US11383970B2 - Semiconductor devices and related methods - Google Patents

Semiconductor devices and related methods Download PDF

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US11383970B2
US11383970B2 US16/505,957 US201916505957A US11383970B2 US 11383970 B2 US11383970 B2 US 11383970B2 US 201916505957 A US201916505957 A US 201916505957A US 11383970 B2 US11383970 B2 US 11383970B2
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US20210009406A1 (en
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Sung Jae Oh
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Amkor Technology Singapore Holding Pte Ltd
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Amkor Technology Singapore Holding Pte Ltd
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Assigned to Amkor Technology Singapore Holding Pte. Ltd. reassignment Amkor Technology Singapore Holding Pte. Ltd. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AMKOR TECHNOLOGY KOREA, INC.
Priority to KR1020200079275A priority patent/KR20210006849A/en
Priority to TW109122255A priority patent/TW202116661A/en
Priority to CN202010640045.0A priority patent/CN112216682A/en
Publication of US20210009406A1 publication Critical patent/US20210009406A1/en
Priority to US17/862,609 priority patent/US20230002217A1/en
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    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
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    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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Definitions

  • the present disclosure relates, in general, to electronic devices, and more particularly, to semiconductor devices and methods for manufacturing semiconductor devices.
  • FIG. 1 shows a cross-sectional view of an example semiconductor device.
  • FIG. 2 shows perspective view of an example method for manufacturing an example semiconductor device.
  • FIGS. 3A and 3B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIGS. 4A and 4B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIGS. 5A, 5B, 5C and 5D show perspective, cross-sectional, top plane and enlarged cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIGS. 6A, 6B and 6C show perspective, cross-sectional and enlarged cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIGS. 7A, 7B and 7C show perspective, cross-sectional and enlarged cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIGS. 8A, 8B and 8C show perspective, cross-sectional and enlarged cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIGS. 9A and 9B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIGS. 10A and 10B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIG. 11 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIG. 12 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIG. 13 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIG. 14 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIG. 15 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIG. 16 shows a cross-sectional view of an example semiconductor device.
  • FIG. 17 shows perspective view of an example method for manufacturing an example semiconductor device.
  • FIGS. 18A and 18B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIGS. 19A and 19B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIGS. 20A and 20B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIGS. 21A and 21B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIGS. 22A and 22B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIGS. 23A and 23B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIGS. 24A and 24B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIGS. 25A and 25B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIGS. 26A and 26B show top plane and cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIGS. 27A and 27B show top plane and cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIG. 28 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIG. 29 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIG. 30 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIG. 31 shows a cross-sectional view of an example semiconductor device.
  • FIGS. 32A and 32B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIGS. 33A and 33B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIGS. 34A, 34B and 34C show perspective, cross-sectional and top plane view of an example method for manufacturing an example semiconductor device.
  • FIGS. 35A and 35B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIGS. 36A and 36B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIGS. 37A and 37B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIGS. 38A and 38B show top plane and cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIGS. 39A and 39B show top plane and cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIGS. 40A and 40B show top plane and cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIG. 41 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIG. 42 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIG. 43 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIG. 44 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIG. 45 shows a cross-sectional view of an example semiconductor device.
  • FIGS. 46A, 46B, 46C and 46D show perspective, top plane, cross-sectional and enlarged cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIGS. 47A, 47B and 47C show perspective, cross-sectional and enlarged cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIGS. 48A, 48B and 48C show perspective, cross-sectional and enlarged cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIGS. 49A, 49B, 49C and 49D show perspective, cross-sectional, top plane and enlarged cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIGS. 50A and 50B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIGS. 51A and 51B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIGS. 52A and 52B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIG. 53 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIG. 54 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIG. 55 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
  • FIG. 56 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
  • x or y means any element of the three-element set ⁇ (x), (y), (x, y) ⁇ .
  • x, y, or z means any element of the seven-element set ⁇ (x), (y), (z), (x, y), (x, z), (y, z), (x, y, z) ⁇ .
  • coplanar can describe surfaces that, within manufacturing tolerances, extend along or adjacent a same plane. In some examples, surfaces can be coplanar when they extend adjacent the same plane substantially parallel to each other within approximately 10 microns.
  • first may be used herein to describe various elements, and these elements should not be limited by these terms. These terms are only used to distinguish one element from another. Thus, for example, a first element discussed in this disclosure could be termed a second element without departing from the teachings of the present disclosure.
  • Coupled may be used to describe two elements directly contacting each other or describe two elements indirectly connected by one or more other elements.
  • element A is coupled to element B, then element A can be directly contacting element B or indirectly connected to element B by an intervening element C.
  • the terms “over” or “on” may be used to describe two elements directly contacting each other or describe two elements indirectly connected by one or more other elements.
  • an electronic device can comprise (a) a first substrate comprising a first substrate top side, a first substrate bottom side, a first substrate sidewall, a first encapsulant extending from the first substrate bottom side to the first substrate top side, and a first substrate interconnect extending from the substrate bottom side to the substrate top side and coated by the first encapsulant, (b) a first electronic component embedded in the first substrate and comprising a first component top side, a first component bottom side, and a first component sidewall coated by the first encapsulant, (c) a second electronic component on the first substrate and comprising a second component top side comprising a second component terminal and a second active region, a second component bottom side coupled to the first substrate top side, and a second component sidewall, (d) a first internal interconnect coupling the second component terminal to the first substrate interconnect, and (e) a cover structure on the first substrate and covering the second component sidewall and the first internal interconnect.
  • an electronic device can comprise (a) a first substrate comprising a first substrate top side, a first substrate bottom side, a first substrate sidewall, a first encapsulant extending from the first substrate bottom side to the first substrate top side, a first substrate interconnect extending from the substrate bottom side to the substrate top side and coated by the first encapsulant, and a second substrate interconnect extending from the substrate bottom side to the substrate top side and coated by the first encapsulant (b) a first electronic component coupled to the first substrate and comprising a first component top side exposed from the first encapsulant and comprising a first component terminal and a first active region, a first component bottom side, and a first component sidewall coated by the first encapsulant, (c) a second electronic component coupled to the first substrate and comprising a second component top side exposed from the first encapsulant and comprising a second component terminal and a second active region, a second component bottom side, and a second component sidewall coated by the first encapsulant (d)
  • a method can comprise (a) providing a first substrate comprising a first encapsulant extending from a first substrate bottom side to a first substrate top side, and a first substrate interconnect extending from the substrate bottom side to the substrate top side, (b) providing a first electronic component coupled to the first substrate and comprising a first component top side exposed from the substrate top side, a first component bottom side, a first active region, and a first component sidewall between the first component top side and the first component bottom side, (c) providing a second electronic component coupled to the first substrate and comprising, a second component top side exposed from the substrate top side, a second component bottom side, a second active region, and a second component sidewall between the second component top side and the second component bottom side, (d) providing a first internal interconnect coupling the second electronic component to the first substrate interconnect, and (e) providing a cover structure on the first substrate; wherein providing the first substrate can comprise providing the first encapsulant coating the first component sidewall and the first substrate interconnect.
  • FIG. 1 shows a cross-sectional view of an example semiconductor device 100 .
  • semiconductor device 100 can comprise a substrate 110 , electronic components 120 and 130 , a cap 140 , an cover structure 150 , external interconnects 160 , adhesives 170 A and 1708 and internal interconnects 180 A and 1808 .
  • Substrate 110 can comprise an encapsulant 115 and substrate interconnects 112 .
  • Electronic component 120 can comprise a terminal 121 .
  • Electronic component 130 can comprise a terminal 131 and a MEMS (Micro-Electro Mechanical System) region 132 .
  • MEMS Micro-Electro Mechanical System
  • Substrate 110 , cap 140 , cover structure 150 , external interconnects 160 , adhesives 170 A and 1708 and internal interconnects 180 A and 1808 can be referred to as a semiconductor package 190 , and can provide electronic components 120 and 130 with protection from external elements and/or environmental exposure. Additionally, semiconductor package 190 can provide electrical coupling between an external component and external interconnects 160 .
  • FIGS. 2 to 15 show various drawings of an example method for manufacturing semiconductor device 100 .
  • FIG. 2 shows perspective view of an example method for manufacturing an example semiconductor device 100 at an early stage of manufacture.
  • a substantially planar carrier 101 can be prepared.
  • Carrier 101 can be referred to as a plate, a board, a wafer, a panel or a strip.
  • Carrier 101 can include, for example, but not limited to, steel, stainless steel, aluminum, copper, glass or a wafer.
  • Carrier 101 can have a thickness in the range from approximately 500 ⁇ m (micrometers) to approximately 1500 ⁇ m.
  • Carrier 101 can allow handling of multiple components, during attachment of electronic components 120 and 130 , encapsulation, formation of an opening in encapsulant 115 , and plating and/or formation of interconnections, in an integrated manner.
  • Carrier 101 can be commonly applied to different examples of this disclosure.
  • Temporary bond layer 102 can be formed on a surface of carrier 101 .
  • Temporary bond layer 102 can be formed on the surface of carrier 101 using a coating process, such as spin coating, doctor blade, casting, painting, spray coating, slot die coating, curtain coating, slide coating or knife over edge coating; a printing process, such as screen printing, pad printing, gravure printing, flexographic coating or offset printing; an inkjet printing process with features intermediate between coating and printing; or direct attachment of an adhesive film or an adhesive tape.
  • Temporary bond layer 102 can be referred to as a temporary adhesive film or a temporary adhesive tape.
  • Temporary bond layer 102 can be, for example, a thermally releasable tape (film) or a UV releasable tape (film), and/or can be weakened in its bonding strength or is removed by heat or UV irradiation. In some examples, temporary bond layer 102 can have a weakened bonding strength or can be removed by physical and/or chemical external forces. Temporary bond layer 102 can have a thickness in the range from approximately 50 ⁇ m to approximately 150 ⁇ m. Temporary bond layer 102 can allow separation of carrier 101 to form external interconnects 160 . Temporary bond layer 102 can be commonly applied to different examples of this disclosure.
  • Conductive layer 103 can be formed on a surface of temporary bond layer 102 .
  • Conductive layer 103 can be referred to as a seed layer or a base layer.
  • conductive layer 103 can be made of, but not limited to, titanium, tungsten, titanium/tungsten, copper, gold, silver, palladium, or nickel.
  • conductive layer 103 can be formed using, but not limited to, sputtering, electroless plating, electroplating, physical vapor deposition (PVD), chemical vapor deposition (CVD), metal organic chemical vapor deposition (MOCVD), atomic layer deposition (ALD), low pressure chemical vapor deposition (LPCVD), or plasma enhanced chemical vapor deposition (PECVD).
  • Conductive layer 103 can have a thickness in the range from approximately 500 ⁇ to approximately 3000 ⁇ . Conductive layer 103 can facilitate forming substrate interconnects 112 at a later stage of manufacture. Conductive layer 103 can be commonly applied to different examples of this disclosure.
  • FIGS. 3A and 3B show perspective and cross-sectional views semiconductor device 100 at a later stage of manufacture.
  • electronic component 120 can be adhered to conductive layer 103 provided on carrier 101 .
  • electronic component 120 can be arrayed on or adhered to conductive layer 103 in a matrix configuration having rows and/or columns.
  • electronic component 120 can be adhered to conductive layer 103 using an adhesive, an adhesive film or an adhesive tape.
  • Electronic component 120 can have a top side, a bottom side opposite to the top side, and a sidewall connecting the top side and the bottom side.
  • the top side can have an active region
  • the bottom side can have a non-active region.
  • the bottom side of electronic component 120 can be adhered to conductive layer 103 of carrier 101 .
  • the top side of electronic component 120 can comprise at least one terminal 121 .
  • terminal 121 can comprise or be referred to as a die pad, a bond pad, or a solder bump, or a pillar bump.
  • Terminal 121 can have a width in the range from approximately 2 ⁇ m to approximately 80 ⁇ m.
  • Electronic component 120 can be referred to as a semiconductor die or a semiconductor chip.
  • the active region of electronic component 120 can comprise processing circuitry to process an electrical signal received from electronic component 130 .
  • the active region of electronic component 120 can comprise an application specific integrated circuit, a logic die, a micro control unit, a memory, a digital signal processor, an analog to digital converter, a network processor, a power management unit, an audio processor, an RF circuit, or a wireless baseband system on chip processor.
  • Electronic component 120 can have a thickness in the range from approximately 50 ⁇ m to approximately 200 ⁇ m.
  • FIGS. 4A and 4B show perspective and cross-sectional view of semiconductor device 100 at a later stage of manufacture.
  • encapsulant 115 can be formed on surfaces of conductive layer 103 and electronic component 120 , such that electronic component 120 is embedded in substrate 110 .
  • encapsulant 115 can coat or be brought into contact with the sidewall of electronic component 120 .
  • encapsulant 115 can be brought into contact with a surface of conductive layer 103 not overlapping the bottom side of electronic component 120 .
  • the top side of electronic component 120 can be substantially coplanar with the top side of encapsulant 115 , and the top side of electronic component 120 can be exposed through the top side of encapsulant 115 .
  • the bottom side of electronic component 120 can be substantially coplanar with the bottom side of encapsulant 115 , and the bottom side of electronic component 120 can be exposed through the bottom side of encapsulant 115 .
  • encapsulant 115 can comprise or be referred to as an epoxy molding compound, a molding layer, or a sealant.
  • encapsulant 115 can comprise an organic resin, an inorganic filler, a curing agent, a catalyst, a coupling agent, a colorant, and/or a flame retardant. Molding based on encapsulant 115 can be formed by any of a variety of processes.
  • encapsulant 115 can be formed by, but not limited to, film assist molding, compression molding, transfer molding, liquid-phase encapsulant molding, vacuum lamination, or paste printing.
  • Encapsulant 115 can have a thickness in the range from approximately 50 ⁇ m to approximately 200 ⁇ m.
  • Encapsulant 115 can protect electronic component 120 from external elements and/or environmental exposure.
  • encapsulant 115 can comprise or be referred to as a body of substrate 110 , such that electronic component 120 can be considered as embedded in substrate 110 .
  • FIGS. 5A, 5B, 5C and 5D show perspective, cross-sectional, top plane and enlarged cross-sectional views of semiconductor device 100 at a later stage of manufacture.
  • openings 116 can be formed in encapsulant 115 .
  • openings 116 can be formed in regions spaced apart from the sidewall of electronic component 120 while passing through encapsulant 115 .
  • openings 116 can include a plurality of openings formed around electronic component 120 .
  • a surface of conductive layer 103 can be exposed by openings 116 .
  • Openings 116 can be referred to as penetration holes or vias, such as through-mold-vias (TMV).
  • TMV through-mold-vias
  • openings 116 can be formed by, but not limited to, laser drilling, mechanical drilling or/and a chemical etching process. Openings 116 can have a width in the range from approximately 5 ⁇ m to approximately 20 ⁇ m. Openings 116 can allow formation of substrate interconnects 112 .
  • FIGS. 6A, 6B and 6C show perspective, cross-sectional and enlarged cross-sectional views of semiconductor device 100 at a later stage of manufacture.
  • photosensitive film 117 can be laminated on the top sides of electronic component 120 and encapsulant 115 .
  • photosensitive film 117 can be formed on the top sides of electronic component 120 and encapsulant 115 by spin coating, doctor blade, casting, painting, spray coating, slot die coating, curtain coating, or a knife over edge coating.
  • photosensitive film 117 can cover openings 116 formed in encapsulant 115 .
  • openings can be formed in photosensitive film 117 as the result of patterning to expose openings 116 .
  • Photosensitive film 117 can be connected with openings 116 of encapsulant 115 .
  • Photosensitive film 117 can be referred to as a dry film, a dry film resist, a photoresist, or a photoresist film.
  • Photosensitive film 117 can prevent substrate interconnects 112 from being formed on the top sides of electronic component 120 and/or encapsulant 115 during formation of substrate interconnects 112 , which will later be described.
  • FIGS. 7A, 7B and 7C show perspective, cross-sectional and enlarged cross-sectional views of semiconductor device 100 at a later stage of manufacture.
  • substrate interconnects 112 can be formed in openings 116 of encapsulant 115 .
  • substrate interconnects 112 can be filled in openings 116 of encapsulant 115 .
  • substrate interconnects 112 can be formed by electroplating through conductive layer 103 to gradually increase the height and/or thickness of substrate interconnects 112 .
  • the thickness or height of substrate interconnects 112 can be similar to or the same with the thickness or height of encapsulant 115 at an end stage of electroplating.
  • substrate interconnects 112 can be formed by sputtering, electroless plating, PVD, CVD, MOCVD, ALD, LPCVD or PECVD, in addition to and/or instead of electroplating.
  • substrate interconnects 112 can be made from copper, gold, silver, palladium, or nickel.
  • Substrate interconnects 112 can be referred to as pillars, posts, vias, TMVs, vertical paths, or conductive paths.
  • Substrate interconnects 112 can have a width in the range from approximately 5 ⁇ m to approximately 20 ⁇ m and a thickness in the range from approximately 50 ⁇ m to approximately 200 ⁇ m.
  • substrate interconnects 112 can electrically and mechanically connect internal interconnects 180 A and 180 B and external interconnects 160 to each other.
  • encapsulant 115 and substrate interconnects 112 can be regarded as components of substrate 110 .
  • FIGS. 8A, 8B and 8C show perspective, cross-sectional and enlarged cross-sectional views of semiconductor device 100 at a later stage of manufacture.
  • photosensitive film 117 can be removed from the top sides of encapsulant 115 and/or electronic component 120 .
