JP2017504215A - セルフアライン式プリフォームレンズを有する発光デバイス - Google Patents
セルフアライン式プリフォームレンズを有する発光デバイス Download PDFInfo
- Publication number
- JP2017504215A JP2017504215A JP2016547552A JP2016547552A JP2017504215A JP 2017504215 A JP2017504215 A JP 2017504215A JP 2016547552 A JP2016547552 A JP 2016547552A JP 2016547552 A JP2016547552 A JP 2016547552A JP 2017504215 A JP2017504215 A JP 2017504215A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- cavity
- lens structure
- lens
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0075—Arrays characterized by non-optical structures, e.g. having integrated holding or alignment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/007—Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
- G02B19/0066—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED in the form of an LED array
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461930586P | 2014-01-23 | 2014-01-23 | |
| US61/930,586 | 2014-01-23 | ||
| PCT/IB2015/050050 WO2015110927A1 (en) | 2014-01-23 | 2015-01-04 | Light emitting device with self-aligning preformed lens |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020164629A Division JP2021002682A (ja) | 2014-01-23 | 2020-09-30 | セルフアライン式プリフォームレンズを有する発光デバイス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017504215A true JP2017504215A (ja) | 2017-02-02 |
| JP2017504215A5 JP2017504215A5 (enExample) | 2018-02-15 |
Family
ID=52396775
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016547552A Pending JP2017504215A (ja) | 2014-01-23 | 2015-01-04 | セルフアライン式プリフォームレンズを有する発光デバイス |
| JP2020164629A Pending JP2021002682A (ja) | 2014-01-23 | 2020-09-30 | セルフアライン式プリフォームレンズを有する発光デバイス |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020164629A Pending JP2021002682A (ja) | 2014-01-23 | 2020-09-30 | セルフアライン式プリフォームレンズを有する発光デバイス |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US10416356B2 (enExample) |
| EP (1) | EP3097351A1 (enExample) |
| JP (2) | JP2017504215A (enExample) |
| KR (1) | KR102217791B1 (enExample) |
| CN (2) | CN111063787A (enExample) |
| WO (1) | WO2015110927A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10895669B2 (en) | 2014-01-23 | 2021-01-19 | Lumileds Llc | Light emitting device with self-aligning preformed lens |
| JP2022088580A (ja) * | 2017-09-26 | 2022-06-14 | オスラム オーエルイーディー ゲゼルシャフト ミット ベシュレンクテル ハフツング | 放射放出半導体デバイス |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6645781B2 (ja) * | 2015-09-11 | 2020-02-14 | アルパッド株式会社 | 半導体発光装置 |
| US10340173B2 (en) * | 2016-10-11 | 2019-07-02 | Micron Technology, Inc. | System for handling semiconductor dies |
| KR20190120715A (ko) * | 2018-04-16 | 2019-10-24 | 리지텍 일렉트로닉스 컴퍼니 리미티드 | 구조화된 광 투사 시스템 |
| EP3832199A1 (en) * | 2019-12-06 | 2021-06-09 | Marelli Automotive Lighting Italy S.p.A. | Automotive lighting and/or signaling device and related assembly method |
| US20230273391A1 (en) * | 2020-07-14 | 2023-08-31 | Nlight, Inc. | Opto-mechanical mounting for optical components |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06104491A (ja) * | 1992-09-17 | 1994-04-15 | Rohm Co Ltd | 発光ダイオードランプ |
| JPH11204841A (ja) * | 1998-01-13 | 1999-07-30 | Nichia Chem Ind Ltd | 光半導体素子とその製造方法 |
| JP2000269555A (ja) * | 1999-03-15 | 2000-09-29 | Citizen Electronics Co Ltd | 表面実装型発光ダイオード及びその製造方法 |
| JP2005057266A (ja) * | 2003-07-31 | 2005-03-03 | Lumileds Lighting Us Llc | 光取り出し効率が改善された発光装置 |
| JP2005101393A (ja) * | 2003-09-26 | 2005-04-14 | Stanley Electric Co Ltd | Ledランプ |
| JP2007059618A (ja) * | 2005-08-24 | 2007-03-08 | Matsushita Electric Works Ltd | Led照明器具 |
