CN105940262B - 具有自对准预制透镜的发光设备 - Google Patents

具有自对准预制透镜的发光设备 Download PDF

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Publication number
CN105940262B
CN105940262B CN201580005512.XA CN201580005512A CN105940262B CN 105940262 B CN105940262 B CN 105940262B CN 201580005512 A CN201580005512 A CN 201580005512A CN 105940262 B CN105940262 B CN 105940262B
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CN
China
Prior art keywords
light emitting
cavity
lens
emitting device
cross
Prior art date
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CN201580005512.XA
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English (en)
Chinese (zh)
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CN105940262A (zh
Inventor
W.戴施纳
M.富斯曼
M.马拉
A.S.哈克
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lumileds Holding BV
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Koninklijke Philips NV
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Priority to CN201911355103.9A priority Critical patent/CN111063787A/zh
Publication of CN105940262A publication Critical patent/CN105940262A/zh
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00Simple or compound lenses
    • G02B3/0006Arrays
    • G02B3/0075Arrays characterized by non-optical structures, e.g. having integrated holding or alignment means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015Fastening arrangements intended to retain light sources
    • F21V19/002Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00Refractors for light sources
    • F21V5/007Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G02B19/0061Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G02B19/0061Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
    • G02B19/0066Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED in the form of an LED array
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00Simple or compound lenses
    • G02B3/0006Arrays
    • G02B3/0037Arrays characterized by the distribution or form of lenses
    • G02B3/0056Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0363Manufacture or treatment of packages of optical field-shaping means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • H10H20/856Reflecting means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/857Interconnections, e.g. lead-frames, bond wires or solder balls

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
CN201580005512.XA 2014-01-23 2015-01-04 具有自对准预制透镜的发光设备 Active CN105940262B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911355103.9A CN111063787A (zh) 2014-01-23 2015-01-04 具有自对准预制透镜的发光设备

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461930586P 2014-01-23 2014-01-23
US61/930586 2014-01-23
PCT/IB2015/050050 WO2015110927A1 (en) 2014-01-23 2015-01-04 Light emitting device with self-aligning preformed lens

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201911355103.9A Division CN111063787A (zh) 2014-01-23 2015-01-04 具有自对准预制透镜的发光设备

Publications (2)

Publication Number Publication Date
CN105940262A CN105940262A (zh) 2016-09-14
CN105940262B true CN105940262B (zh) 2020-01-07

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CN201911355103.9A Pending CN111063787A (zh) 2014-01-23 2015-01-04 具有自对准预制透镜的发光设备

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US (3) US10416356B2 (enExample)
EP (1) EP3097351A1 (enExample)
JP (2) JP2017504215A (enExample)
KR (1) KR102217791B1 (enExample)
CN (2) CN105940262B (enExample)
WO (1) WO2015110927A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015110927A1 (en) 2014-01-23 2015-07-30 Koninklijke Philips N.V. Light emitting device with self-aligning preformed lens
JP6645781B2 (ja) * 2015-09-11 2020-02-14 アルパッド株式会社 半導体発光装置
US10340173B2 (en) * 2016-10-11 2019-07-02 Micron Technology, Inc. System for handling semiconductor dies
DE102017122325A1 (de) * 2017-09-26 2019-03-28 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement und Verfahren zur Herstellung von strahlungsemittierenden Halbleiterbauelementen
KR20190120715A (ko) * 2018-04-16 2019-10-24 리지텍 일렉트로닉스 컴퍼니 리미티드 구조화된 광 투사 시스템
EP3832199A1 (en) * 2019-12-06 2021-06-09 Marelli Automotive Lighting Italy S.p.A. Automotive lighting and/or signaling device and related assembly method
US20230273391A1 (en) * 2020-07-14 2023-08-31 Nlight, Inc. Opto-mechanical mounting for optical components

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6896381B2 (en) * 2002-10-11 2005-05-24 Light Prescriptions Innovators, Llc Compact folded-optics illumination lens
CN101235953A (zh) * 2008-03-04 2008-08-06 友达光电股份有限公司 透镜结构与发光单元
US7465961B2 (en) * 2003-03-25 2008-12-16 Sharp Kabushiki Kaisha Electronic equipment, backlight structure and keypad for electronic equipment
CN102537720A (zh) * 2010-11-30 2012-07-04 胜华科技股份有限公司 水晶灯灯源
CN103196040A (zh) * 2012-01-06 2013-07-10 扬升照明股份有限公司 透镜结构、光源装置以及光源模块