  • photosensitive film 117 can be removed by heat, light, a chemical solution and/or a physical external force.
  • Top sides of substrate interconnects 112 can be made substantially coplanar with the top sides of electronic component 120 and/or encapsulant 115 .
  • the top sides of substrate interconnects 112 can be exposed through the top side of encapsulant 115 , or the sidewalls of substrate interconnects 112 can be coated by encapsulant 115 . In some examples, substrate interconnects 112 can extend from the bottom side to the top side of substrate 110 .
  • Substrate 110 can include encapsulant 115 and substrate interconnects 112 , and can be configured such that electronic component 120 is embedded in encapsulant 115 and/or in substrate 110 , providing reduced thickness for semiconductor device 100 .
  • Encapsulant 115 extends from the bottom side to the top side of substrate 110
  • FIGS. 9A and 9B show perspective and cross-sectional views of semiconductor device 100 at a later stage of manufacture.
  • electronic component 130 can be attached to substrate 110 or to electronic component 120 embedded in substrate 110 .
  • electronic component 120 can have a larger width than electronic component 130 .
  • the bottom side of electronic component 130 can be adhered to the top side of electronic component 120 or the top side of substrate 110 using adhesive ( 170 A of FIG. 1 ).
  • electronic component 120 can have a smaller width than electronic component 130 .
  • a portion of the bottom side of electronic component 130 can be adhered to the top side of electronic component 120 using adhesive 170 A, and another portion of the bottom side of electronic component 130 can be adhered to the top side of encapsulant 115 using adhesive 170 A.
  • the top side of electronic component 130 can comprise terminal 131 .
  • terminal 131 can comprise or be referred to as a die pad, a bond pad, a solder bump, or a pillar bump.
  • Terminal 131 can have a width in the range from approximately 2 ⁇ m to approximately 80 ⁇ m.
  • Electronic component 130 can comprise or be referred to as a MEMS device, a semiconductor die or a semiconductor chip.
  • Electronic component 130 can have a thickness in the range from approximately 200 ⁇ m to approximately 300 ⁇ m.
  • electronic component 130 can comprise an active region on its top side, such as a MEMS or micro-electro-mechanical component on its top side.
  • electronic component 130 can further comprise a cap 140 attached to its top side using adhesive ( 170 B of FIG. 1 ) to protect MEMS region 132 .
  • a gap or a space can be provided between the bottom side of cap 140 and the top side or the active region of electronic component 130 .
  • Cap 140 can have a smaller width than electronic component 130 , and can be attached without overlapping terminal 131 of electronic component 130 .
  • Cap 140 can be referred to as a cover or a lid.
  • Cap 140 can be made from silicon, glass, metal or resin.
  • Cap 140 can be translucent, whether transparent or semi-transparent, and/or can have a thickness in the range from approximately 200 ⁇ m to approximately 250 ⁇ m.
  • FIGS. 10A and 10B show perspective and cross-sectional views of semiconductor device 100 at a later stage of manufacture.
  • internal interconnect 180 A can electrically connect terminal 121 of electronic component 120 with substrate interconnects 112
  • internal interconnect 180 B can electrically connect terminal 131 of electronic component 130 with substrate interconnects 112 .
  • internal interconnects 180 A and 180 B can electrically connect electronic component 120 and electronic component 130 to each other.
  • internal interconnects 180 A and 180 B can be referred to as wires or bonding wires.
  • internal interconnects 180 A and 180 B can have a loop height in the range from approximately 30 ⁇ m to approximately 70 ⁇ m and a diameter in the range from approximately 15 ⁇ m to approximately 25 ⁇ m.
  • internal interconnects 180 A and 180 B can be made from gold, copper or aluminum.
  • internal interconnect 180 A can electrically connect electronic component 120 and substrate interconnects 112 to allow electrical connection of electronic component 120 to an external component.
  • internal interconnect 180 B can electrically connect electronic component 130 and substrate interconnects 112 to allow electrical connection of electronic component 130 to an external component.
  • internal interconnect 180 A or 180 B can electrically connect electronic component 120 and electronic component 130 to each other, receiving and transmitting electrical signals from/to each other.
  • FIG. 11 shows cross-sectional view of semiconductor device 100 at a later stage of manufacture.
  • cover structure 150 can cover or coat electronic components 120 or 130 positioned on substrate 110 , and internal interconnects 180 A and 180 B.
  • cover structure 150 comprises a cover encapsulant or cover molding layer
  • substrate encapsulant comprises a substrate molding layer, where the cover molding layer coats the substrate molding layer.
  • cover structure 150 coats the sidewall of electronic component 130 .
  • cover structure 150 covers the sidewall of cap 140 , but can leave the top side of cap 140 exposed.
  • cover structure 150 coats the top side of electronic component 120 and the top side of electronic component 130 at least partially.
  • cover structure 150 can be brought into contact with substrate encapsulant 115 and substrate interconnects 112 .
  • cover structure 150 can encapsulate the sidewalls and top sides of electronic components 120 and 130 , except for bottom sides of electronic components 120 and 130 , and can encapsulate internal interconnects 180 A and 180 B.
  • cover structure 150 may not encapsulate the top side of cap 140 .
  • the top side of cap 140 can be exposed through cover structure 150 accordingly.
  • adhesive 170 A can be located between the bottom side of electronic component 130 and the top side of substrate 110 or the top side of electronic component 120 as can be seen in FIG. 1
  • cover structure 150 comprises an encapsulant that coats a sidewall of adhesive 170 and a portion of the top side of adhesive 170 that extends beyond a footprint of electronic component 130 .
  • Cover structure 150 can have a thickness in the range from approximately 450 ⁇ m to approximately 500 ⁇ m. Cover structure 150 can provide electronic components 120 and 130 and internal interconnects 180 A and 180 with protection from external elements and/or environmental exposure. In some examples, cover structure 150 can be formed using similar encapsulant materials or processes as those described for encapsulant 115 of substrate 110 .
  • FIG. 12 shows cross-sectional view of semiconductor device 100 at a later stage of manufacture.
  • carrier 101 can be separated from conductive layer 103 .
  • temporary bond layer 102 can be separated from conductive layer 103 in a state in which it is attached to carrier 101 .
  • heat, light, a chemical solution and/or a physical external force can be provided, thereby removing or reducing a bonding strength of temporary bond layer 102 . Accordingly, conductive layer 103 can be exposed.
  • FIG. 13 shows cross-sectional view of semiconductor device 100 at a later stage of manufacture.
  • conductive layer 103 can be removed.
  • conductive layer 103 can be removed by mechanical grinding and/or chemical etching.
  • the bottom sides of electronic component 120 , substrate interconnects 112 and substrate encapsulant 115 can be exposed.
  • the bottom sides of electronic component 120 , substrate interconnects 112 and substrate encapsulant 115 can be made substantially coplanar.
  • the bottom sides of electronic component 120 and substrate interconnects 112 can be exposed through the bottom side of encapsulant 115 .
  • FIG. 14 shows cross-sectional view of semiconductor device 100 at a later stage of manufacture.
  • external interconnects 160 can be provided at bottom sides of substrate interconnects 112 .
  • External interconnect 160 can comprise or be connected to substrate interconnects 112 through a low melting point material.
  • external interconnects 160 can comprise of be referred to as solder balls, solder pads, or pad platings.
  • external interconnects 160 can be made from, but not limited to, Sn, Ag, Pb, Cu, Sn—Pb, Sn37-Pb, Sn95-Pb, Sn—Pb—Ag, Sn—Cu, Sn—Ag, Sn—Au, Sn—Bi or Sn—Ag—Cu.
  • External interconnect 160 can have a thickness in the range from approximately 50 ⁇ m to approximately 150 ⁇ m.
  • External interconnect 160 can allow mounting of semiconductor package 190 to an external device.
  • FIG. 15 shows cross-sectional view of semiconductor device 100 at a later stage of manufacture.
  • semiconductor device 100 can be singulated into discrete semiconductor devices.
  • semiconductor device 100 can be singulated into discrete semiconductor devices by a diamond blade or laser beam.
  • the sidewalls of substrate encapsulant 115 and cover structure 150 can be made substantially coplanar.
  • substrate interconnect 112 is represented as a conductive vertical via that extends from top to bottom of substrate 110 , with its sidewall coated or directly contacted by encapsulant 115 .
  • substrate interconnect 112 can be applied as a via structure that comprises a conductive via and a dielectric casing around the sidewall of the conductive via, where the sidewall of the dielectric casing can be coated by encapsulant 115 of substrate 110 .
  • via structure can comprise a PCB insert, with the dielectric casing defined by one or more laminate layers having, for instance, inorganic or fiberglass strands.
  • such via structure can comprise a pre-molded insert, with the dielectric casing defined by a molding compound distinct from encapsulant 115 .
  • Semiconductor device 100 having reduced dimensions can be achieved by the manufacturing method described. In some examples, as the thickness and width of semiconductor device 100 can be reduced by such manufacturing method, semiconductor device 100 can be suitably applied to a wearable device.
  • FIG. 16 shows a cross-sectional view of an example semiconductor device 200 .
  • semiconductor device 200 can comprise substrates 110 and 210 , electronic components 120 and 130 , cap 140 , cover structure 150 , external interconnects 160 , adhesives 170 A and 170 B and internal interconnects 180 .
  • semiconductor device 200 can comprise an adhesive 270 and/or an interface film 280 .
  • Substrate 210 can comprise conductive structures 211 and dielectric structures 212 .
  • Adhesive 270 can be interposed between electronic component 120 and electronic component 130 .
  • Interface film 280 can be interposed between substrate 110 and cover structure 150 .
  • Substrates 110 and 210 , cap 140 , cover structure 150 , external interconnects 160 , adhesives 170 A, 170 B and 270 , internal interconnects 180 and interface film 280 can be collectively referred to as a semiconductor package 290 , and/or can provide electronic components 120 and 130 with protection from external elements and/or environmental exposure.
  • semiconductor package 290 can provide electrical coupling between an external component and external interconnects 160 .
  • FIGS. 17 to 30 show various drawings of an example method for manufacturing semiconductor device 200 .
  • FIG. 17 shows perspective view of an example method for manufacturing semiconductor device 200 at an early stage of manufacture.
  • a substantially planar carrier 101 can be prepared.
  • interface film 280 can be formed on a surface of carrier 101 .
  • Interface film 280 can be formed on the surface of carrier 101 using a coating process, such as spin coating, doctor blade, casting, painting, spray coating, slot die coating, curtain coating, slide coating or knife over edge coating; a printing process, such as screen printing, pad printing, gravure printing, flexographic coating or offset printing; an inkjet printing process with features intermediate between coating and printing; or direct attachment of an adhesive film or an adhesive tape.
  • Interface film 280 can have a thickness in the range from approximately 50 ⁇ m to approximately 150 ⁇ m.
  • Interface film 280 can be removed during the manufacture of semiconductor device 200 .
  • interface film 280 can be interposed between substrate 110 and cover structure 150 and can remain between substrate 110 and cover structure 150 .
  • Conductive layer 103 can be further formed on a surface of interface film 280 .
  • FIGS. 18A and 18B show perspective and cross-sectional view of semiconductor device 200 at a later stage of manufacture.
  • substrate interconnects 112 can be formed on conductive layer 103 provided on a top surface of carrier 101 .
  • substrate interconnects 112 can be formed on conductive layer 103 in a matrix configuration having rows and/or columns.
  • substrate interconnects 112 can be formed by, but not limited to, electroplating, electroless plating, sputtering, PVD, CVD, MOCVD, ALD, LPCVD or PECVD.
  • substrate interconnects 112 can be made from copper, gold, silver, palladium, or nickel.
  • Substrate interconnects 112 can be referred to as pillars, posts, vias, or conductive paths. In some examples, substrate interconnects 112 can electrically and mechanically connect internal interconnects 180 , which will later be described, and substrate 210 to each other.
  • FIGS. 19A and 19B show perspective and cross-sectional view of semiconductor device 200 at a later stage of manufacture.
  • conductive layer 103 of regions not overlapping substrate interconnects 112 can be removed.
  • the removing of conductive layer 103 can be performed by, for example, but not limited to, soft etching using substrate interconnects 112 as masks. Accordingly, conductive layer 103 of regions overlapping substrate interconnects 112 may remain.
  • electronic component 120 can be adhered onto interface film 280 over an empty region between substrate interconnects 112 .
  • electronic component 120 can be adhered to interface film 280 using adhesive 270 .
  • the bottom side of electronic component 120 can be adhered to interface film 280 using adhesive 270 .
  • FIGS. 20A and 20B show perspective and cross-sectional view of semiconductor device 200 at a later stage of manufacture.
  • encapsulant 115 can be formed on sidewalls of substrate interconnects 112 and electronic component 120 .
  • encapsulant 115 can be brought into contact with sidewalls of substrate interconnects 112 and electronic component 120 .
  • encapsulant 115 can be brought into contact with a surface of interface film 280 not overlapping bottom sides of substrate interconnects 112 and electronic component 120 .
  • the top sides of substrate interconnects 112 and electronic component 120 can be made substantially coplanar with the top side of encapsulant 115 .
  • the top sides of substrate interconnects 112 and electronic component 120 can be exposed through the top side of encapsulant 115 .
  • substrate 110 can comprise embedded electronic component 120 and substrate interconnects 112 .
  • FIGS. 21A and 21B show perspective and cross-sectional view of semiconductor device 200 at a later stage of manufacture.
  • substrate 210 can be formed on top sides of substrate 110 and electronic component 120 .
  • substrate 210 can comprise conductive structures 211 and dielectric structures 212 .
  • Conductive structures 211 can comprise one or more conductive layers or paths.
  • Conductive structures 211 can be electrically connected to terminal 121 of electronic component 120 and/or substrate interconnects 112 of substrate 110 .
  • Dielectric structures 212 can comprise one or more dielectric layers. Dielectric structures 212 can cover conductive structures 211 , thereby protecting conductive structures 211 from external elements.
  • conductive structures 211 can be referred to as a redistribution layer (RDL), a wiring pattern or a circuit pattern.
  • RDL redistribution layer
  • conductive structures 211 can be made from, for example, but not limited to, copper, aluminum, gold, silver, or nickel.
  • Conductive structures 211 can be formed by, for example, but not limited to, sputtering, electroless plating, electroplating, PVD, CVD, MODVD, ALD, LPCVD or PECVD.
  • Conductive structures 211 can have a thickness and width in ranges from approximately 2 ⁇ m to approximately 10 ⁇ m. Some of conductive structures 211 can be electrically connected to terminal 121 of electronic component 120 .
  • dielectric structures 212 can comprise or be referred to as a passivation layer, an insulation layer or a protection layer. Dielectric structures 212 can be made from, for example, but not limited to, Si3N4, SiO2, SiON, PI, BCB, PBO, BT, epoxy resin, phenol resin, silicon resin, or acrylate polymer.
  • dielectric structures 212 can be formed by, for example, but not limited to, PVD, CVD, MOCVD, ALD, LPCVD, PECVD, printing, spin coating, spray coating, sintering or thermal oxidation.
  • dielectric structures 212 can cover top sides of electronic component 120 , substrate encapsulant 115 and substrate interconnects 112 , but terminal 121 of electronic component 120 and substrate interconnects 112 can be exposed through patterning.
  • Dielectric structures 212 can have a thickness in the range from approximately 10 ⁇ m to approximately 15 ⁇ m. In some examples, some regions of conductive structures 211 can be exposed through dielectric structures 212 .
  • Substrate 210 is presented here as a redistribution layer (“RDL”) substrate.
  • RDL substrates can comprise one or more conductive redistribution layers and one or more dielectric layers that (a) can be formed layer by layer over an electronic device to which the RDL substrate is to be electrically coupled, or (b) can be formed layer by layer over a carrier that can be entirely removed or at least partially removed after the electronic device and the RDL substrate are coupled together.
  • RDL substrates can be manufactured layer by layer as a wafer-level substrate on a round wafer in a wafer-level process, and/or as a panel-level substrate on a rectangular or square panel carrier in a panel-level process.
  • RDL substrates can be formed in an additive buildup process that can include one or more dielectric layers alternatingly stacked with one or more conductive layers that define respective conductive redistribution patterns or traces configured to collectively (a) fan-out electrical traces outside the footprint of the electronic device, and/or (b) fan-in electrical traces within the footprint of the electronic device.
  • the conductive patterns can be formed using a plating process such as, for example, an electroplating process or an electroless plating process.
  • the conductive patterns can comprise an electrically conductive material such as, for example, copper or other plateable metal.
  • the locations of the conductive patterns can be made using a photo-patterning process such as, for example, a photolithography process and a photoresist material to form a photolithographic mask.
  • the dielectric layers of the RDL substrate can be patterned with a photo-patterning process, which can include a photolithographic mask through which light is exposed to photo-pattern desired features such as vias in the dielectric layers.
  • the dielectric layers can be made from photo-definable organic dielectric materials such as, for example, polyimide (PI), benzocyclobutene (BCB), or polybenzoxazole (PBO). Such dielectric materials can be spun-on or otherwise coated in liquid form, rather than attached as a pre-formed film.
  • such photo-definable dielectric materials can omit structural reinforcers or can be filler-free, without strands, weaves, or other particles, that could interfere with the light from the photo-patterning process.
  • such filler-free characteristics of filler-free dielectric materials can permit a reduction of the thickness of the resulting dielectric layer.
  • the photo-definable dielectric materials described above can be organic materials, in other examples the dielectric materials of the RDL substrates can comprise one or more inorganic dielectric layers.