| US20110110097A1 (en) * | 2009-11-09 | 2011-05-12 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Led unit |
| JP2011138815A (ja) * | 2009-12-25 | 2011-07-14 | Nichia Corp | 発光装置 |
| JP2011137896A (ja) * | 2009-12-26 | 2011-07-14 | Asahi Rubber Inc | レンズアレイシート及びそれのダイシング方法 |
| JP2011521480A (ja) * | 2008-05-29 | 2011-07-21 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 半導体装置 |
| EP2393135A1 (en) * | 2010-06-07 | 2011-12-07 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device and method for manufacturing the same |
| US20120305971A1 (en) * | 2011-05-31 | 2012-12-06 | Samsung Electronics Co., Ltd. | Light emitting device lens, light emitting device module including light emitting device lens and method for manufacturing light emitting device module using light emitting device lens |
| JP2012533904A (ja) * | 2009-07-22 | 2012-12-27 | フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー | 角度に対する色変化が低減されたled |
| US20130039050A1 (en) * | 2011-08-08 | 2013-02-14 | Quarkstar, Llc | Solid-State Luminaire |
| WO2013084155A1 (en) * | 2011-12-08 | 2013-06-13 | Koninklijke Philips Electronics N.V. | Forming thick metal layers on a semiconductor light emitting device |
Family Cites Families (52)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NO143045B (no) | 1975-05-16 | Kolbjoern Bjoershol | Apparat for kroksetting av en fiskeline. | |
| JPS5860954A (ja) * | 1981-10-07 | 1983-04-11 | Asahimatsu Shokuhin Kk | 大豆タンパク凍結変性物のゲル状食品製造法 |
| JPS5860954U (ja) * | 1981-10-19 | 1983-04-25 | 株式会社リコー | 発光素子取付構造 |
| JPH0561790U (ja) * | 1992-01-21 | 1993-08-13 | セイコーエプソン株式会社 | 操作パネル |
| US6521916B2 (en) * | 1999-03-15 | 2003-02-18 | Gentex Corporation | Radiation emitter device having an encapsulant with different zones of thermal conductivity |
| US6547423B2 (en) * | 2000-12-22 | 2003-04-15 | Koninklijke Phillips Electronics N.V. | LED collimation optics with improved performance and reduced size |
| US6607286B2 (en) * | 2001-05-04 | 2003-08-19 | Lumileds Lighting, U.S., Llc | Lens and lens cap with sawtooth portion for light emitting diode |
| US6598998B2 (en) * | 2001-05-04 | 2003-07-29 | Lumileds Lighting, U.S., Llc | Side emitting light emitting device |
| JP3948650B2 (ja) | 2001-10-09 | 2007-07-25 | アバゴ・テクノロジーズ・イーシービーユー・アイピー(シンガポール)プライベート・リミテッド | 発光ダイオード及びその製造方法 |
| ITMI20012579A1 (it) * | 2001-12-06 | 2003-06-06 | Fraen Corp Srl | Modulo illuminante ad elevata dissipazione di calore |
| US6896381B2 (en) * | 2002-10-11 | 2005-05-24 | Light Prescriptions Innovators, Llc | Compact folded-optics illumination lens |
| US7465961B2 (en) * | 2003-03-25 | 2008-12-16 | Sharp Kabushiki Kaisha | Electronic equipment, backlight structure and keypad for electronic equipment |
| JP4534074B2 (ja) * | 2003-11-27 | 2010-09-01 | 青木電器工業株式会社 | 高輝度led発光部 |
| CN1934721A (zh) * | 2004-03-24 | 2007-03-21 | 东芝照明技术株式会社 | 发光装置和照明装置 |
| US7456499B2 (en) * | 2004-06-04 | 2008-11-25 | Cree, Inc. | Power light emitting die package with reflecting lens and the method of making the same |
| JP5128047B2 (ja) | 2004-10-07 | 2013-01-23 | Towa株式会社 | 光デバイス及び光デバイスの生産方法 |
| US7452737B2 (en) | 2004-11-15 | 2008-11-18 | Philips Lumileds Lighting Company, Llc | Molded lens over LED die |
| US7858408B2 (en) * | 2004-11-15 | 2010-12-28 | Koninklijke Philips Electronics N.V. | LED with phosphor tile and overmolded phosphor in lens |
| KR100649640B1 (ko) * | 2005-02-03 | 2006-11-27 | 삼성전기주식회사 | 측면 방출형 발광다이오드 패키지 |
| TW200825529A (en) * | 2006-12-06 | 2008-06-16 | Chi Lin Technology Co Ltd | Light mixer and backlight module having it |
