方法 |
JPH07312443A (ja) * | 1994-03-23 | 1995-11-28 | Nippondenso Co Ltd | 半導体装置 |
JP2002170984A (ja) * | 2000-12-04 | 2002-06-14 | Sumitomo Electric Ind Ltd | 光通信装置 |
JP2006203111A (ja) * | 2005-01-24 | 2006-08-03 | Hosiden Corp | 物体検出センサ |
JP2007199328A (ja) * | 2006-01-26 | 2007-08-09 | Fuji Xerox Co Ltd | 光接続装置 |
JP2010034189A (ja) * | 2008-07-28 | 2010-02-12 | Sharp Corp | 光学式近接センサ及びその製造方法並びに当該光学式近接センサを搭載した電子機器 |
US8212202B2 (en) * | 2009-01-08 | 2012-07-03 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Reflective optical encoder package and method |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020537818A (ja) * | 2017-10-18 | 2020-12-24 | オスラム オーエルイーディー ゲゼルシャフト ミット ベシュレンクテル ハフツングOSRAM OLED GmbH | 半導体デバイス |
US11735682B2 (en) | 2017-10-18 | 2023-08-22 | Osram Oled Gmbh | Semiconductor device |
JP2020068264A (ja) * | 2018-10-23 | 2020-04-30 | 旭化成エレクトロニクス株式会社 | 光デバイス |
JP7368081B2 (ja) | 2018-10-23 | 2023-10-24 | 旭化成エレクトロニクス株式会社 | 光デバイス |
US11293966B2 (en) | 2019-05-31 | 2022-04-05 | Advantest Corporation | Test apparatus for determining pass or fail of LEDs, test method and computer-readable medium |
WO2022132042A1 (en) * | 2020-12-14 | 2022-06-23 | Ams Sensors Singapore Pte. Ltd. | Wafer-level manufacture of optical packages |
US11800619B2 (en) | 2021-01-21 | 2023-10-24 | Advantest Corporation | Test apparatus, test method, and computer-readable storage medium |
US11788885B2 (en) | 2021-02-26 | 2023-10-17 | Advantest Corporation | Test apparatus, test method, and computer-readable storage medium |
WO2024029086A1 (ja) * | 2022-08-05 | 2024-02-08 | 株式会社レゾナック | 電子部品装置及び電子部品装置の製造方法 |
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