  • Some examples of inorganic dielectric layer(s) can comprise silicon nitride (Si3N4), silicon oxide (SiO2), and/or SiON.
  • the inorganic dielectric layer(s) can be formed by growing the inorganic dielectric layers using an oxidation or nitridization process instead using photo-defined organic dielectric materials. Such inorganic dielectric layers can be filler-fee, without strands, weaves, or other dissimilar inorganic particles.
  • the RDL substrates can omit a permanent core structure or carrier such as, for example, a dielectric material comprising bismaleimide triazine (BT) or FR4 and these types of RDL substrates can be referred to as a coreless substrate.
  • Substrates in other examples of this disclosure can also comprise an RDL substrate.
  • substrate 210 can be a pre-formed substrate.
  • the pre-formed substrate can be manufactured prior to attachment to an electronic device and can comprise dielectric layers between respective conductive layers.
  • the conductive layers can comprise copper and can be formed using an electroplating process.
  • the dielectric layers can be relatively thicker non-photo-definable layers that can be attached as a pre-formed film rather than as a liquid and can include a resin with fillers such as strands, weaves, and/or other inorganic particles for rigidity and/or structural support. Since the dielectric layers are non-photo-definable, features such as vias or openings can be formed by using a drill or laser.
  • the dielectric layers can comprise a prepreg material or Ajinomoto Buildup Film (ABF).
  • the pre-formed substrate can include a permanent core structure or carrier such as, for example, a dielectric material comprising bismaleimide triazine (BT) or FR4, and dielectric and conductive layers can be formed on the permanent core structure.
  • the pre-formed substrate can be a coreless substrate which omits the permanent core structure, and the dielectric and conductive layers can be formed on a sacrificial carrier that is removed after formation of the dielectric and conductive layers and before attachment to the electronic device.
  • the pre-formed substrate can referred to as a printed circuit board (PCB) or a laminate substrate.
  • PCB printed circuit board
  • Such pre-formed substrate can be formed through a semi-additive or modified-semi-additive process.
  • Substrates in other examples of this disclosure can also comprise a pre-formed substrate.
  • FIGS. 22A and 22B show perspective and cross-sectional view of semiconductor device 200 at a later stage of manufacture.
  • external interconnects 160 can be formed on substrate 210 .
  • external interconnects 160 can be formed on conductive structures 211 exposed through dielectric structures 212 of substrate 210 .
  • UBMs Under Bump Metallizations
  • external interconnects 160 can be formed the UBMs.
  • FIGS. 23A and 23B show perspective and cross-sectional view of semiconductor device 200 at a later stage of manufacture.
  • a carrier 201 can be attached to substrate 210 and external interconnects 160 .
  • a temporary bond layer 202 can be attached to a bottom side of carrier 201 and can also be attached to substrate 210 and external interconnects 160 .
  • Temporary bond layer 202 can surround external interconnects 160 and can be temporarily attached to dielectric structures 212 of substrate 210 not overlapping external interconnects 160 and/or conductive structures 211 .
  • Temporary bond layer 202 can be separated from substrate 210 and external interconnects 160 by heat, light, a chemical solution and/or a physical external force at a subsequent stage.
  • Carrier 201 can have a thickness in the range from approximately 500 ⁇ m to approximately 1500 ⁇ m
  • temporary bond layer 202 can have a thickness in the range from approximately 50 ⁇ m to approximately 150 ⁇ m.
  • shapes, materials and/or manufacturing methods of carrier 201 and temporary bond layer 202 can be similar to or the same with those of carrier 101 and temporary bond layer 102 having been described above.
  • FIGS. 24A and 24B show perspective and cross-sectional view of semiconductor device 200 at a later stage of manufacture.
  • carrier 101 can be separated from interface film 280 .
  • interface film 280 can remain and only carrier 101 can be removed.
  • interface film 280 can be maintained at a state in which it is adhered to encapsulant 115 , conductive layer 103 and an adhesive layer 270 . Accordingly, conductive layer 103 and adhesive layer 270 remain be protected without being exposed during the manufacture of semiconductor device 200 .
  • interface film 280 can be removed.
  • FIGS. 25A and 25B show perspective and cross-sectional view of semiconductor device 200 at a later stage of manufacture. The orientation of the assembly has been flipped from the previous stage.
  • openings 280 A can be formed in interface film 280 .
  • Openings 280 A can be formed in regions of interface film 280 corresponding to substrate interconnects 112 . Accordingly, top sides of substrate interconnects 112 can be exposed through openings 280 A of interface film 280 .
  • Openings 280 A can be formed by laser drilling, mechanical drilling or/and a chemical etching process.
  • FIGS. 26A and 26B show top plane and cross-sectional view of semiconductor device 200 at a later stage of manufacture.
  • electronic component 130 can be attached to substrate 110 .
  • Electronic component 130 can comprise cap 140 as previously described ( FIG. 9 ).
  • electronic component 130 can be attached using adhesive ( 170 of FIG. 16 ).
  • electronic component 130 can be attached onto a region of interface film 280 corresponding to electronic component 120 using adhesive 170 .
  • electronic component 130 can have a smaller width than electronic component 120 .
  • electronic component 130 can have a larger width than electronic component 120 .
  • electronic component 130 is attached such that its active region faces upward. In some examples, the active region of electronic component 120 can face downward towards substrate 210 .
  • FIGS. 27A and 27B show top plane and cross-sectional view of semiconductor device 200 at a later stage of manufacture.
  • internal interconnects 180 can electrically connect electronic component 130 and substrate interconnects 112 .
  • internal interconnects 180 can be referred to as wires or bonding wires.
  • internal interconnects 180 can have a loop height in the range from approximately 30 ⁇ m to approximately 70 ⁇ m and a diameter in the range from approximately 15 ⁇ m to approximately 25 ⁇ m.
  • internal interconnects 180 can be made from gold, copper or aluminum.
  • internal interconnects 180 can allow electrical connection of electronic component 130 to an external component.
  • FIG. 28 shows cross-sectional view of semiconductor device 200 at a later stage of manufacture.
  • cover structure 150 can encapsulate electronic component 130 and internal interconnects 180 positioned on interface film 280 .
  • cover structure 150 can be brought into contact with interface film 280 and substrate interconnects 112 .
  • cover structure 150 can encapsulate the sidewall and top side of electronic component 130 , except for a bottom side of electronic component 130 , and can encapsulate internal interconnects 180 .
  • cover structure 150 may not encapsulate a top side of cap 140 . The top side of cap 140 can be exposed through cover structure 150 .
  • FIG. 29 shows cross-sectional view of semiconductor device 200 at a later stage of manufacture.
  • carrier 201 can be separated to expose from substrate 210 and external interconnects 160 .
  • temporary bond layer 202 can be separated from substrate 210 and external interconnects 160 while attached to carrier 201 .
  • heat, light, a chemical solution and/or a physical external force can be provided, thereby removing or reducing a bonding strength of temporary bond layer 202 .
  • FIG. 30 shows cross-sectional view of semiconductor device 200 at a later stage of manufacture.
  • semiconductor device 200 can be singulated into discrete semiconductor devices.
  • semiconductor device 200 can be separated into discrete semiconductor devices by a diamond blade or laser beam.
  • the sidewalls of substrate encapsulant 115 , substrate conductive structures 211 , dielectric structures 212 , or cover structure 150 can be substantially coplanar.
  • semiconductor device 200 can correspond to the depiction shown in FIG. 16 .
  • the top side of substrate 210 is coupled to the bottom side of substrate 110
  • external interconnects 160 are coupled to the bottom side of substrate 210 .
  • Conductive structure 211 comprises conductors (traces, vias, pads) that extend between or through the one or more layers of dielectric structure 212 to define conductive paths between the top side to the bottom side of substrate 210 .
  • a conductor of conductive structure 211 can be exposed at the top side of substrate 210 , and can be coupled to terminal 121 of electronic component 120 , where terminal 121 is exposed from encapsulant 115 at the bottom side of substrate 110 .
  • a conductor of conductive structure 211 can be exposed at the top side of substrate 210 , and can be coupled to substrate interconnect 112 , where substrate interconnect 112 is exposed from encapsulant 115 at the bottom side of substrate 110 .
  • substrate 210 can be an RDL substrate, where the top side or top dielectric layer of dielectric structure 212 can be conformal to a contour of the bottom side of substrate 110 .
  • substrate 110 comprises adhesive 270 on the top side of electronic component 120 , between electronic component 120 and electronic component 130 .
  • the top side of adhesive 270 can be exposed from encapsulant 115 of substrate 110 .
  • encapsulant 115 of substrate 110 can coat a sidewall of adhesive 270 , or a portion of the bottom side of adhesive 270 that extends beyond a footprint of electronic component 120 .
  • Semiconductor device 200 having reduced dimensions can be achieved by the manufacturing method described. In some examples, as the thickness and width of semiconductor device 200 can be reduced by such manufacturing method, semiconductor device 200 can be suitably applied to a wearable device.
  • FIG. 31 shows cross-sectional view of semiconductor device.
  • semiconductor device 300 can comprise a substrate 110 , electronic components 320 and 330 , cover structure 350 , and protective layers 370 A and 370 B.
  • Substrate 110 as presented with respect to semiconductor device 300 can be similar to substrate 110 as previously described with respect to semiconductor devices 100 and 200 , but comprises embedded electronic components 320 and 332 .
  • Electronic component 320 can comprise a terminal 321 and a MEMS region 322 .
  • Electronic component 330 can comprise a terminal 331 .
  • Cover structure 350 can comprise compartments 351 and 352 and apertures 390 A and 390 B.
  • FIGS. 32 to 44 show various drawings of an example method for manufacturing semiconductor device 300 .
  • FIGS. 32A and 32B show perspective and cross-sectional view of semiconductor device 300 at an early stage of manufacture.
  • a pair of electronic components 320 and 330 can be adhered in parallel to conductive layer 103 provided in a carrier 101 .
  • pairs of electronic components 320 and 330 can be arrayed on or adhered to conductive layer 103 in a matrix configuration having rows and/or columns.
  • electronic components 320 and 330 can be adhered to conductive layer 103 using an adhesive, an adhesive film or an adhesive tape.
  • Each of electronic components 320 and 330 can have a top side, a bottom side opposite to the top side, and a sidewall connecting the top side and the bottom side.
  • the top sides can have an active region
  • the bottom sides can have a non-active region.
  • the bottom sides of electronic components 320 and 330 can be adhered to conductive layer 103 of carrier 101 .
  • the top side of each of electronic components 320 and 330 can comprise at least one terminal 321 , 331 .
  • Terminals 321 and 331 can comprise or be referred to as die pads, bond pads, solder bumps, or pillar bumps.
  • Each of terminals 321 and 331 can have a width in the range from approximately 2 ⁇ m to approximately 80 ⁇ m.
  • Electronic components 320 and 330 can be referred to as semiconductor dies or semiconductor chips.
  • each of electronic components 320 and/or 330 can comprise at least one of a MEMS component, a radiation emitting component such as a light emitting diode or a laser, a sensor or receiver component such as an optical sensor, a phototetector, or other reflection sensor, an application specific integrated circuit, a logic die, a micro control unit, a memory, a digital signal processor, a network processor, a power management unit, an audio processor, an RF circuit, or a wireless baseband system on chip processor.
  • electronic component 320 can be an optical sensor and electronic component 330 can be a light emitting diode.
  • electronic component 320 can comprise an emitter, such as a laser
  • electronic component 330 can comprise a reflection sensor, such as a photodetector, for a LIDAR (Light Detection And Ranging) system.
  • Electronic components 320 and 330 can have a thickness in the range from approximately 50 ⁇ m to approximately 200 ⁇ m.
  • FIGS. 33A and 33B show perspective and cross-sectional view of semiconductor device 300 at a later stage of manufacture.
  • encapsulant 115 can be formed on surfaces of conductive layer 103 and electronic components 320 and 330 .
  • encapsulant 115 can be brought into contact with sidewalls of electronic components 320 and 330 .
  • encapsulant 115 can be brought into contact with a surface of conductive layer 103 not overlapping the bottom sides of electronic components 320 and 330 .
  • the top sides of electronic components 320 and 330 can be substantially coplanar with the top side of encapsulant 115 .
  • Electronic components 320 and 330 can be horizontally embedded in encapsulant 115 , and the top sides of electronic components 320 and 330 can be exposed through the top side of encapsulant 115 .
  • FIGS. 34A, 34B and 34C show perspective, cross-sectional and top plane view of semiconductor device 300 at a later stage of manufacture.
  • openings 116 can be formed in encapsulant 115 .
  • openings 116 can be formed in regions spaced apart from sidewalls of each of electronic components 320 and 330 while passing through encapsulant 115 .
  • openings 116 can include a plurality of openings formed around electronic components 320 and 330 .
  • FIGS. 35A and 35B show perspective and cross-sectional view of semiconductor device 300 at a later stage of manufacture.
  • photosensitive film 117 can be laminated on the top sides of electronic components 320 and 330 and encapsulant 115 and then patterned.
  • photosensitive film 117 can close openings 116 formed in encapsulant 115 , but openings 116 can be opened by a patterning process. Accordingly, openings of photosensitive film 117 can be connected with openings 116 of encapsulant 115 .
  • FIGS. 36A and 36B show perspective and cross-sectional view of semiconductor device 300 at a later stage of manufacture.
  • substrate interconnects 112 can be formed in openings 116 of encapsulant 115 .
  • substrate interconnects 112 can be filled in openings 116 of encapsulant 115 .
  • FIGS. 37A and 37B show perspective and cross-sectional view of semiconductor device 300 at a later stage of manufacture.
  • photosensitive film 117 can be removed from the top sides of encapsulant 115 and/or electronic components 320 and 330 .
  • the top sides of substrate interconnects 112 can be substantially coplanar with the top sides of electronic components 320 and 330 and encapsulant 115 .
  • the top sides of substrate interconnects 112 can be exposed through the top side of encapsulant 115 .
  • Substrate 110 can include encapsulant 115 and substrate interconnects 112 , and can be configured such that pairs of electronic components 320 and 330 are embedded in parallel in encapsulant 115 and/or in substrate 110 , providing reduced thickness for semiconductor device 300 .
  • FIGS. 38A and 38B show top plane and cross-sectional view of semiconductor device 300 at a later stage of manufacture.
  • internal interconnect 180 A can electrically connect terminal 321 of electronic component 320 and an adjacent substrate interconnect 112
  • internal interconnect 180 B can electrically connect terminal 331 of electronic component 330 and an adjacent substrate interconnect 112 .
  • internal interconnect 180 A can allow electronic component 320 to be electrically connected to an external component.
  • internal interconnect 180 B can allow electronic component 330 to be electrically connected to an external component.
  • FIGS. 39A and 39B show top plane and cross-sectional view of semiconductor device 300 at a later stage of manufacture.
  • protective layers 370 A and 370 B can cover electronic components 320 and 330 .
  • protective layers 370 A and 370 B can cover the entire top sides of electronic components 320 and 330 and can also cover some regions of encapsulant 115 around electronic components 320 and 330 and some regions of internal interconnects 180 A and 180 B.
  • some regions of internal interconnects 180 A and 180 B can be exposed from protective layers 370 A and 370 B.
  • Protective layers 370 A and 370 B can be made from translucent materials, whether transparent or semi-transparent to radiation such as light.
  • each of protective layers 370 A and 370 B can comprise or be referred to as an insulator, a dielectric, a protection layer, a translucent layer, or a FOW (Film Over Wire or Film On Wire).
  • protective layers 370 A and 370 B can be derived from liquid-phase insulators.
  • a constant amount of liquid-phase insulator can be applied to the top side of each of electronic components 320 and 330 .
  • the liquid-phase insulator can cover some regions of internal interconnects 180 A and 180 B.
  • the liquid-phase insulator can exist in a liquid phase when it is in a packing material. However, once the liquid-phase insulator is applied to top sides of electronic components 320 and 330 , like in this disclosure, it can turn into a solid-phase insulator.
  • the liquid-phase insulator after being applied to top sides of electronic components 320 and 330 , can be in a liquid phase at room temperature and can turn into a solid-phase insulator when it is heated to a temperature higher than a reference temperature and then cooled.
  • Each of protective layers 370 A and 370 B can have a round section (e.g., an upper boundary) having a radius of curvature because of manufacturing characteristics.
  • Protective layers 370 A and 370 B can have a thickness in the range from approximately 50 ⁇ m to approximately 100 ⁇ m.
  • Protective layers 370 A and 370 B can prevent the top sides of electronic components 320 and 330 from being corroded or damaged.
  • FIGS. 40A and 40B show top plane and cross-sectional view of semiconductor device 300 at a later stage of manufacture.
  • cover structure 350 can be attached to substrate 110 .
  • Cover structure 350 can comprise compartment 351 over and surrounding electronic component 320 and internal interconnect 180 A. Compartment 351 comprises aperture 390 A that extends through a top side of cover structure 350 and that allows light or radiation to be incident on electronic component 320 . Cover structure 350 can comprise compartment 352 over and surrounding electronic component 330 and internal interconnect 180 B. Compartment 352 comprises aperture 390 B that extends through a top side of cover structure 350 and that allows radiation such as light to be emitted from electronic component 330 .
  • apertures 390 A or 390 B can comprise a translucent material, or a translucent material can be located on or under apertures 390 A or 390 B.
  • each of apertures 390 A and 390 B can be shaped as a circle, or can have a diameter or breadth in the range from approximately 400 ⁇ m to approximately 600 ⁇ m.