| KR20090115803A (ko) * | 2007-02-13 | 2009-11-06 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 렌즈를 갖는 led 소자 및 그 제조 방법 |
| US7993034B2 (en) * | 2007-09-21 | 2011-08-09 | Cooper Technologies Company | Reflector having inflection point and LED fixture including such reflector |
| CN100538160C (zh) * | 2007-12-10 | 2009-09-09 | 王敏 | Led小角度远距离送光镜组及阵列 |
| CN101235953A (zh) * | 2008-03-04 | 2008-08-06 | 友达光电股份有限公司 | 透镜结构与发光单元 |
| WO2009109974A2 (en) * | 2008-03-05 | 2009-09-11 | Oree, Advanced Illumination Solutions Inc. | Illumination apparatus and methods of forming the same |
| JP5279329B2 (ja) * | 2008-04-24 | 2013-09-04 | パナソニック株式会社 | レンズ付発光ユニット |
| JP5512515B2 (ja) | 2008-05-30 | 2014-06-04 | シャープ株式会社 | 発光装置、面光源および液晶表示装置 |
| US7874703B2 (en) * | 2008-08-28 | 2011-01-25 | Dialight Corporation | Total internal reflection lens with base |
| JP2010170734A (ja) * | 2009-01-20 | 2010-08-05 | Panasonic Electric Works Co Ltd | Led照明装置 |
| CN101936501B (zh) * | 2009-06-30 | 2013-04-24 | 富准精密工业(深圳)有限公司 | 发光二极管模组 |
| US9385285B2 (en) | 2009-09-17 | 2016-07-05 | Koninklijke Philips N.V. | LED module with high index lens |
| CN102062347A (zh) * | 2009-11-12 | 2011-05-18 | 富准精密工业(深圳)有限公司 | 发光二极管模组及其透镜 |
| JP5412253B2 (ja) | 2009-11-25 | 2014-02-12 | パナソニック株式会社 | 発光装置 |
| WO2011076214A1 (en) * | 2009-12-21 | 2011-06-30 | Martin Professional A/S | Light collector with extended center lens |
| WO2012055046A1 (en) * | 2010-10-27 | 2012-05-03 | Dbm Reflex Enterprises Inc. | Lens array assembly for solid state light sources and method |
| KR20120050179A (ko) * | 2010-11-10 | 2012-05-18 | 삼성엘이디 주식회사 | 플래시 렌즈 및 이를 채용한 플래시 모듈 |
| US8597988B2 (en) * | 2010-11-18 | 2013-12-03 | Bridgelux, Inc. | System for flash-free overmolding of led array substrates |
| TW201233940A (en) * | 2010-11-30 | 2012-08-16 | Wintek Corp | Light source for crystal lamp |
| WO2012147342A1 (ja) * | 2011-04-28 | 2012-11-01 | 株式会社朝日ラバー | レンズ付き光半導体装置、及びその製造方法 |
| US8497519B2 (en) * | 2011-05-24 | 2013-07-30 | Tsmc Solid State Lighting Ltd. | Batwing LED with remote phosphor configuration |
| CN103187504A (zh) * | 2011-12-27 | 2013-07-03 | 展晶科技(深圳)有限公司 | 发光二极管封装结构 |
| CN103196040B (zh) | 2012-01-06 | 2015-03-11 | 扬升照明股份有限公司 | 透镜结构、光源装置以及光源模块 |
| JP6309898B2 (ja) * | 2012-01-16 | 2018-04-11 | ダウ シリコーンズ コーポレーション | 光学物品及び形成方法 |
| KR101386710B1 (ko) | 2012-04-05 | 2014-04-18 | 건국대학교 산학협력단 | 비환식 석시노글리칸의 용도 |
| US9349929B2 (en) * | 2012-05-31 | 2016-05-24 | Cree, Inc. | Light emitter packages, systems, and methods |
| TW201431127A (zh) * | 2013-01-29 | 2014-08-01 | Hon Hai Prec Ind Co Ltd | 發光二極體封裝結構及其製造方法 |
| US9318674B2 (en) * | 2013-02-05 | 2016-04-19 | Cree, Inc. | Submount-free light emitting diode (LED) components and methods of fabricating same |
| KR20150000676A (ko) * | 2013-06-25 | 2015-01-05 | 삼성전자주식회사 | 반도체 발광소자 패키지 제조방법 |
| CN111063787A (zh) | 2014-01-23 | 2020-04-24 | 亮锐控股有限公司 | 具有自对准预制透镜的发光设备 |
| US10297731B2 (en) * | 2014-11-26 | 2019-05-21 | Bridgelux, Inc. | Light emitting diode constructions and methods for making the same |
| US10591134B2 (en) * | 2016-01-19 | 2020-03-17 | Lutron Ketra, Llc | Lens for improved color mixing and beam control of an LED light source |
| JP6104491B1 (ja) | 2017-01-20 | 2017-03-29 | 三菱日立パワーシステムズ株式会社 | 船舶用脱硫装置および該船舶用脱硫装置を搭載した船舶 |
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2015
- 2015-01-04 CN CN201911355103.9A patent/CN111063787A/zh active Pending
- 2015-01-04 CN CN201580005512.XA patent/CN105940262B/zh active Active