Family Cites Families (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NO143045B (no) 1975-05-16 Kolbjoern Bjoershol Apparat for kroksetting av en fiskeline.
JPS5860954A (ja) * 1981-10-07 1983-04-11 Asahimatsu Shokuhin Kk 大豆タンパク凍結変性物のゲル状食品製造法
JPS5860954U (ja) * 1981-10-19 1983-04-25 株式会社リコー 発光素子取付構造
JPH0561790U (ja) * 1992-01-21 1993-08-13 セイコーエプソン株式会社 操作パネル
JPH06104491A (ja) * 1992-09-17 1994-04-15 Rohm Co Ltd 発光ダイオードランプ
JPH11204841A (ja) 1998-01-13 1999-07-30 Nichia Chem Ind Ltd 光半導体素子とその製造方法
JP3349111B2 (ja) * 1999-03-15 2002-11-20 株式会社シチズン電子 表面実装型発光ダイオード及びその製造方法
US6521916B2 (en) * 1999-03-15 2003-02-18 Gentex Corporation Radiation emitter device having an encapsulant with different zones of thermal conductivity
US6547423B2 (en) * 2000-12-22 2003-04-15 Koninklijke Phillips Electronics N.V. LED collimation optics with improved performance and reduced size
US6598998B2 (en) * 2001-05-04 2003-07-29 Lumileds Lighting, U.S., Llc Side emitting light emitting device
US6607286B2 (en) * 2001-05-04 2003-08-19 Lumileds Lighting, U.S., Llc Lens and lens cap with sawtooth portion for light emitting diode
JP3948650B2 (ja) 2001-10-09 2007-07-25 アバゴ・テクノロジーズ・イーシービーユー・アイピー(シンガポール)プライベート・リミテッド 発光ダイオード及びその製造方法
ITMI20012579A1 (it) * 2001-12-06 2003-06-06 Fraen Corp Srl Modulo illuminante ad elevata dissipazione di calore
US7009213B2 (en) 2003-07-31 2006-03-07 Lumileds Lighting U.S., Llc Light emitting devices with improved light extraction efficiency
JP4444609B2 (ja) 2003-09-26 2010-03-31 スタンレー電気株式会社 Ledランプ及び製造方法
JP4534074B2 (ja) * 2003-11-27 2010-09-01 青木電器工業株式会社 高輝度led発光部
CN1934721A (zh) * 2004-03-24 2007-03-21 东芝照明技术株式会社 发光装置和照明装置
US7456499B2 (en) * 2004-06-04 2008-11-25 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same
JP5128047B2 (ja) * 2004-10-07 2013-01-23 Towa株式会社 光デバイス及び光デバイスの生産方法
US7858408B2 (en) * 2004-11-15 2010-12-28 Koninklijke Philips Electronics N.V. LED with phosphor tile and overmolded phosphor in lens
US7452737B2 (en) 2004-11-15 2008-11-18 Philips Lumileds Lighting Company, Llc Molded lens over LED die
KR100649640B1 (ko) * 2005-02-03 2006-11-27 삼성전기주식회사 측면 방출형 발광다이오드 패키지
JP4696780B2 (ja) * 2005-08-24 2011-06-08 パナソニック電工株式会社 Led照明器具
TW200825529A (en) * 2006-12-06 2008-06-16 Chi Lin Technology Co Ltd Light mixer and backlight module having it
EP2111651A4 (en) * 2007-02-13 2011-08-17 3M Innovative Properties Co LED WITH LENS AND METHOD FOR THEIR MANUFACTURE
US20090080189A1 (en) * 2007-09-21 2009-03-26 Cooper Technologies Company Optic Coupler for Light Emitting Diode Fixture
CN100538160C (zh) * 2007-12-10 2009-09-09 王敏 Led小角度远距离送光镜组及阵列
US20090225566A1 (en) * 2008-03-05 2009-09-10 Micha Zimmermann Illumination apparatus and methods of forming the same
JP5279329B2 (ja) * 2008-04-24 2013-09-04 パナソニック株式会社 レンズ付発光ユニット
DE102008025756B4 (de) 2008-05-29 2023-02-23 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiteranordnung
BRPI0913195A2 (pt) 2008-05-30 2016-01-12 Sharp Kk dispostivo emissor de luz, fonte de luz de superfície, dispositivo de vídeo de cristal líquido e método para a fabricação de dispositivo emissor de luz
US7874703B2 (en) * 2008-08-28 2011-01-25 Dialight Corporation Total internal reflection lens with base
JP2010170734A (ja) * 2009-01-20 2010-08-05 Panasonic Electric Works Co Ltd Led照明装置
CN101936501B (zh) * 2009-06-30 2013-04-24 富准精密工业(深圳)有限公司 发光二极管模组
US8803171B2 (en) * 2009-07-22 2014-08-12 Koninklijke Philips N.V. Reduced color over angle variation LEDs
US9385285B2 (en) * 2009-09-17 2016-07-05 Koninklijke Philips N.V. LED module with high index lens
CN102052630A (zh) * 2009-11-09 2011-05-11 富准精密工业(深圳)有限公司 发光组件
CN102062347A (zh) * 2009-11-12 2011-05-18 富准精密工业(深圳)有限公司 发光二极管模组及其透镜
JP5412253B2 (ja) * 2009-11-25 2014-02-12 パナソニック株式会社 発光装置
EP2516920B1 (en) * 2009-12-21 2019-11-27 Harman Professional Denmark ApS Light collector with extended center lens
JP5701502B2 (ja) * 2009-12-25 2015-04-15 日亜化学工業株式会社 発光装置
JP5512262B2 (ja) * 2009-12-26 2014-06-04 株式会社朝日ラバー レンズアレイシート及びそれのダイシング方法
JP5449039B2 (ja) 2010-06-07 2014-03-19 株式会社東芝 半導体発光装置及びその製造方法
WO2012055046A1 (en) * 2010-10-27 2012-05-03 Dbm Reflex Enterprises Inc. Lens array assembly for solid state light sources and method
KR20120050179A (ko) * 2010-11-10 2012-05-18 삼성엘이디 주식회사 플래시 렌즈 및 이를 채용한 플래시 모듈
US8597988B2 (en) * 2010-11-18 2013-12-03 Bridgelux, Inc. System for flash-free overmolding of led array substrates
CN103477457A (zh) * 2011-04-28 2013-12-25 株式会社朝日橡胶 带透镜的光半导体装置及其制造方法
US8497519B2 (en) * 2011-05-24 2013-07-30 Tsmc Solid State Lighting Ltd. Batwing LED with remote phosphor configuration
KR20120133264A (ko) 2011-05-31 2012-12-10 삼성전자주식회사 발광소자 렌즈, 이를 포함하는 발광소자 모듈 및 이를 이용한 발광소자 모듈의 제조방법
US8573823B2 (en) * 2011-08-08 2013-11-05 Quarkstar Llc Solid-state luminaire
WO2013084155A1 (en) 2011-12-08 2013-06-13 Koninklijke Philips Electronics N.V. Forming thick metal layers on a semiconductor light emitting device
CN103187504A (zh) * 2011-12-27 2013-07-03 展晶科技(深圳)有限公司 发光二极管封装结构
WO2013109607A1 (en) * 2012-01-16 2013-07-25 Dow Corning Corporation Optical article and method of forming
KR101386710B1 (ko) 2012-04-05 2014-04-18 건국대학교 산학협력단 비환식 석시노글리칸의 용도
US9349929B2 (en) * 2012-05-31 2016-05-24 Cree, Inc. Light emitter packages, systems, and methods
TW201431127A (zh) * 2013-01-29 2014-08-01 Hon Hai Prec Ind Co Ltd 發光二極體封裝結構及其製造方法
US9318674B2 (en) * 2013-02-05 2016-04-19 Cree, Inc. Submount-free light emitting diode (LED) components and methods of fabricating same
KR20150000676A (ko) * 2013-06-25 2015-01-05 삼성전자주식회사 반도체 발광소자 패키지 제조방법
WO2015110927A1 (en) 2014-01-23 2015-07-30 Koninklijke Philips N.V. Light emitting device with self-aligning preformed lens
US10297731B2 (en) * 2014-11-26 2019-05-21 Bridgelux, Inc. Light emitting diode constructions and methods for making the same
US10591134B2 (en) * 2016-01-19 2020-03-17 Lutron Ketra, Llc Lens for improved color mixing and beam control of an LED light source
JP6104491B1 (ja) 2017-01-20 2017-03-29 三菱日立パワーシステムズ株式会社 船舶用脱硫装置および該船舶用脱硫装置を搭載した船舶