  • Cover structure 350 can comprise divisor wall 355 that divides compartment 351 and compartment 352 from each other, and that can restrict radiation of electronic component 330 at compartment 352 from being directly incident on electronic component 320 or compartment 351 .
  • Cover structure 350 can be referred to as a lid, a cap, or a cover.
  • cover structure 350 can be pre-fabricated using a metal, plastic, laminate substrate, or ceramic, and can be bonded or adhered to encapsulant 115 of substrate 110 .
  • Cover structure 350 can have a height in the range from approximately 400 ⁇ m to approximately 600 ⁇ m. Cover structure 350 generally can protect electronic components 320 and 330 and internal interconnects 180 A and 180 B from external elements and/or environmental exposure. In addition, compartments 351 and 352 of cover structure 350 can prevent the radiation emitted from, for example, electronic component 330 , from being incident into adjacent electronic component 320 .
  • FIG. 41 shows cross-sectional view of semiconductor device 300 at a later stage of manufacture.
  • carrier 101 can be separated from conductive layer 103 .
  • temporary bond layer 102 can be separated from conductive layer 103 while attached to carrier 101 .
  • heat, light, a chemical solution and/or a physical external force can be provided, thereby removing or reducing a bonding strength of temporary bond layer 102 . Accordingly, conductive layer 103 can be exposed.
  • FIG. 42 shows cross-sectional view of semiconductor device 300 at a later stage of manufacture.
  • conductive layer 103 can be removed.
  • conductive layer 103 can be removed by mechanical grinding and/or chemical etching.
  • bottom sides of electronic components 320 and 330 , substrate interconnects 112 and substrate encapsulant 115 can be exposed.
  • bottom sides of electronic components 320 and 330 , substrate interconnects 112 and substrate encapsulant 115 can be substantially coplanar.
  • the bottom sides of electronic components 320 and 330 and the bottom sides of substrate interconnects 112 can be exposed through the bottom side of encapsulant 115 .
  • FIG. 43 shows cross-sectional view of semiconductor device 300 at a later stage of manufacture.
  • external interconnects 160 can be provided on the bottom sides of substrate interconnects 112 .
  • External interconnects 160 can comprise or be connected to substrate interconnects 112 through a low melting point material.
  • External interconnects 160 can allow semiconductor device 300 to be mounted to an external device.
  • FIG. 44 shows cross-sectional view of semiconductor device 300 at a later stage of manufacture.
  • semiconductor device 300 can be singulated into discrete semiconductor devices.
  • semiconductor device 300 can be singulated into discrete semiconductor devices by a diamond blade or laser beam.
  • sidewalls of substrate encapsulant 115 and cover structure 350 can be made substantially coplanar.
  • semiconductor device 300 can correspond to the depiction shown in FIG. 31 .
  • electronic component 320 and electronic component 330 are coupled to or embedded in substrate 110 , with their sidewalls coated by encapsulant 115 and their top sides exposed from encapsulant 115 .
  • the bottom sides of electronic component 320 or electronic component 330 can be exposed from encapsulant 115 at the bottom side of substrate 110 .
  • the top side of electronic device 320 comprises an active area and terminal 321 .
  • the top side of electronic device 330 comprises an active area and terminal 322 .
  • Internal interconnect 180 A couples terminal 321 to a substrate interconnect 112 of substrate 110
  • internal interconnect 1808 couples terminal 331 to another substrate interconnect 112 of substrate 110
  • Electronic devices 320 and 330 are separated from each other by a portion of encapsulant 115 of substrate 110 .
  • Cover structure 350 comprises divisor wall 355 that divides compartments 351 and 352 and that is located over the portion of encapsulant 115 that separates electronic component 320 from electronic component 330 .
  • electronic component 320 can comprise a radiation emitting component that emits radiation through aperture 390 B of compartment 352 .
  • electronic component 330 can comprise a radiation receiver component that, through aperture 390 A of compartment 351 , senses or detects a reflection of the radiation emitted by electronic component 320 .
  • protective layers 370 A and 370 B can be translucent with respect to the radiation emitted by electronic component 330 , permitting emission of such radiation from electronic device 330 and detection of a reflection of such radiation by electronic device 320 .
  • divisor wall 355 or compartment 351 can be opaque with respect to the radiation emitted by electronic component 330 , restricting such radiation from entering compartment 351 and directly inciding upon electronic component 320 other than through aperture 390 A.
  • Semiconductor device 300 having reduced dimensions can be achieved by the manufacturing method described. In some examples, as the thickness and width of semiconductor device 300 can be reduced by such manufacturing method, semiconductor device 300 can be suitably applied to a wearable device.
  • FIG. 45 shows a cross-sectional view of an example semiconductor device 400 .
  • semiconductor device 400 can comprise a substrate 110 , electronic components 120 and 430 and a cover structure 450 .
  • Substrate 110 can further comprise an opening or aperture 119 , compared to substrates in other examples of this disclosure.
  • Electronic component 430 can comprise a terminal 431 and a MEMS region 432 .
  • Cover structure 450 can comprise a compartment 451 .
  • Substrate 110 , cover structure 450 , external interconnects 160 and internal interconnects 180 A, 180 B and 180 C can be referred to a semiconductor package 490 , which can provide electronic components 120 and 430 with protection from external elements and/or environmental exposure.
  • semiconductor package 490 can provide electrical coupling between an external component and external interconnects 160 .
  • FIGS. 46 to 56 show various drawings of an example method for manufacturing semiconductor device 400 .
  • FIGS. 46A, 46B, 46C and 46D show perspective, top plane, cross-sectional and enlarged cross-sectional view of semiconductor device 400 at an early stage of manufacture.
  • at least two types of openings 116 and 119 can be formed in encapsulant 115 .
  • Opening (aperture) 119 positioned adjacent to electronic component 120 can have a relatively larger diameter and can pass through encapsulant 115 and conductive layer 103 .
  • Opening 116 can be formed about sides of electronic components 120 and 430 and opening 119 , and can pass through encapsulant 115 .
  • opening 119 having a relatively larger diameter or breadth can be formed to permit an external signal, such as a pressure signal, to reach electronic component 430 .
  • Openings 116 having a relatively smaller diameter can be plurally formed to provide a path to substrate interconnects 112 .
  • Opening 119 can be similar to the formation of opening 116 as described with respect to other examples here. Opening 119 can have a diameter in the range from approximately 400 ⁇ m to approximately 500 ⁇ m, and openings 116 can have a diameter in the range from approximately 5 ⁇ m to approximately 20 ⁇ m.
  • FIGS. 47A, 47B and 47C show perspective, cross-sectional and enlarged cross-sectional view of semiconductor device 400 at a later stage of manufacture.
  • photosensitive film 117 can be laminated on the top sides of electronic components 120 and 430 and encapsulant 115 and then patterned.
  • Photosensitive film 117 can close openings 116 and 119 formed in encapsulant 115 , but only opening 116 can be opened by a patterning process.
  • openings can be formed in photosensitive film 117 as the result of patterning. Accordingly, openings of photosensitive film 117 can be connected with openings 116 of encapsulant 115 .
  • opening 119 can be still in a closed state.
  • FIGS. 48A, 48B and 48C show perspective, cross-sectional and enlarged cross-sectional view of semiconductor device 400 at a later stage of manufacture.
  • substrate interconnects 112 can be formed in openings 116 of encapsulant 115 .
  • substrate interconnects 112 can be filled in openings 116 of encapsulant 115 .
  • opening 119 of substrate 110 is still closed by photosensitive film 117 , no interconnect is formed in opening 119 .
  • FIGS. 49A, 49B, 49C and 49D show perspective, cross-sectional, top plane and enlarged cross-sectional view of semiconductor device 400 at a later stage of manufacture.
  • photosensitive film 117 can be removed from the top sides of encapsulant 115 and/or electronic component 120 .
  • the top sides of substrate interconnects 112 can be substantially coplanar with the top sides of electronic component 120 and encapsulant 115 .
  • the top sides of substrate interconnects 112 can be exposed through the top side of encapsulant 115 .
  • opening 119 and temporary bond layer 102 disposed at an interior side of opening 119 can be exposed through encapsulant 115 .
  • Substrate 110 can include encapsulant 115 , substrate interconnects 112 and opening 119 , and can be configured such that electronic component 120 is embedded in encapsulant 115 .
  • electronic component 120 can be embedded in substrate 110
  • opening 119 can be formed in substrate 110 , providing semiconductor device 400 having a reduced thickness and improved efficiency.
  • FIGS. 50A and 50B show perspective and cross-sectional view of semiconductor device 400 at a later stage of manufacture.
  • electronic component 430 can be attached to encapsulant 115 of substrate 110 .
  • electronic component 430 can be provided over a region corresponding to (overlapping) opening 119 formed in encapsulant 115 .
  • opening 119 of encapsulant 115 can be closed by electronic component 430 .
  • an external signal e.g., pressure, sound, etc.
  • electronic component 430 can be adhered to encapsulant 115 of substrate 110 using an adhesive.
  • electronic component 430 can comprise a terminal 431 and a MEMS region (e.g., a diaphragm region) 432 that is exposed to opening 119 .
  • Electronic component 430 can comprise or be referred to as a MEMS, a semiconductor die or a semiconductor chip.
  • Electronic component 430 can have a thickness in the range from approximately 150 ⁇ m to approximately 250 ⁇ m.
  • Electronic component 430 can function as a microphone or a pressure sensor.
  • FIGS. 51A and 51B show perspective and cross-sectional view of semiconductor device 400 at a later stage of manufacture.
  • internal interconnect 180 A can electrically connect electronic component 120 and substrate interconnects 112
  • internal interconnect 180 B can electrically connect electronic component 430 and substrate interconnects 112
  • internal interconnect 180 C can electrically connect electronic component 120 and electronic component 430 .
  • an active region of electronic component 120 can comprise processing circuitry for processing signals from the MEMS of electronic component 430 .
  • internal interconnect 180 A can allow electronic component 120 to be electrically connected to an external component
  • internal interconnect 180 B can allow electronic component 430 to be electrically connected to an external component.
  • FIGS. 52A and 52B show perspective and cross-sectional view of semiconductor device 400 at a later stage of manufacture.
  • cover structure 450 can be adhered to substrate 110 .
  • Cover structure 450 can cover electronic components 120 and 430 and can define compartment 451 surrounding internal interconnects 180 A, 180 B and 180 C.
  • Cover structure 450 can generally protect electronic components 120 and 430 and internal interconnects 180 A, 180 B and 180 C from external elements and/or environmental exposure.
  • FIG. 53 shows cross-sectional view of semiconductor device 400 at a later stage of manufacture.
  • carrier 101 can be separated from conductive layer 103 .
  • temporary bond layer 102 can be separated from conductive layer 103 while attached to carrier 101 .
  • conductive layer 103 can be exposed.
  • opening 119 can also be exposed.
  • FIG. 54 shows cross-sectional view of semiconductor device 400 at a later stage of manufacture.
  • conductive layer 103 can be removed.
  • conductive layer 103 can be removed by mechanical grinding and/or chemical etching.
  • Bottom sides of electronic component 430 , substrate interconnects 112 and encapsulant 115 can be exposed.
  • opening 119 positioned to correspond to electronic component 430 can be exposed through encapsulant 115 .
  • FIG. 55 shows cross-sectional view of semiconductor device 400 at a later stage of manufacture.
  • external interconnects 160 can be provided on the bottom sides of substrate interconnects 112 . In this way, opening 119 passing through substrate 110 and electronic component 120 embedded in substrate 110 can be positioned/exposed between external interconnects 160 .
  • FIG. 56 shows cross-sectional view of semiconductor device 400 at a later stage of manufacture.
  • semiconductor device 400 can be singulated into discrete semiconductor devices.
  • semiconductor device 400 can be singulated into discrete semiconductor devices by a diamond blade or laser beam.
  • Sidewalls of encapsulant 115 and cover structure 450 can be made substantially coplanar.
  • Semiconductor device 400 having reduced dimensions can be achieved by the manufacturing method described. In some examples, as the thickness and width of semiconductor device 400 can be reduced by such manufacturing method, semiconductor device 400 can be suitably applied to a wearable device.

Abstract

In one example, an electronic device can comprise (a) a first substrate comprising a first encapsulant extending from the first substrate bottom side to the first substrate top side, and a first substrate interconnect extending from the substrate bottom side to the substrate top side and coated by the first encapsulant, (b) a first electronic component embedded in the first substrate and comprising a first component sidewall coated by the first encapsulant, (c) a second electronic component coupled to the first substrate top side, (d) a first internal interconnect coupling the second electronic component to the first substrate interconnect, and (e) a cover structure on the first substrate and covering the second component sidewall and the first internal interconnect. Other examples and related methods are also disclosed herein.

Description

TECHNICAL FIELD
The present disclosure relates, in general, to electronic devices, and more particularly, to semiconductor devices and methods for manufacturing semiconductor devices.
BACKGROUND
Prior semiconductor packages and methods for forming semiconductor packages are inadequate, for example resulting in excess cost, decreased reliability, relatively low performance, or package sizes that are too large. Further limitations and disadvantages of conventional and traditional approaches will become apparent to one of skill in the art, through comparison of such approaches with the present disclosure and reference to the drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 shows a cross-sectional view of an example semiconductor device.
FIG. 2 shows perspective view of an example method for manufacturing an example semiconductor device.
FIGS. 3A and 3B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
FIGS. 4A and 4B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
FIGS. 5A, 5B, 5C and 5D show perspective, cross-sectional, top plane and enlarged cross-sectional view of an example method for manufacturing an example semiconductor device.
FIGS. 6A, 6B and 6C show perspective, cross-sectional and enlarged cross-sectional view of an example method for manufacturing an example semiconductor device.
FIGS. 7A, 7B and 7C show perspective, cross-sectional and enlarged cross-sectional view of an example method for manufacturing an example semiconductor device.
FIGS. 8A, 8B and 8C show perspective, cross-sectional and enlarged cross-sectional view of an example method for manufacturing an example semiconductor device.
FIGS. 9A and 9B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
FIGS. 10A and 10B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
FIG. 11 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
FIG. 12 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
FIG. 13 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
FIG. 14 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
FIG. 15 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
FIG. 16 shows a cross-sectional view of an example semiconductor device.
FIG. 17 shows perspective view of an example method for manufacturing an example semiconductor device.
FIGS. 18A and 18B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
FIGS. 19A and 19B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
FIGS. 20A and 20B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
FIGS. 21A and 21B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
FIGS. 22A and 22B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
FIGS. 23A and 23B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
FIGS. 24A and 24B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
FIGS. 25A and 25B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
FIGS. 26A and 26B show top plane and cross-sectional view of an example method for manufacturing an example semiconductor device.
FIGS. 27A and 27B show top plane and cross-sectional view of an example method for manufacturing an example semiconductor device.
FIG. 28 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
FIG. 29 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
FIG. 30 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
FIG. 31 shows a cross-sectional view of an example semiconductor device.
FIGS. 32A and 32B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
FIGS. 33A and 33B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
FIGS. 34A, 34B and 34C show perspective, cross-sectional and top plane view of an example method for manufacturing an example semiconductor device.
FIGS. 35A and 35B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
FIGS. 36A and 36B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
FIGS. 37A and 37B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
FIGS. 38A and 38B show top plane and cross-sectional view of an example method for manufacturing an example semiconductor device.
FIGS. 39A and 39B show top plane and cross-sectional view of an example method for manufacturing an example semiconductor device.
FIGS. 40A and 40B show top plane and cross-sectional view of an example method for manufacturing an example semiconductor device.
FIG. 41 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
FIG. 42 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
FIG. 43 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
FIG. 44 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
FIG. 45 shows a cross-sectional view of an example semiconductor device.
FIGS. 46A, 46B, 46C and 46D show perspective, top plane, cross-sectional and enlarged cross-sectional view of an example method for manufacturing an example semiconductor device.
FIGS. 47A, 47B and 47C show perspective, cross-sectional and enlarged cross-sectional view of an example method for manufacturing an example semiconductor device.
FIGS. 48A, 48B and 48C show perspective, cross-sectional and enlarged cross-sectional view of an example method for manufacturing an example semiconductor device.
FIGS. 49A, 49B, 49C and 49D show perspective, cross-sectional, top plane and enlarged cross-sectional view of an example method for manufacturing an example semiconductor device.
FIGS. 50A and 50B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
FIGS. 51A and 51B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
FIGS. 52A and 52B show perspective and cross-sectional view of an example method for manufacturing an example semiconductor device.
FIG. 53 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
FIG. 54 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
FIG. 55 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
FIG. 56 shows cross-sectional view of an example method for manufacturing an example semiconductor device.
The following discussion provides various examples of semiconductor devices and methods of manufacturing semiconductor devices. Such examples are non-limiting, and the scope of the appended claims should not be limited to the particular examples disclosed. In the following discussion, the terms “example” and “e.g.” are non-limiting.
The figures illustrate the general manner of construction, and descriptions and details of well-known features and techniques may be omitted to avoid unnecessarily obscuring the present disclosure. In addition, elements in the drawing figures are not necessarily drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help improve understanding of the examples discussed in the present disclosure. The same reference numerals in different figures denote the same elements.
The term “or” means any one or more of the items in the list joined by “or”. As an example, “x or y” means any element of the three-element set {(x), (y), (x, y)}. As another example, “x, y, or z” means any element of the seven-element set {(x), (y), (z), (x, y), (x, z), (y, z), (x, y, z)}.
The terms “comprises,” “comprising,” “includes,” and/or “including,” are “open ended” terms and specify the presence of stated features, but do not preclude the presence or addition of one or more other features.