- 2015-01-04 KR KR1020167023018A patent/KR102217791B1/ko active Active
- 2015-01-04 WO PCT/IB2015/050050 patent/WO2015110927A1/en not_active Ceased
- 2015-01-04 EP EP15701247.7A patent/EP3097351A1/en not_active Withdrawn
- 2015-01-04 JP JP2016547552A patent/JP2017504215A/ja active Pending
- 2015-01-04 US US15/110,840 patent/US10416356B2/en active Active
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2019
- 2019-09-16 US US16/572,074 patent/US10895669B2/en active Active
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2020
- 2020-09-30 JP JP2020164629A patent/JP2021002682A/ja active Pending
-
2021
- 2021-01-14 US US17/149,129 patent/US11313996B2/en active Active
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06104491A (ja) * | 1992-09-17 | 1994-04-15 | Rohm Co Ltd | 発光ダイオードランプ |
| JPH11204841A (ja) * | 1998-01-13 | 1999-07-30 | Nichia Chem Ind Ltd | 光半導体素子とその製造方法 |
| JP2000269555A (ja) * | 1999-03-15 | 2000-09-29 | Citizen Electronics Co Ltd | 表面実装型発光ダイオード及びその製造方法 |
| JP2005057266A (ja) * | 2003-07-31 | 2005-03-03 | Lumileds Lighting Us Llc | 光取り出し効率が改善された発光装置 |
| JP2005101393A (ja) * | 2003-09-26 | 2005-04-14 | Stanley Electric Co Ltd | Ledランプ |
| JP2007059618A (ja) * | 2005-08-24 | 2007-03-08 | Matsushita Electric Works Ltd | Led照明器具 |
| JP2011521480A (ja) * | 2008-05-29 | 2011-07-21 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 半導体装置 |
| JP2012533904A (ja) * | 2009-07-22 | 2012-12-27 | フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー | 角度に対する色変化が低減されたled |
| US20110110097A1 (en) * | 2009-11-09 | 2011-05-12 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Led unit |
| JP2011138815A (ja) * | 2009-12-25 | 2011-07-14 | Nichia Corp | 発光装置 |
| JP2011137896A (ja) * | 2009-12-26 | 2011-07-14 | Asahi Rubber Inc | レンズアレイシート及びそれのダイシング方法 |
| EP2393135A1 (en) * | 2010-06-07 | 2011-12-07 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device and method for manufacturing the same |
| US20120305971A1 (en) * | 2011-05-31 | 2012-12-06 | Samsung Electronics Co., Ltd. | Light emitting device lens, light emitting device module including light emitting device lens and method for manufacturing light emitting device module using light emitting device lens |
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| US11313996B2 (en) | 2014-01-23 | 2022-04-26 | Lumileds Llc | Light emitting device with self-aligning preformed lens |
| JP2022088580A (ja) * | 2017-09-26 | 2022-06-14 | オスラム オーエルイーディー ゲゼルシャフト ミット ベシュレンクテル ハフツング | 放射放出半導体デバイス |
| JP7318048B2 (ja) | 2017-09-26 | 2023-07-31 | オスラム オーエルイーディー ゲゼルシャフト ミット ベシュレンクテル ハフツング | 放射放出半導体デバイス |
| US11848406B2 (en) | 2017-09-26 | 2023-12-19 | Osram Oled Gmbh | Radiation-emitting semiconductor component and method for producing radiation-emitting semiconductor component |
| US12142712B2 (en) | 2017-09-26 | 2024-11-12 | Osram Oled Gmbh | Radiation-emitting semiconductor component and method for producing radiation-emitting semiconductor component |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105940262A (zh) | 2016-09-14 |
| US20200116902A1 (en) | 2020-04-16 |
| CN105940262B (zh) | 2020-01-07 |
| US11313996B2 (en) | 2022-04-26 |
| US10416356B2 (en) | 2019-09-17 |
| US10895669B2 (en) | 2021-01-19 |
| JP2021002682A (ja) | 2021-01-07 |
| US20160341852A1 (en) | 2016-11-24 |
| EP3097351A1 (en) | 2016-11-30 |
| US20210132263A1 (en) | 2021-05-06 |
| KR20160113198A (ko) | 2016-09-28 |
| WO2015110927A1 (en) | 2015-07-30 |
| CN111063787A (zh) | 2020-04-24 |
| KR102217791B1 (ko) | 2021-02-22 |
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