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6896381B2 (en) * 2002-10-11 2005-05-24 Light Prescriptions Innovators, Llc Compact folded-optics illumination lens
US7465961B2 (en) * 2003-03-25 2008-12-16 Sharp Kabushiki Kaisha Electronic equipment, backlight structure and keypad for electronic equipment
CN101235953A (zh) * 2008-03-04 2008-08-06 友达光电股份有限公司 透镜结构与发光单元
CN102537720A (zh) * 2010-11-30 2012-07-04 胜华科技股份有限公司 水晶灯灯源
CN103196040A (zh) * 2012-01-06 2013-07-10 扬升照明股份有限公司 透镜结构、光源装置以及光源模块

Also Published As

Publication number Publication date
KR20160113198A (ko) 2016-09-28
US11313996B2 (en) 2022-04-26
WO2015110927A1 (en) 2015-07-30
CN111063787A (zh) 2020-04-24
JP2021002682A (ja) 2021-01-07
US20200116902A1 (en) 2020-04-16
US10895669B2 (en) 2021-01-19
CN105940262A (zh) 2016-09-14
JP2017504215A (ja) 2017-02-02
US20160341852A1 (en) 2016-11-24
US20210132263A1 (en) 2021-05-06
KR102217791B1 (ko) 2021-02-22
US10416356B2 (en) 2019-09-17
EP3097351A1 (en) 2016-11-30

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