The term “coplanar” can describe surfaces that, within manufacturing tolerances, extend along or adjacent a same plane. In some examples, surfaces can be coplanar when they extend adjacent the same plane substantially parallel to each other within approximately 10 microns.
The terms “first,” “second,” etc. may be used herein to describe various elements, and these elements should not be limited by these terms. These terms are only used to distinguish one element from another. Thus, for example, a first element discussed in this disclosure could be termed a second element without departing from the teachings of the present disclosure.
Unless specified otherwise, the term “coupled” may be used to describe two elements directly contacting each other or describe two elements indirectly connected by one or more other elements. For example, if element A is coupled to element B, then element A can be directly contacting element B or indirectly connected to element B by an intervening element C. Similarly, the terms “over” or “on” may be used to describe two elements directly contacting each other or describe two elements indirectly connected by one or more other elements.
DESCRIPTION
In one example, an electronic device can comprise (a) a first substrate comprising a first substrate top side, a first substrate bottom side, a first substrate sidewall, a first encapsulant extending from the first substrate bottom side to the first substrate top side, and a first substrate interconnect extending from the substrate bottom side to the substrate top side and coated by the first encapsulant, (b) a first electronic component embedded in the first substrate and comprising a first component top side, a first component bottom side, and a first component sidewall coated by the first encapsulant, (c) a second electronic component on the first substrate and comprising a second component top side comprising a second component terminal and a second active region, a second component bottom side coupled to the first substrate top side, and a second component sidewall, (d) a first internal interconnect coupling the second component terminal to the first substrate interconnect, and (e) a cover structure on the first substrate and covering the second component sidewall and the first internal interconnect.
In one example, an electronic device can comprise (a) a first substrate comprising a first substrate top side, a first substrate bottom side, a first substrate sidewall, a first encapsulant extending from the first substrate bottom side to the first substrate top side, a first substrate interconnect extending from the substrate bottom side to the substrate top side and coated by the first encapsulant, and a second substrate interconnect extending from the substrate bottom side to the substrate top side and coated by the first encapsulant (b) a first electronic component coupled to the first substrate and comprising a first component top side exposed from the first encapsulant and comprising a first component terminal and a first active region, a first component bottom side, and a first component sidewall coated by the first encapsulant, (c) a second electronic component coupled to the first substrate and comprising a second component top side exposed from the first encapsulant and comprising a second component terminal and a second active region, a second component bottom side, and a second component sidewall coated by the first encapsulant (d) a first internal interconnect coupling the first component terminal to the first substrate interconnect, (e) a second internal interconnect coupling the second component terminal to the second substrate interconnect, and (f) a cover structure on the first substrate.
In one example, a method can comprise (a) providing a first substrate comprising a first encapsulant extending from a first substrate bottom side to a first substrate top side, and a first substrate interconnect extending from the substrate bottom side to the substrate top side, (b) providing a first electronic component coupled to the first substrate and comprising a first component top side exposed from the substrate top side, a first component bottom side, a first active region, and a first component sidewall between the first component top side and the first component bottom side, (c) providing a second electronic component coupled to the first substrate and comprising, a second component top side exposed from the substrate top side, a second component bottom side, a second active region, and a second component sidewall between the second component top side and the second component bottom side, (d) providing a first internal interconnect coupling the second electronic component to the first substrate interconnect, and (e) providing a cover structure on the first substrate; wherein providing the first substrate can comprise providing the first encapsulant coating the first component sidewall and the first substrate interconnect.
Other examples are included in the present disclosure. Such examples may be found in the figures, in the claims, and/or in the description of the present disclosure.
FIG. 1 shows a cross-sectional view of an example semiconductor device 100. In the example shown in FIG. 1, semiconductor device 100 can comprise a substrate 110, electronic components 120 and 130, a cap 140, an cover structure 150, external interconnects 160, adhesives 170A and 1708 and internal interconnects 180A and 1808.
Substrate 110 can comprise an encapsulant 115 and substrate interconnects 112. Electronic component 120 can comprise a terminal 121. Electronic component 130 can comprise a terminal 131 and a MEMS (Micro-Electro Mechanical System) region 132.
Substrate 110, cap 140, cover structure 150, external interconnects 160, adhesives 170A and 1708 and internal interconnects 180A and 1808 can be referred to as a semiconductor package 190, and can provide electronic components 120 and 130 with protection from external elements and/or environmental exposure. Additionally, semiconductor package 190 can provide electrical coupling between an external component and external interconnects 160.
FIGS. 2 to 15 show various drawings of an example method for manufacturing semiconductor device 100. FIG. 2 shows perspective view of an example method for manufacturing an example semiconductor device 100 at an early stage of manufacture.
In the example shown in FIG. 2, a substantially planar carrier 101 can be prepared. Carrier 101 can be referred to as a plate, a board, a wafer, a panel or a strip. Carrier 101 can include, for example, but not limited to, steel, stainless steel, aluminum, copper, glass or a wafer. Carrier 101 can have a thickness in the range from approximately 500 μm (micrometers) to approximately 1500 μm. Carrier 101 can allow handling of multiple components, during attachment of electronic components 120 and 130, encapsulation, formation of an opening in encapsulant 115, and plating and/or formation of interconnections, in an integrated manner. Carrier 101 can be commonly applied to different examples of this disclosure.
Temporary bond layer 102 can be formed on a surface of carrier 101. Temporary bond layer 102 can be formed on the surface of carrier 101 using a coating process, such as spin coating, doctor blade, casting, painting, spray coating, slot die coating, curtain coating, slide coating or knife over edge coating; a printing process, such as screen printing, pad printing, gravure printing, flexographic coating or offset printing; an inkjet printing process with features intermediate between coating and printing; or direct attachment of an adhesive film or an adhesive tape. Temporary bond layer 102 can be referred to as a temporary adhesive film or a temporary adhesive tape. Temporary bond layer 102 can be, for example, a thermally releasable tape (film) or a UV releasable tape (film), and/or can be weakened in its bonding strength or is removed by heat or UV irradiation. In some examples, temporary bond layer 102 can have a weakened bonding strength or can be removed by physical and/or chemical external forces. Temporary bond layer 102 can have a thickness in the range from approximately 50 μm to approximately 150 μm. Temporary bond layer 102 can allow separation of carrier 101 to form external interconnects 160. Temporary bond layer 102 can be commonly applied to different examples of this disclosure.
Conductive layer 103 can be formed on a surface of temporary bond layer 102. Conductive layer 103 can be referred to as a seed layer or a base layer. In some examples, conductive layer 103 can be made of, but not limited to, titanium, tungsten, titanium/tungsten, copper, gold, silver, palladium, or nickel. In some examples, conductive layer 103 can be formed using, but not limited to, sputtering, electroless plating, electroplating, physical vapor deposition (PVD), chemical vapor deposition (CVD), metal organic chemical vapor deposition (MOCVD), atomic layer deposition (ALD), low pressure chemical vapor deposition (LPCVD), or plasma enhanced chemical vapor deposition (PECVD). Conductive layer 103 can have a thickness in the range from approximately 500 Å to approximately 3000 Å. Conductive layer 103 can facilitate forming substrate interconnects 112 at a later stage of manufacture. Conductive layer 103 can be commonly applied to different examples of this disclosure.
FIGS. 3A and 3B show perspective and cross-sectional views semiconductor device 100 at a later stage of manufacture. In the example shown in FIGS. 3A and 3B, electronic component 120 can be adhered to conductive layer 103 provided on carrier 101. In some examples, electronic component 120 can be arrayed on or adhered to conductive layer 103 in a matrix configuration having rows and/or columns. In some examples, electronic component 120 can be adhered to conductive layer 103 using an adhesive, an adhesive film or an adhesive tape. Electronic component 120 can have a top side, a bottom side opposite to the top side, and a sidewall connecting the top side and the bottom side. In some examples, the top side can have an active region, and the bottom side can have a non-active region. The bottom side of electronic component 120 can be adhered to conductive layer 103 of carrier 101. The top side of electronic component 120 can comprise at least one terminal 121. In some examples, terminal 121 can comprise or be referred to as a die pad, a bond pad, or a solder bump, or a pillar bump. Terminal 121 can have a width in the range from approximately 2 μm to approximately 80 μm. Electronic component 120 can be referred to as a semiconductor die or a semiconductor chip. In some examples, the active region of electronic component 120 can comprise processing circuitry to process an electrical signal received from electronic component 130. In some examples, the active region of electronic component 120 can comprise an application specific integrated circuit, a logic die, a micro control unit, a memory, a digital signal processor, an analog to digital converter, a network processor, a power management unit, an audio processor, an RF circuit, or a wireless baseband system on chip processor. Electronic component 120 can have a thickness in the range from approximately 50 μm to approximately 200 μm.
FIGS. 4A and 4B show perspective and cross-sectional view of semiconductor device 100 at a later stage of manufacture. In the example shown in FIGS. 4A and 4B, encapsulant 115 can be formed on surfaces of conductive layer 103 and electronic component 120, such that electronic component 120 is embedded in substrate 110. In some examples, encapsulant 115 can coat or be brought into contact with the sidewall of electronic component 120. In addition, encapsulant 115 can be brought into contact with a surface of conductive layer 103 not overlapping the bottom side of electronic component 120. In some examples, the top side of electronic component 120 can be substantially coplanar with the top side of encapsulant 115, and the top side of electronic component 120 can be exposed through the top side of encapsulant 115. In some examples, the bottom side of electronic component 120 can be substantially coplanar with the bottom side of encapsulant 115, and the bottom side of electronic component 120 can be exposed through the bottom side of encapsulant 115.
In some examples, encapsulant 115 can comprise or be referred to as an epoxy molding compound, a molding layer, or a sealant. In some examples, encapsulant 115 can comprise an organic resin, an inorganic filler, a curing agent, a catalyst, a coupling agent, a colorant, and/or a flame retardant. Molding based on encapsulant 115 can be formed by any of a variety of processes. In some examples, encapsulant 115 can be formed by, but not limited to, film assist molding, compression molding, transfer molding, liquid-phase encapsulant molding, vacuum lamination, or paste printing. Encapsulant 115 can have a thickness in the range from approximately 50 μm to approximately 200 μm. Encapsulant 115 can protect electronic component 120 from external elements and/or environmental exposure. In some examples, encapsulant 115 can comprise or be referred to as a body of substrate 110, such that electronic component 120 can be considered as embedded in substrate 110.
FIGS. 5A, 5B, 5C and 5D show perspective, cross-sectional, top plane and enlarged cross-sectional views of semiconductor device 100 at a later stage of manufacture. In the example shown in FIGS. 5A, 5B, 5C and 5D, openings 116 can be formed in encapsulant 115. In some examples, openings 116 can be formed in regions spaced apart from the sidewall of electronic component 120 while passing through encapsulant 115. In some examples, openings 116 can include a plurality of openings formed around electronic component 120. A surface of conductive layer 103 can be exposed by openings 116. Openings 116 can be referred to as penetration holes or vias, such as through-mold-vias (TMV). In some examples, openings 116 can be formed by, but not limited to, laser drilling, mechanical drilling or/and a chemical etching process. Openings 116 can have a width in the range from approximately 5 μm to approximately 20 μm. Openings 116 can allow formation of substrate interconnects 112.
FIGS. 6A, 6B and 6C show perspective, cross-sectional and enlarged cross-sectional views of semiconductor device 100 at a later stage of manufacture. In the example shown in FIGS. 6A, 6B and 6C, photosensitive film 117 can be laminated on the top sides of electronic component 120 and encapsulant 115. In some examples, photosensitive film 117 can be formed on the top sides of electronic component 120 and encapsulant 115 by spin coating, doctor blade, casting, painting, spray coating, slot die coating, curtain coating, or a knife over edge coating. In some examples, photosensitive film 117 can cover openings 116 formed in encapsulant 115. In some examples, openings can be formed in photosensitive film 117 as the result of patterning to expose openings 116. Accordingly, openings of photosensitive film 117 can be connected with openings 116 of encapsulant 115. Photosensitive film 117 can be referred to as a dry film, a dry film resist, a photoresist, or a photoresist film. Photosensitive film 117 can prevent substrate interconnects 112 from being formed on the top sides of electronic component 120 and/or encapsulant 115 during formation of substrate interconnects 112, which will later be described.
FIGS. 7A, 7B and 7C show perspective, cross-sectional and enlarged cross-sectional views of semiconductor device 100 at a later stage of manufacture. In the example shown in FIGS. 7A, 7B and 7C, substrate interconnects 112 can be formed in openings 116 of encapsulant 115. In some examples, substrate interconnects 112 can be filled in openings 116 of encapsulant 115. In some examples, substrate interconnects 112 can be formed by electroplating through conductive layer 103 to gradually increase the height and/or thickness of substrate interconnects 112. The thickness or height of substrate interconnects 112 can be similar to or the same with the thickness or height of encapsulant 115 at an end stage of electroplating. In some examples, substrate interconnects 112 can be formed by sputtering, electroless plating, PVD, CVD, MOCVD, ALD, LPCVD or PECVD, in addition to and/or instead of electroplating. In some examples, substrate interconnects 112 can be made from copper, gold, silver, palladium, or nickel. Substrate interconnects 112 can be referred to as pillars, posts, vias, TMVs, vertical paths, or conductive paths. Substrate interconnects 112 can have a width in the range from approximately 5 μm to approximately 20 μm and a thickness in the range from approximately 50 μm to approximately 200 μm. As will be later described, substrate interconnects 112 can electrically and mechanically connect internal interconnects 180A and 180B and external interconnects 160 to each other. In some examples, encapsulant 115 and substrate interconnects 112 can be regarded as components of substrate 110.
FIGS. 8A, 8B and 8C show perspective, cross-sectional and enlarged cross-sectional views of semiconductor device 100 at a later stage of manufacture. In the example shown in FIGS. 8A, 8B and 8C, photosensitive film 117 can be removed from the top sides of encapsulant 115 and/or electronic component 120. In some examples, photosensitive film 117 can be removed by heat, light, a chemical solution and/or a physical external force. Top sides of substrate interconnects 112 can be made substantially coplanar with the top sides of electronic component 120 and/or encapsulant 115. In some examples, the top sides of substrate interconnects 112 can be exposed through the top side of encapsulant 115, or the sidewalls of substrate interconnects 112 can be coated by encapsulant 115. In some examples, substrate interconnects 112 can extend from the bottom side to the top side of substrate 110.
Substrate 110 can include encapsulant 115 and substrate interconnects 112, and can be configured such that electronic component 120 is embedded in encapsulant 115 and/or in substrate 110, providing reduced thickness for semiconductor device 100. Encapsulant 115 extends from the bottom side to the top side of substrate 110
FIGS. 9A and 9B show perspective and cross-sectional views of semiconductor device 100 at a later stage of manufacture. In the example shown in FIGS. 9A and 9B, electronic component 130 can be attached to substrate 110 or to electronic component 120 embedded in substrate 110. In some examples, electronic component 120 can have a larger width than electronic component 130. In such examples, the bottom side of electronic component 130 can be adhered to the top side of electronic component 120 or the top side of substrate 110 using adhesive (170A of FIG. 1). In some examples, electronic component 120 can have a smaller width than electronic component 130. In such examples, a portion of the bottom side of electronic component 130 can be adhered to the top side of electronic component 120 using adhesive 170A, and another portion of the bottom side of electronic component 130 can be adhered to the top side of encapsulant 115 using adhesive 170A. The top side of electronic component 130 can comprise terminal 131. In some examples, terminal 131 can comprise or be referred to as a die pad, a bond pad, a solder bump, or a pillar bump. Terminal 131 can have a width in the range from approximately 2 μm to approximately 80 μm. Electronic component 130 can comprise or be referred to as a MEMS device, a semiconductor die or a semiconductor chip. Electronic component 130 can have a thickness in the range from approximately 200 μm to approximately 300 μm. In some examples, electronic component 130 can comprise an active region on its top side, such as a MEMS or micro-electro-mechanical component on its top side. In some examples, electronic component 130 can further comprise a cap 140 attached to its top side using adhesive (170B of FIG. 1) to protect MEMS region 132. A gap or a space can be provided between the bottom side of cap 140 and the top side or the active region of electronic component 130. Cap 140 can have a smaller width than electronic component 130, and can be attached without overlapping terminal 131 of electronic component 130. Cap 140 can be referred to as a cover or a lid. Cap 140 can be made from silicon, glass, metal or resin. Cap 140 can be translucent, whether transparent or semi-transparent, and/or can have a thickness in the range from approximately 200 μm to approximately 250 μm.
FIGS. 10A and 10B show perspective and cross-sectional views of semiconductor device 100 at a later stage of manufacture. In the example shown in FIGS. 10A and 10B, internal interconnect 180A can electrically connect terminal 121 of electronic component 120 with substrate interconnects 112, and internal interconnect 180B can electrically connect terminal 131 of electronic component 130 with substrate interconnects 112. In some examples, internal interconnects 180A and 180B can electrically connect electronic component 120 and electronic component 130 to each other. In some examples, internal interconnects 180A and 180B can be referred to as wires or bonding wires. In some examples, internal interconnects 180A and 180B can have a loop height in the range from approximately 30 μm to approximately 70 μm and a diameter in the range from approximately 15 μm to approximately 25 μm. In some examples, internal interconnects 180A and 180B can be made from gold, copper or aluminum. In some examples, internal interconnect 180A can electrically connect electronic component 120 and substrate interconnects 112 to allow electrical connection of electronic component 120 to an external component. In some examples, internal interconnect 180B can electrically connect electronic component 130 and substrate interconnects 112 to allow electrical connection of electronic component 130 to an external component. In some examples, internal interconnect 180A or 180B can electrically connect electronic component 120 and electronic component 130 to each other, receiving and transmitting electrical signals from/to each other.
FIG. 11 shows cross-sectional view of semiconductor device 100 at a later stage of manufacture. In the example shown in FIG. 11, cover structure 150 can cover or coat electronic components 120 or 130 positioned on substrate 110, and internal interconnects 180A and 180B. In some examples, cover structure 150 comprises a cover encapsulant or cover molding layer, and substrate encapsulant comprises a substrate molding layer, where the cover molding layer coats the substrate molding layer. In some examples, cover structure 150 coats the sidewall of electronic component 130. In some examples, cover structure 150 covers the sidewall of cap 140, but can leave the top side of cap 140 exposed. In some examples, cover structure 150 coats the top side of electronic component 120 and the top side of electronic component 130 at least partially. In some examples, cover structure 150 can be brought into contact with substrate encapsulant 115 and substrate interconnects 112. In addition, in some examples, cover structure 150 can encapsulate the sidewalls and top sides of electronic components 120 and 130, except for bottom sides of electronic components 120 and 130, and can encapsulate internal interconnects 180A and 180B. In some examples, cover structure 150 may not encapsulate the top side of cap 140. Here, the top side of cap 140 can be exposed through cover structure 150 accordingly. In some examples adhesive 170A can be located between the bottom side of electronic component 130 and the top side of substrate 110 or the top side of electronic component 120 as can be seen in FIG. 1, and cover structure 150 comprises an encapsulant that coats a sidewall of adhesive 170 and a portion of the top side of adhesive 170 that extends beyond a footprint of electronic component 130.
Cover structure 150 can have a thickness in the range from approximately 450 μm to approximately 500 μm. Cover structure 150 can provide electronic components 120 and 130 and internal interconnects 180A and 180 with protection from external elements and/or environmental exposure. In some examples, cover structure 150 can be formed using similar encapsulant materials or processes as those described for encapsulant 115 of substrate 110.
FIG. 12 shows cross-sectional view of semiconductor device 100 at a later stage of manufacture. In the example shown in FIG. 12, carrier 101 can be separated from conductive layer 103. In some examples, temporary bond layer 102 can be separated from conductive layer 103 in a state in which it is attached to carrier 101. In some examples, heat, light, a chemical solution and/or a physical external force can be provided, thereby removing or reducing a bonding strength of temporary bond layer 102. Accordingly, conductive layer 103 can be exposed.
FIG. 13 shows cross-sectional view of semiconductor device 100 at a later stage of manufacture. In the example shown in FIG. 13, conductive layer 103 can be removed. In some examples, conductive layer 103 can be removed by mechanical grinding and/or chemical etching. Accordingly, the bottom sides of electronic component 120, substrate interconnects 112 and substrate encapsulant 115 can be exposed. In some examples, the bottom sides of electronic component 120, substrate interconnects 112 and substrate encapsulant 115 can be made substantially coplanar. In some examples, the bottom sides of electronic component 120 and substrate interconnects 112 can be exposed through the bottom side of encapsulant 115.
FIG. 14 shows cross-sectional view of semiconductor device 100 at a later stage of manufacture. In the example shown in FIG. 14, external interconnects 160 can be provided at bottom sides of substrate interconnects 112. External interconnect 160 can comprise or be connected to substrate interconnects 112 through a low melting point material. In some examples, external interconnects 160 can comprise of be referred to as solder balls, solder pads, or pad platings. In some examples, external interconnects 160 can be made from, but not limited to, Sn, Ag, Pb, Cu, Sn—Pb, Sn37-Pb, Sn95-Pb, Sn—Pb—Ag, Sn—Cu, Sn—Ag, Sn—Au, Sn—Bi or Sn—Ag—Cu. External interconnect 160 can have a thickness in the range from approximately 50 μm to approximately 150 μm. External interconnect 160 can allow mounting of semiconductor package 190 to an external device.
FIG. 15 shows cross-sectional view of semiconductor device 100 at a later stage of manufacture. In the example shown in FIG. 15, semiconductor device 100 can be singulated into discrete semiconductor devices. In some examples, semiconductor device 100 can be singulated into discrete semiconductor devices by a diamond blade or laser beam. In some examples, the sidewalls of substrate encapsulant 115 and cover structure 150 can be made substantially coplanar.
When singulated, semiconductor device 100 can correspond to the depiction shown in FIG. 1. As can be appreciated there, substrate interconnect 112 is represented as a conductive vertical via that extends from top to bottom of substrate 110, with its sidewall coated or directly contacted by encapsulant 115. In some examples, substrate interconnect 112 can be applied as a via structure that comprises a conductive via and a dielectric casing around the sidewall of the conductive via, where the sidewall of the dielectric casing can be coated by encapsulant 115 of substrate 110. In some examples such via structure can comprise a PCB insert, with the dielectric casing defined by one or more laminate layers having, for instance, inorganic or fiberglass strands. In some examples, such via structure can comprise a pre-molded insert, with the dielectric casing defined by a molding compound distinct from encapsulant 115.
Semiconductor device 100 having reduced dimensions can be achieved by the manufacturing method described. In some examples, as the thickness and width of semiconductor device 100 can be reduced by such manufacturing method, semiconductor device 100 can be suitably applied to a wearable device.
FIG. 16 shows a cross-sectional view of an example semiconductor device 200. In the example shown in FIG. 16, semiconductor device 200 can comprise substrates 110 and 210, electronic components 120 and 130, cap 140, cover structure 150, external interconnects 160, adhesives 170A and 170B and internal interconnects 180. In addition, semiconductor device 200 can comprise an adhesive 270 and/or an interface film 280.
Substrate 210 can comprise conductive structures 211 and dielectric structures 212. Adhesive 270 can be interposed between electronic component 120 and electronic component 130. Interface film 280 can be interposed between substrate 110 and cover structure 150.
Substrates 110 and 210, cap 140, cover structure 150, external interconnects 160, adhesives 170A, 170B and 270, internal interconnects 180 and interface film 280 can be collectively referred to as a semiconductor package 290, and/or can provide electronic components 120 and 130 with protection from external elements and/or environmental exposure. In addition, semiconductor package 290 can provide electrical coupling between an external component and external interconnects 160.
FIGS. 17 to 30 show various drawings of an example method for manufacturing semiconductor device 200. FIG. 17 shows perspective view of an example method for manufacturing semiconductor device 200 at an early stage of manufacture.
In the example shown in FIG. 17, a substantially planar carrier 101 can be prepared. In addition, interface film 280 can be formed on a surface of carrier 101. Interface film 280 can be formed on the surface of carrier 101 using a coating process, such as spin coating, doctor blade, casting, painting, spray coating, slot die coating, curtain coating, slide coating or knife over edge coating; a printing process, such as screen printing, pad printing, gravure printing, flexographic coating or offset printing; an inkjet printing process with features intermediate between coating and printing; or direct attachment of an adhesive film or an adhesive tape. Interface film 280 can have a thickness in the range from approximately 50 μm to approximately 150 μm. Interface film 280 can be removed during the manufacture of semiconductor device 200. Alternatively, as described above, interface film 280 can be interposed between substrate 110 and cover structure 150 and can remain between substrate 110 and cover structure 150. Conductive layer 103 can be further formed on a surface of interface film 280.
FIGS. 18A and 18B show perspective and cross-sectional view of semiconductor device 200 at a later stage of manufacture. In the example shown in FIGS. 18A and 18B, substrate interconnects 112 can be formed on conductive layer 103 provided on a top surface of carrier 101. In some examples, substrate interconnects 112 can be formed on conductive layer 103 in a matrix configuration having rows and/or columns. In some examples, substrate interconnects 112 can be formed by, but not limited to, electroplating, electroless plating, sputtering, PVD, CVD, MOCVD, ALD, LPCVD or PECVD. In some examples, substrate interconnects 112 can be made from copper, gold, silver, palladium, or nickel. Substrate interconnects 112 can be referred to as pillars, posts, vias, or conductive paths. In some examples, substrate interconnects 112 can electrically and mechanically connect internal interconnects 180, which will later be described, and substrate 210 to each other.
FIGS. 19A and 19B show perspective and cross-sectional view of semiconductor device 200 at a later stage of manufacture. In the example shown in FIGS. 18A and 18B, conductive layer 103 of regions not overlapping substrate interconnects 112 can be removed. The removing of conductive layer 103 can be performed by, for example, but not limited to, soft etching using substrate interconnects 112 as masks. Accordingly, conductive layer 103 of regions overlapping substrate interconnects 112 may remain. In some examples, electronic component 120 can be adhered onto interface film 280 over an empty region between substrate interconnects 112. In some examples, electronic component 120 can be adhered to interface film 280 using adhesive 270. The bottom side of electronic component 120 can be adhered to interface film 280 using adhesive 270.
FIGS. 20A and 20B show perspective and cross-sectional view of semiconductor device 200 at a later stage of manufacture. In the example shown in FIGS. 20A and 20B, encapsulant 115 can be formed on sidewalls of substrate interconnects 112 and electronic component 120. In some examples, encapsulant 115 can be brought into contact with sidewalls of substrate interconnects 112 and electronic component 120. In addition, encapsulant 115 can be brought into contact with a surface of interface film 280 not overlapping bottom sides of substrate interconnects 112 and electronic component 120. In addition, the top sides of substrate interconnects 112 and electronic component 120 can be made substantially coplanar with the top side of encapsulant 115. The top sides of substrate interconnects 112 and electronic component 120 can be exposed through the top side of encapsulant 115. In some examples, substrate 110 can comprise embedded electronic component 120 and substrate interconnects 112.
FIGS. 21A and 21B show perspective and cross-sectional view of semiconductor device 200 at a later stage of manufacture. In the example shown in FIGS. 21A and 21B, substrate 210 can be formed on top sides of substrate 110 and electronic component 120. In some examples, substrate 210 can comprise conductive structures 211 and dielectric structures 212. Conductive structures 211 can comprise one or more conductive layers or paths. Conductive structures 211 can be electrically connected to terminal 121 of electronic component 120 and/or substrate interconnects 112 of substrate 110. Dielectric structures 212 can comprise one or more dielectric layers. Dielectric structures 212 can cover conductive structures 211, thereby protecting conductive structures 211 from external elements.
In some examples, conductive structures 211 can be referred to as a redistribution layer (RDL), a wiring pattern or a circuit pattern. In some examples, conductive structures 211 can be made from, for example, but not limited to, copper, aluminum, gold, silver, or nickel. Conductive structures 211 can be formed by, for example, but not limited to, sputtering, electroless plating, electroplating, PVD, CVD, MODVD, ALD, LPCVD or PECVD. Conductive structures 211 can have a thickness and width in ranges from approximately 2 μm to approximately 10 μm. Some of conductive structures 211 can be electrically connected to terminal 121 of electronic component 120. Some of conductive structures 211 can be electrically connected to substrate interconnects 112. Some of conductive structures 211 can be electrically connected to terminal 121 of electronic component 120 and substrate interconnects 112, thereby electrically connecting terminal 121 of electronic component 120 and substrate interconnects 112 to each other. In some examples, dielectric structures 212 can comprise or be referred to as a passivation layer, an insulation layer or a protection layer. Dielectric structures 212 can be made from, for example, but not limited to, Si3N4, SiO2, SiON, PI, BCB, PBO, BT, epoxy resin, phenol resin, silicon resin, or acrylate polymer. In addition, dielectric structures 212 can be formed by, for example, but not limited to, PVD, CVD, MOCVD, ALD, LPCVD, PECVD, printing, spin coating, spray coating, sintering or thermal oxidation. In some examples, dielectric structures 212 can cover top sides of electronic component 120, substrate encapsulant 115 and substrate interconnects 112, but terminal 121 of electronic component 120 and substrate interconnects 112 can be exposed through patterning. Dielectric structures 212 can have a thickness in the range from approximately 10 μm to approximately 15 μm. In some examples, some regions of conductive structures 211 can be exposed through dielectric structures 212.
Substrate 210 is presented here as a redistribution layer (“RDL”) substrate. RDL substrates can comprise one or more conductive redistribution layers and one or more dielectric layers that (a) can be formed layer by layer over an electronic device to which the RDL substrate is to be electrically coupled, or (b) can be formed layer by layer over a carrier that can be entirely removed or at least partially removed after the electronic device and the RDL substrate are coupled together. RDL substrates can be manufactured layer by layer as a wafer-level substrate on a round wafer in a wafer-level process, and/or as a panel-level substrate on a rectangular or square panel carrier in a panel-level process. RDL substrates can be formed in an additive buildup process that can include one or more dielectric layers alternatingly stacked with one or more conductive layers that define respective conductive redistribution patterns or traces configured to collectively (a) fan-out electrical traces outside the footprint of the electronic device, and/or (b) fan-in electrical traces within the footprint of the electronic device. The conductive patterns can be formed using a plating process such as, for example, an electroplating process or an electroless plating process. The conductive patterns can comprise an electrically conductive material such as, for example, copper or other plateable metal. The locations of the conductive patterns can be made using a photo-patterning process such as, for example, a photolithography process and a photoresist material to form a photolithographic mask. The dielectric layers of the RDL substrate can be patterned with a photo-patterning process, which can include a photolithographic mask through which light is exposed to photo-pattern desired features such as vias in the dielectric layers. Thus, the dielectric layers can be made from photo-definable organic dielectric materials such as, for example, polyimide (PI), benzocyclobutene (BCB), or polybenzoxazole (PBO). Such dielectric materials can be spun-on or otherwise coated in liquid form, rather than attached as a pre-formed film. To permit proper formation of desired photo-defined features, such photo-definable dielectric materials can omit structural reinforcers or can be filler-free, without strands, weaves, or other particles, that could interfere with the light from the photo-patterning process. In some examples, such filler-free characteristics of filler-free dielectric materials can permit a reduction of the thickness of the resulting dielectric layer. Although the photo-definable dielectric materials described above can be organic materials, in other examples the dielectric materials of the RDL substrates can comprise one or more inorganic dielectric layers. Some examples of inorganic dielectric layer(s) can comprise silicon nitride (Si3N4), silicon oxide (SiO2), and/or SiON. The inorganic dielectric layer(s) can be formed by growing the inorganic dielectric layers using an oxidation or nitridization process instead using photo-defined organic dielectric materials. Such inorganic dielectric layers can be filler-fee, without strands, weaves, or other dissimilar inorganic particles. In some examples, the RDL substrates can omit a permanent core structure or carrier such as, for example, a dielectric material comprising bismaleimide triazine (BT) or FR4 and these types of RDL substrates can be referred to as a coreless substrate. Substrates in other examples of this disclosure can also comprise an RDL substrate.
In other examples, substrate 210 can be a pre-formed substrate. The pre-formed substrate can be manufactured prior to attachment to an electronic device and can comprise dielectric layers between respective conductive layers. The conductive layers can comprise copper and can be formed using an electroplating process. The dielectric layers can be relatively thicker non-photo-definable layers that can be attached as a pre-formed film rather than as a liquid and can include a resin with fillers such as strands, weaves, and/or other inorganic particles for rigidity and/or structural support. Since the dielectric layers are non-photo-definable, features such as vias or openings can be formed by using a drill or laser. In some examples, the dielectric layers can comprise a prepreg material or Ajinomoto Buildup Film (ABF). The pre-formed substrate can include a permanent core structure or carrier such as, for example, a dielectric material comprising bismaleimide triazine (BT) or FR4, and dielectric and conductive layers can be formed on the permanent core structure. In other examples, the pre-formed substrate can be a coreless substrate which omits the permanent core structure, and the dielectric and conductive layers can be formed on a sacrificial carrier that is removed after formation of the dielectric and conductive layers and before attachment to the electronic device. The pre-formed substrate can referred to as a printed circuit board (PCB) or a laminate substrate. Such pre-formed substrate can be formed through a semi-additive or modified-semi-additive process. Substrates in other examples of this disclosure can also comprise a pre-formed substrate.
FIGS. 22A and 22B show perspective and cross-sectional view of semiconductor device 200 at a later stage of manufacture. In the example shown in FIGS. 22A and 22B, external interconnects 160 can be formed on substrate 210. In some examples, external interconnects 160 can be formed on conductive structures 211 exposed through dielectric structures 212 of substrate 210. In some examples, UBMs (Under Bump Metallizations) can be formed on conductive structures 211 exposed through dielectric structures 212, and external interconnects 160 can be formed the UBMs.
FIGS. 23A and 23B show perspective and cross-sectional view of semiconductor device 200 at a later stage of manufacture. In the example shown in FIGS. 23A and 23B, a carrier 201 can be attached to substrate 210 and external interconnects 160. In some examples, a temporary bond layer 202 can be attached to a bottom side of carrier 201 and can also be attached to substrate 210 and external interconnects 160. Temporary bond layer 202 can surround external interconnects 160 and can be temporarily attached to dielectric structures 212 of substrate 210 not overlapping external interconnects 160 and/or conductive structures 211. Temporary bond layer 202 can be separated from substrate 210 and external interconnects 160 by heat, light, a chemical solution and/or a physical external force at a subsequent stage. Carrier 201 can have a thickness in the range from approximately 500 μm to approximately 1500 μm, and temporary bond layer 202 can have a thickness in the range from approximately 50 μm to approximately 150 μm. In some examples, shapes, materials and/or manufacturing methods of carrier 201 and temporary bond layer 202 can be similar to or the same with those of carrier 101 and temporary bond layer 102 having been described above.
FIGS. 24A and 24B show perspective and cross-sectional view of semiconductor device 200 at a later stage of manufacture. In the example shown in FIGS. 24A and 24B, carrier 101 can be separated from interface film 280. In some examples, interface film 280 can remain and only carrier 101 can be removed. In some examples, interface film 280 can be maintained at a state in which it is adhered to encapsulant 115, conductive layer 103 and an adhesive layer 270. Accordingly, conductive layer 103 and adhesive layer 270 remain be protected without being exposed during the manufacture of semiconductor device 200. In some examples, interface film 280 can be removed.
FIGS. 25A and 25B show perspective and cross-sectional view of semiconductor device 200 at a later stage of manufacture. The orientation of the assembly has been flipped from the previous stage. In the example shown in FIGS. 25A and 25B, openings 280A can be formed in interface film 280. Openings 280A can be formed in regions of interface film 280 corresponding to substrate interconnects 112. Accordingly, top sides of substrate interconnects 112 can be exposed through openings 280A of interface film 280. Openings 280A can be formed by laser drilling, mechanical drilling or/and a chemical etching process.
FIGS. 26A and 26B show top plane and cross-sectional view of semiconductor device 200 at a later stage of manufacture. In some examples, electronic component 130 can be attached to substrate 110. Electronic component 130 can comprise cap 140 as previously described (FIG. 9). In some examples, electronic component 130 can be attached using adhesive (170 of FIG. 16). In some examples, electronic component 130 can be attached onto a region of interface film 280 corresponding to electronic component 120 using adhesive 170. In some examples, electronic component 130 can have a smaller width than electronic component 120. In some examples, electronic component 130 can have a larger width than electronic component 120. In some examples, electronic component 130 is attached such that its active region faces upward. In some examples, the active region of electronic component 120 can face downward towards substrate 210.
FIGS. 27A and 27B show top plane and cross-sectional view of semiconductor device 200 at a later stage of manufacture. In the example shown in FIGS. 27A and 27B, internal interconnects 180 can electrically connect electronic component 130 and substrate interconnects 112. In some examples, internal interconnects 180 can be referred to as wires or bonding wires. In some examples, internal interconnects 180 can have a loop height in the range from approximately 30 μm to approximately 70 μm and a diameter in the range from approximately 15 μm to approximately 25 μm. In some examples, internal interconnects 180 can be made from gold, copper or aluminum. In some examples, internal interconnects 180 can allow electrical connection of electronic component 130 to an external component.
FIG. 28 shows cross-sectional view of semiconductor device 200 at a later stage of manufacture. In the example shown in FIG. 28, cover structure 150 can encapsulate electronic component 130 and internal interconnects 180 positioned on interface film 280. In some examples, cover structure 150 can be brought into contact with interface film 280 and substrate interconnects 112. In addition, in some examples, cover structure 150 can encapsulate the sidewall and top side of electronic component 130, except for a bottom side of electronic component 130, and can encapsulate internal interconnects 180. In some examples, cover structure 150 may not encapsulate a top side of cap 140. The top side of cap 140 can be exposed through cover structure 150.
FIG. 29 shows cross-sectional view of semiconductor device 200 at a later stage of manufacture. In the example shown in FIG. 29, carrier 201 can be separated to expose from substrate 210 and external interconnects 160. In some examples, temporary bond layer 202 can be separated from substrate 210 and external interconnects 160 while attached to carrier 201. In some examples, heat, light, a chemical solution and/or a physical external force can be provided, thereby removing or reducing a bonding strength of temporary bond layer 202.
FIG. 30 shows cross-sectional view of semiconductor device 200 at a later stage of manufacture. In the example shown in FIG. 30, semiconductor device 200 can be singulated into discrete semiconductor devices. In some examples, semiconductor device 200 can be separated into discrete semiconductor devices by a diamond blade or laser beam. As the result of sawing or singulation, the sidewalls of substrate encapsulant 115, substrate conductive structures 211, dielectric structures 212, or cover structure 150 can be substantially coplanar.
When singulated, semiconductor device 200 can correspond to the depiction shown in FIG. 16. As can be appreciated there, the top side of substrate 210 is coupled to the bottom side of substrate 110, and external interconnects 160 are coupled to the bottom side of substrate 210. Conductive structure 211 comprises conductors (traces, vias, pads) that extend between or through the one or more layers of dielectric structure 212 to define conductive paths between the top side to the bottom side of substrate 210. In some examples, a conductor of conductive structure 211 can be exposed at the top side of substrate 210, and can be coupled to terminal 121 of electronic component 120, where terminal 121 is exposed from encapsulant 115 at the bottom side of substrate 110. In some examples, a conductor of conductive structure 211 can be exposed at the top side of substrate 210, and can be coupled to substrate interconnect 112, where substrate interconnect 112 is exposed from encapsulant 115 at the bottom side of substrate 110. In some examples, substrate 210 can be an RDL substrate, where the top side or top dielectric layer of dielectric structure 212 can be conformal to a contour of the bottom side of substrate 110. In some examples, substrate 110 comprises adhesive 270 on the top side of electronic component 120, between electronic component 120 and electronic component 130. In some examples, the top side of adhesive 270 can be exposed from encapsulant 115 of substrate 110. In some examples, encapsulant 115 of substrate 110 can coat a sidewall of adhesive 270, or a portion of the bottom side of adhesive 270 that extends beyond a footprint of electronic component 120.
Semiconductor device 200 having reduced dimensions can be achieved by the manufacturing method described. In some examples, as the thickness and width of semiconductor device 200 can be reduced by such manufacturing method, semiconductor device 200 can be suitably applied to a wearable device.
FIG. 31 shows cross-sectional view of semiconductor device. In the example shown in FIG. 31, semiconductor device 300 can comprise a substrate 110, electronic components 320 and 330, cover structure 350, and protective layers 370A and 370B.
Substrate 110 as presented with respect to semiconductor device 300 can be similar to substrate 110 as previously described with respect to semiconductor devices 100 and 200, but comprises embedded electronic components 320 and 332. Electronic component 320 can comprise a terminal 321 and a MEMS region 322. Electronic component 330 can comprise a terminal 331. Cover structure 350 can comprise compartments 351 and 352 and apertures 390A and 390B.
FIGS. 32 to 44 show various drawings of an example method for manufacturing semiconductor device 300. FIGS. 32A and 32B show perspective and cross-sectional view of semiconductor device 300 at an early stage of manufacture.
In the example shown in FIGS. 32A and 32B, a pair of electronic components 320 and 330 can be adhered in parallel to conductive layer 103 provided in a carrier 101. In some examples, pairs of electronic components 320 and 330 can be arrayed on or adhered to conductive layer 103 in a matrix configuration having rows and/or columns. In some examples, electronic components 320 and 330 can be adhered to conductive layer 103 using an adhesive, an adhesive film or an adhesive tape. Each of electronic components 320 and 330 can have a top side, a bottom side opposite to the top side, and a sidewall connecting the top side and the bottom side. In some examples, the top sides can have an active region, and the bottom sides can have a non-active region. The bottom sides of electronic components 320 and 330 can be adhered to conductive layer 103 of carrier 101. The top side of each of electronic components 320 and 330 can comprise at least one terminal 321, 331. Terminals 321 and 331 can comprise or be referred to as die pads, bond pads, solder bumps, or pillar bumps. Each of terminals 321 and 331 can have a width in the range from approximately 2 μm to approximately 80 μm. Electronic components 320 and 330 can be referred to as semiconductor dies or semiconductor chips. In addition, in some examples, each of electronic components 320 and/or 330 can comprise at least one of a MEMS component, a radiation emitting component such as a light emitting diode or a laser, a sensor or receiver component such as an optical sensor, a phototetector, or other reflection sensor, an application specific integrated circuit, a logic die, a micro control unit, a memory, a digital signal processor, a network processor, a power management unit, an audio processor, an RF circuit, or a wireless baseband system on chip processor. In an example, electronic component 320 can be an optical sensor and electronic component 330 can be a light emitting diode. In an example, electronic component 320 can comprise an emitter, such as a laser, and electronic component 330 can comprise a reflection sensor, such as a photodetector, for a LIDAR (Light Detection And Ranging) system. Electronic components 320 and 330 can have a thickness in the range from approximately 50 μm to approximately 200 μm.
FIGS. 33A and 33B show perspective and cross-sectional view of semiconductor device 300 at a later stage of manufacture. In the example shown in FIGS. 33A and 33B, encapsulant 115 can be formed on surfaces of conductive layer 103 and electronic components 320 and 330. In some examples, encapsulant 115 can be brought into contact with sidewalls of electronic components 320 and 330. In addition, encapsulant 115 can be brought into contact with a surface of conductive layer 103 not overlapping the bottom sides of electronic components 320 and 330. In addition, the top sides of electronic components 320 and 330 can be substantially coplanar with the top side of encapsulant 115. Electronic components 320 and 330 can be horizontally embedded in encapsulant 115, and the top sides of electronic components 320 and 330 can be exposed through the top side of encapsulant 115.
FIGS. 34A, 34B and 34C show perspective, cross-sectional and top plane view of semiconductor device 300 at a later stage of manufacture. In the example shown in FIGS. 34A and 34B, openings 116 can be formed in encapsulant 115. In some examples, openings 116 can be formed in regions spaced apart from sidewalls of each of electronic components 320 and 330 while passing through encapsulant 115. In some examples, openings 116 can include a plurality of openings formed around electronic components 320 and 330.
FIGS. 35A and 35B show perspective and cross-sectional view of semiconductor device 300 at a later stage of manufacture. In the example shown in FIGS. 35A and 35B, photosensitive film 117 can be laminated on the top sides of electronic components 320 and 330 and encapsulant 115 and then patterned. In some examples, photosensitive film 117 can close openings 116 formed in encapsulant 115, but openings 116 can be opened by a patterning process. Accordingly, openings of photosensitive film 117 can be connected with openings 116 of encapsulant 115.
FIGS. 36A and 36B show perspective and cross-sectional view of semiconductor device 300 at a later stage of manufacture. In the example shown in FIGS. 36A and 36B, substrate interconnects 112 can be formed in openings 116 of encapsulant 115. In some examples, substrate interconnects 112 can be filled in openings 116 of encapsulant 115.
FIGS. 37A and 37B show perspective and cross-sectional view of semiconductor device 300 at a later stage of manufacture. In the example shown in FIGS. 37A and 37B, photosensitive film 117 can be removed from the top sides of encapsulant 115 and/or electronic components 320 and 330. In some examples, the top sides of substrate interconnects 112 can be substantially coplanar with the top sides of electronic components 320 and 330 and encapsulant 115. In some examples, the top sides of substrate interconnects 112 can be exposed through the top side of encapsulant 115.
Substrate 110 can include encapsulant 115 and substrate interconnects 112, and can be configured such that pairs of electronic components 320 and 330 are embedded in parallel in encapsulant 115 and/or in substrate 110, providing reduced thickness for semiconductor device 300.
FIGS. 38A and 38B show top plane and cross-sectional view of semiconductor device 300 at a later stage of manufacture. In the example shown in FIGS. 38A and 38B, internal interconnect 180A can electrically connect terminal 321 of electronic component 320 and an adjacent substrate interconnect 112, and internal interconnect 180B can electrically connect terminal 331 of electronic component 330 and an adjacent substrate interconnect 112. In some examples, internal interconnect 180A can allow electronic component 320 to be electrically connected to an external component. In some examples, internal interconnect 180B can allow electronic component 330 to be electrically connected to an external component.
FIGS. 39A and 39B show top plane and cross-sectional view of semiconductor device 300 at a later stage of manufacture. In the example shown in FIGS. 39A and 39B, protective layers 370A and 370B can cover electronic components 320 and 330. In some examples, protective layers 370A and 370B can cover the entire top sides of electronic components 320 and 330 and can also cover some regions of encapsulant 115 around electronic components 320 and 330 and some regions of internal interconnects 180A and 180B. In some examples, some regions of internal interconnects 180A and 180B can be exposed from protective layers 370A and 370B. Protective layers 370A and 370B can be made from translucent materials, whether transparent or semi-transparent to radiation such as light. In some examples, each of protective layers 370A and 370B can comprise or be referred to as an insulator, a dielectric, a protection layer, a translucent layer, or a FOW (Film Over Wire or Film On Wire).
In some examples, protective layers 370A and 370B can be derived from liquid-phase insulators. In some examples, a constant amount of liquid-phase insulator can be applied to the top side of each of electronic components 320 and 330. Here, the liquid-phase insulator can cover some regions of internal interconnects 180A and 180B. The liquid-phase insulator can exist in a liquid phase when it is in a packing material. However, once the liquid-phase insulator is applied to top sides of electronic components 320 and 330, like in this disclosure, it can turn into a solid-phase insulator. In some examples, after being applied to top sides of electronic components 320 and 330, the liquid-phase insulator can be in a liquid phase at room temperature and can turn into a solid-phase insulator when it is heated to a temperature higher than a reference temperature and then cooled. Each of protective layers 370A and 370B can have a round section (e.g., an upper boundary) having a radius of curvature because of manufacturing characteristics. Protective layers 370A and 370B can have a thickness in the range from approximately 50 μm to approximately 100 μm. Protective layers 370A and 370B can prevent the top sides of electronic components 320 and 330 from being corroded or damaged.
FIGS. 40A and 40B show top plane and cross-sectional view of semiconductor device 300 at a later stage of manufacture. In the example shown in FIGS. 40A and 40B, cover structure 350 can be attached to substrate 110.
Cover structure 350 can comprise compartment 351 over and surrounding electronic component 320 and internal interconnect 180A. Compartment 351 comprises aperture 390A that extends through a top side of cover structure 350 and that allows light or radiation to be incident on electronic component 320. Cover structure 350 can comprise compartment 352 over and surrounding electronic component 330 and internal interconnect 180B. Compartment 352 comprises aperture 390B that extends through a top side of cover structure 350 and that allows radiation such as light to be emitted from electronic component 330. In some examples, apertures 390A or 390B can comprise a translucent material, or a translucent material can be located on or under apertures 390A or 390B. In some examples, each of apertures 390A and 390B can be shaped as a circle, or can have a diameter or breadth in the range from approximately 400 μm to approximately 600 μm. Cover structure 350 can comprise divisor wall 355 that divides compartment 351 and compartment 352 from each other, and that can restrict radiation of electronic component 330 at compartment 352 from being directly incident on electronic component 320 or compartment 351. Cover structure 350 can be referred to as a lid, a cap, or a cover. In some examples, cover structure 350 can be pre-fabricated using a metal, plastic, laminate substrate, or ceramic, and can be bonded or adhered to encapsulant 115 of substrate 110. Cover structure 350 can have a height in the range from approximately 400 μm to approximately 600 μm. Cover structure 350 generally can protect electronic components 320 and 330 and internal interconnects 180A and 180B from external elements and/or environmental exposure. In addition, compartments 351 and 352 of cover structure 350 can prevent the radiation emitted from, for example, electronic component 330, from being incident into adjacent electronic component 320.
FIG. 41 shows cross-sectional view of semiconductor device 300 at a later stage of manufacture. In the example shown in FIG. 41, carrier 101 can be separated from conductive layer 103. In some examples, temporary bond layer 102 can be separated from conductive layer 103 while attached to carrier 101. In some examples, heat, light, a chemical solution and/or a physical external force can be provided, thereby removing or reducing a bonding strength of temporary bond layer 102. Accordingly, conductive layer 103 can be exposed.
FIG. 42 shows cross-sectional view of semiconductor device 300 at a later stage of manufacture. In the example shown in FIG. 42, conductive layer 103 can be removed. In some examples, conductive layer 103 can be removed by mechanical grinding and/or chemical etching. Accordingly, bottom sides of electronic components 320 and 330, substrate interconnects 112 and substrate encapsulant 115 can be exposed. In some examples, bottom sides of electronic components 320 and 330, substrate interconnects 112 and substrate encapsulant 115 can be substantially coplanar. In some examples, the bottom sides of electronic components 320 and 330 and the bottom sides of substrate interconnects 112 can be exposed through the bottom side of encapsulant 115.
FIG. 43 shows cross-sectional view of semiconductor device 300 at a later stage of manufacture. In the example shown in FIG. 43, external interconnects 160 can be provided on the bottom sides of substrate interconnects 112. External interconnects 160 can comprise or be connected to substrate interconnects 112 through a low melting point material. External interconnects 160 can allow semiconductor device 300 to be mounted to an external device.
FIG. 44 shows cross-sectional view of semiconductor device 300 at a later stage of manufacture. In the example shown in FIG. 44, semiconductor device 300 can be singulated into discrete semiconductor devices. In some examples, semiconductor device 300 can be singulated into discrete semiconductor devices by a diamond blade or laser beam. In some examples, sidewalls of substrate encapsulant 115 and cover structure 350 can be made substantially coplanar.
When singulated, semiconductor device 300 can correspond to the depiction shown in FIG. 31. As can be appreciated there, electronic component 320 and electronic component 330 are coupled to or embedded in substrate 110, with their sidewalls coated by encapsulant 115 and their top sides exposed from encapsulant 115. In some examples, the bottom sides of electronic component 320 or electronic component 330 can be exposed from encapsulant 115 at the bottom side of substrate 110. In some examples, the top side of electronic device 320 comprises an active area and terminal 321. In some examples, the top side of electronic device 330 comprises an active area and terminal 322. Internal interconnect 180A couples terminal 321 to a substrate interconnect 112 of substrate 110, and internal interconnect 1808 couples terminal 331 to another substrate interconnect 112 of substrate 110. Electronic devices 320 and 330 are separated from each other by a portion of encapsulant 115 of substrate 110. Cover structure 350 comprises divisor wall 355 that divides compartments 351 and 352 and that is located over the portion of encapsulant 115 that separates electronic component 320 from electronic component 330. In some examples, electronic component 320 can comprise a radiation emitting component that emits radiation through aperture 390B of compartment 352. In some examples, electronic component 330 can comprise a radiation receiver component that, through aperture 390A of compartment 351, senses or detects a reflection of the radiation emitted by electronic component 320. in some examples, protective layers 370A and 370B can be translucent with respect to the radiation emitted by electronic component 330, permitting emission of such radiation from electronic device 330 and detection of a reflection of such radiation by electronic device 320. In some examples, divisor wall 355 or compartment 351 can be opaque with respect to the radiation emitted by electronic component 330, restricting such radiation from entering compartment 351 and directly inciding upon electronic component 320 other than through aperture 390A.
Semiconductor device 300 having reduced dimensions can be achieved by the manufacturing method described. In some examples, as the thickness and width of semiconductor device 300 can be reduced by such manufacturing method, semiconductor device 300 can be suitably applied to a wearable device.
FIG. 45 shows a cross-sectional view of an example semiconductor device 400. In the example shown in FIG. 45, semiconductor device 400 can comprise a substrate 110, electronic components 120 and 430 and a cover structure 450.
Substrate 110 can further comprise an opening or aperture 119, compared to substrates in other examples of this disclosure. Electronic component 430 can comprise a terminal 431 and a MEMS region 432. Cover structure 450 can comprise a compartment 451.
Substrate 110, cover structure 450, external interconnects 160 and internal interconnects 180A, 180B and 180C can be referred to a semiconductor package 490, which can provide electronic components 120 and 430 with protection from external elements and/or environmental exposure. In addition, semiconductor package 490 can provide electrical coupling between an external component and external interconnects 160.
FIGS. 46 to 56 show various drawings of an example method for manufacturing semiconductor device 400.
FIGS. 46A, 46B, 46C and 46D show perspective, top plane, cross-sectional and enlarged cross-sectional view of semiconductor device 400 at an early stage of manufacture. In the example shown in FIGS. 46A and 46B, at least two types of openings 116 and 119 can be formed in encapsulant 115. Opening (aperture) 119 positioned adjacent to electronic component 120 can have a relatively larger diameter and can pass through encapsulant 115 and conductive layer 103. Opening 116 can be formed about sides of electronic components 120 and 430 and opening 119, and can pass through encapsulant 115. Here, opening 119 having a relatively larger diameter or breadth can be formed to permit an external signal, such as a pressure signal, to reach electronic component 430. Openings 116 having a relatively smaller diameter can be plurally formed to provide a path to substrate interconnects 112.
The formation of opening 119 can be similar to the formation of opening 116 as described with respect to other examples here. Opening 119 can have a diameter in the range from approximately 400 μm to approximately 500 μm, and openings 116 can have a diameter in the range from approximately 5 μm to approximately 20 μm.
FIGS. 47A, 47B and 47C show perspective, cross-sectional and enlarged cross-sectional view of semiconductor device 400 at a later stage of manufacture. In the example shown in FIGS. 47A and 47B, photosensitive film 117 can be laminated on the top sides of electronic components 120 and 430 and encapsulant 115 and then patterned. Photosensitive film 117 can close openings 116 and 119 formed in encapsulant 115, but only opening 116 can be opened by a patterning process. In some examples, openings can be formed in photosensitive film 117 as the result of patterning. Accordingly, openings of photosensitive film 117 can be connected with openings 116 of encapsulant 115. Here, opening 119 can be still in a closed state.
FIGS. 48A, 48B and 48C show perspective, cross-sectional and enlarged cross-sectional view of semiconductor device 400 at a later stage of manufacture. In the example shown in FIGS. 48A and 48B, substrate interconnects 112 can be formed in openings 116 of encapsulant 115. In some examples, substrate interconnects 112 can be filled in openings 116 of encapsulant 115. In some examples, since opening 119 of substrate 110 is still closed by photosensitive film 117, no interconnect is formed in opening 119.
FIGS. 49A, 49B, 49C and 49D show perspective, cross-sectional, top plane and enlarged cross-sectional view of semiconductor device 400 at a later stage of manufacture. In the example shown in FIGS. 49A and 49B, photosensitive film 117 can be removed from the top sides of encapsulant 115 and/or electronic component 120. The top sides of substrate interconnects 112 can be substantially coplanar with the top sides of electronic component 120 and encapsulant 115. In some examples, the top sides of substrate interconnects 112 can be exposed through the top side of encapsulant 115. In addition, opening 119 and temporary bond layer 102 disposed at an interior side of opening 119 can be exposed through encapsulant 115.
Substrate 110 can include encapsulant 115, substrate interconnects 112 and opening 119, and can be configured such that electronic component 120 is embedded in encapsulant 115. In some examples, electronic component 120 can be embedded in substrate 110, and opening 119 can be formed in substrate 110, providing semiconductor device 400 having a reduced thickness and improved efficiency.
FIGS. 50A and 50B show perspective and cross-sectional view of semiconductor device 400 at a later stage of manufacture. In the example shown in FIGS. 50A and 50B, electronic component 430 can be attached to encapsulant 115 of substrate 110. In some examples, electronic component 430 can be provided over a region corresponding to (overlapping) opening 119 formed in encapsulant 115. In some examples, opening 119 of encapsulant 115 can be closed by electronic component 430. Accordingly, an external signal (e.g., pressure, sound, etc.) can be transmitted to electronic component 430 through opening 119 of substrate 110. In some examples, electronic component 430 can be adhered to encapsulant 115 of substrate 110 using an adhesive. In some examples, electronic component 430 can comprise a terminal 431 and a MEMS region (e.g., a diaphragm region) 432 that is exposed to opening 119. Electronic component 430 can comprise or be referred to as a MEMS, a semiconductor die or a semiconductor chip. Electronic component 430 can have a thickness in the range from approximately 150 μm to approximately 250 μm. Electronic component 430 can function as a microphone or a pressure sensor.
FIGS. 51A and 51B show perspective and cross-sectional view of semiconductor device 400 at a later stage of manufacture. In the example shown in FIGS. 51A and 51B, internal interconnect 180A can electrically connect electronic component 120 and substrate interconnects 112, internal interconnect 180B can electrically connect electronic component 430 and substrate interconnects 112, and internal interconnect 180C can electrically connect electronic component 120 and electronic component 430. In some examples, an active region of electronic component 120 can comprise processing circuitry for processing signals from the MEMS of electronic component 430. In some examples, internal interconnect 180A can allow electronic component 120 to be electrically connected to an external component, and internal interconnect 180B can allow electronic component 430 to be electrically connected to an external component.
FIGS. 52A and 52B show perspective and cross-sectional view of semiconductor device 400 at a later stage of manufacture. In the example shown in FIGS. 52A and 52B, cover structure 450 can be adhered to substrate 110. Cover structure 450 can cover electronic components 120 and 430 and can define compartment 451 surrounding internal interconnects 180A, 180B and 180C. Cover structure 450 can generally protect electronic components 120 and 430 and internal interconnects 180A, 180B and 180C from external elements and/or environmental exposure.
FIG. 53 shows cross-sectional view of semiconductor device 400 at a later stage of manufacture. In the example shown in FIG. 53, carrier 101 can be separated from conductive layer 103. In some examples, temporary bond layer 102 can be separated from conductive layer 103 while attached to carrier 101. Accordingly, conductive layer 103 can be exposed. In addition, in some examples, opening 119 can also be exposed.
FIG. 54 shows cross-sectional view of semiconductor device 400 at a later stage of manufacture. In the example shown in FIG. 54, conductive layer 103 can be removed. In some examples, conductive layer 103 can be removed by mechanical grinding and/or chemical etching. Bottom sides of electronic component 430, substrate interconnects 112 and encapsulant 115 can be exposed. In some examples, opening 119 positioned to correspond to electronic component 430 can be exposed through encapsulant 115.
FIG. 55 shows cross-sectional view of semiconductor device 400 at a later stage of manufacture. In the example shown in FIG. 55, external interconnects 160 can be provided on the bottom sides of substrate interconnects 112. In this way, opening 119 passing through substrate 110 and electronic component 120 embedded in substrate 110 can be positioned/exposed between external interconnects 160.
FIG. 56 shows cross-sectional view of semiconductor device 400 at a later stage of manufacture. In the example shown in FIG. 56, semiconductor device 400 can be singulated into discrete semiconductor devices. In some examples, semiconductor device 400 can be singulated into discrete semiconductor devices by a diamond blade or laser beam. Sidewalls of encapsulant 115 and cover structure 450 can be made substantially coplanar.
Semiconductor device 400 having reduced dimensions can be achieved by the manufacturing method described. In some examples, as the thickness and width of semiconductor device 400 can be reduced by such manufacturing method, semiconductor device 400 can be suitably applied to a wearable device.
The present disclosure includes reference to certain examples, however, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the disclosure. In addition, modifications may be made to the disclosed examples without departing from the scope of the present disclosure. Therefore, it is intended that the present disclosure not be limited to the examples disclosed, but that the disclosure will include all examples falling within the scope of the appended claims.

Claims (20)

The invention claimed is:
1. An electronic device comprising:
a first substrate comprising:
a first substrate top side;
a first substrate bottom side;
a first substrate sidewall;
a first encapsulant comprising:
a first encapsulant bottom side, wherein the first encapsulant bottom side provides a first portion of the first substrate bottom side; and
a first encapsulant top side, wherein the first encapsulant top side provides a first portion of the first substrate top side;
a first conductive pillar through the first encapsulant from the first encapsulant bottom side to the first encapsulant top side, wherein the first conductive pillar comprises a conductive upper portion and a conductive lower portion that are coated and surrounded by the first encapsulant; and
a first electronic component comprising:
a first component top side, wherein the first component top side provides a second portion of the first substrate top side;
a first component bottom side, wherein the first component bottom side provides a second portion of the first substrate bottom side; and
a first component sidewall coated by the first encapsulant;
a second electronic component on the first substrate and comprising:
a second component top side comprising a second component terminal and a second active region;
a second component bottom side coupled to the first substrate top side; and
a second component sidewall;
a first internal interconnect coupling the second component terminal to the first conductive pillar;
a cover structure on the first substrate and covering the second component sidewall and the first internal interconnect; and
a cap comprising a planar bottom side attached to the second component top side via an adhesive;
wherein the adhesive has a thickness that positions the planar bottom side of the cap above the second component top side and forms a gap between the second active region and the planar bottom side of the cap equal to the thickness of the adhesive; and
wherein the cover structure comprises a second encapsulant that coats the second component sidewall and a sidewall of the cap.
2. The electronic device of claim 1, wherein:
the second encapsulant coats the first substrate top side, the first component top side, and the first internal interconnect; and
a top side of the cap is exposed from the second encapsulant.
3. The electronic device of claim 1, wherein:
the first encapsulant comprises a first molding layer; and
the cover structure comprises a second molding layer that coats the first molding layer and the second component sidewall.
4. The electronic device of claim 1, comprising:
a second internal interconnect;
wherein:
the first substrate comprises a second conductive pillar extending from the first substrate bottom side to the first substrate top side and coated by the first encapsulant;
the second active region comprises a Micro-Electro-Mechanical-System (MEMS);
the first component top side comprises a first component terminal and processing circuitry for processing signals from the MEMS;
the second electronic component overlaps the first electronic component but leaves the first component terminal exposed; and
the second internal interconnect couples the first component terminal to the second conductive pillar.
5. The electronic device of claim 1, wherein the first component bottom side comprises a first active region exposed from the first encapsulant at the first substrate bottom side and facing away from the second active region.
6. The electronic device of claim 5, comprising:
a second substrate comprising:
a second substrate top side coupled to the first substrate bottom side; and
a second substrate bottom side;
and
an external interconnect coupled to the second substrate bottom side.
7. The electronic device of claim 6, wherein the second substrate is an RDL substrate conformal to the first substrate bottom side.
8. The electronic device of claim 1, further comprising:
a first adhesive between the first electronic component and the second electronic component;
wherein:
a top side of the first adhesive is exposed from the first encapsulant; and
the first encapsulant coats a portion of a bottom side of the first adhesive.
9. An electronic device comprising:
a first substrate comprising:
a first substrate top side;
a first substrate bottom side;
a first substrate sidewall;
a first encapsulant comprising:
a first encapsulant bottom side, wherein the first encapsulant bottom side provides a first portion of the first substrate bottom side; and
a first encapsulant top side, wherein the first encapsulant top side provides a first portion of the first substrate top side;
a first conductive pillar through the first encapsulant from the first encapsulant bottom side to the first encapsulant top side, wherein the first conductive pillar comprises a conductive upper portion and a conductive lower portion that are coated and surrounded by the first encapsulant; and
a first electronic component comprising:
a first component top side, wherein the first component top side provides a second portion of the first substrate top side;
a first component bottom side, wherein the first component bottom side provides a second portion of the first substrate bottom side; and
a first component sidewall coated by the first encapsulant;
a second electronic component on the first substrate and comprising:
a second component top side comprising a second component terminal and a second active region;
a second component bottom side coupled to the first substrate top side; and
a second component sidewall;
a first internal interconnect coupling the second component terminal to the first conductive pillar; and
a cover structure on the first substrate and covering the second component sidewall and the first internal interconnect; and
a second internal interconnect;
wherein:
the first substrate comprises an opening through the first encapsulant, from the first substrate top side to the first substrate bottom side;
the second active region of the second electronic component comprises a Micro-Electro-Mechanical-System (MEMS);
the first component top side comprises processing circuitry for processing signals from the MEMS;
the second electronic component is located over the opening of the first substrate, with the MEMS exposed to the opening;
the cover structure comprises a cover structure internal surface that defines a compartment containing the second electronic component;
the cover structure internal surface does not contact the second electronic component; and
the second internal interconnect couples the second electronic component to the first electronic component.
10. The electronic device of claim 1, comprising:
an adhesive between the second component bottom side and the first component top side;
wherein:
a bottom side of the adhesive contacts the first component top side;
the cover structure comprises a second encapsulant; and
the second encapsulant coats the second component sidewall, the first substrate top side, and a portion of a top side of the adhesive that extends beyond a footprint of the second electronic component.
11. An electronic device comprising:
a first substrate comprising:
a first substrate top side;
a first substrate bottom side;
a first substrate sidewall;
a first encapsulant comprising:
a first encapsulant bottom side, wherein the first encapsulant bottom side provides a first portion of the first substrate bottom side; and
a first encapsulant top side, wherein the first encapsulant top side provide a first portion of the first substrate top side;
a first conductive pillar through the first encapsulant from the first encapsulant bottom side to the first encapsulant top side, wherein the first conductive pillar is coated and surrounded by the first encapsulant;
a second conductive pillar through the first encapsulant from the first encapsulant bottom side to the first encapsulant top side, wherein the second conductive pillar is coated and surrounded by the first encapsulant;
a first electronic component comprising:
a first component top side, wherein the first component top side provides a second portion of the first substrate top side, and wherein the first component top side comprises a first component terminal and a first active region;
a first component bottom side, wherein the first component bottom side provides a second portion of the first substrate bottom side; and
a first component sidewall coated by the first encapsulant; and
a second electronic component comprising:
a second component top side exposed from the first encapsulant and comprising a second component terminal and a second active region;
a second component bottom side; and
a second component sidewall coated by the first encapsulant;
a first bonding wire coupling the first component terminal to the first conductive pillar;
a second bonding wire coupling the second component terminal to the second conductive pillar; and
a cover structure on the first substrate,
wherein:
the cover structure comprises a divisor wall that divides a first compartment from a second compartment over the first substrate;
the first compartment is over the first electronic component and comprises a first aperture through a top side of the cover structure; and
the second compartment is over the second electronic component and comprises a second aperture through the top side of the cover structure.
12. The electronic device of claim 11, wherein:
the first active region of the first electronic component comprises a radiation emitter configured to emit radiation pulses; and
the second active region of the second electronic component comprises a reflection sensor configured to detect reflections of the radiation pulses.
13. The electronic device of claim 11, comprising:
a first protective layer over the first electronic component;
a second protective layer over the second electronic component;
wherein:
the cover structure comprises a divisor wall between the first protective layer and the second protective layer;
the first protective layer and the second protective layer are translucent; and
the divisor wall is opaque.
14. The electronic device of claim 1, wherein a top end of the first conductive pillar is coplanar with the first encapsulant top side.
15. The electronic device of claim 9, wherein a top end of the first conductive pillar is coplanar with the first encapsulant top side.
16. The electronic device of claim 11, wherein a top end of the first conductive pillar is coplanar with the first encapsulant top side.
17. The electronic device of claim 9, wherein the cover structure is adhered to the first substrate.
18. The electronic device of claim 9, wherein the MEM comprises a microphone.
19. The electronic device of claim 9, wherein the MEM comprises a pressure sensor.
20. The electronic device of claim 6, wherein:
the second substrate comprises a second substrate dielectric structure and a second substrate conductive structure;
the second substrate conductive structure comprises:
a first conductor exposed from the second substrate dielectric structure at the second substrate top side; and
a second conductor exposed from the second substrate dielectric structure at the second substrate top side;
the first component bottom side comprises a first component terminal exposed from the first encapsulant of the first substrate at the first substrate bottom side;
the first component terminal is coupled to the first conductor of the second substrate; and
the first conductive pillar is coupled to the second conductor of the second substrate.
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