JP2017500742A5 - - Google Patents

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Publication number
JP2017500742A5
JP2017500742A5 JP2016539041A JP2016539041A JP2017500742A5 JP 2017500742 A5 JP2017500742 A5 JP 2017500742A5 JP 2016539041 A JP2016539041 A JP 2016539041A JP 2016539041 A JP2016539041 A JP 2016539041A JP 2017500742 A5 JP2017500742 A5 JP 2017500742A5
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JP
Japan
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medium
location
yoso
temperature
processed
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JP2016539041A
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English (en)
Japanese (ja)
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JP6195673B2 (ja
JP2017500742A (ja
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Priority claimed from ATA946/2013A external-priority patent/AT515147B1/de
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Publication of JP2017500742A5 publication Critical patent/JP2017500742A5/ja
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JP2016539041A 2013-12-09 2014-11-26 液体で物体を処理するための方法および装置 Active JP6195673B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ATA946/2013 2013-12-09
ATA946/2013A AT515147B1 (de) 2013-12-09 2013-12-09 Verfahren und Vorrichtung zum Behandeln von Gegenständen mit einer Flüssigkeit
PCT/AT2014/000209 WO2015085334A1 (de) 2013-12-09 2014-11-26 Verfahren und vorrichtung zum behandeln von gegenständen mit einer flüssigkeit

Publications (3)

Publication Number Publication Date
JP2017500742A JP2017500742A (ja) 2017-01-05
JP2017500742A5 true JP2017500742A5 (enExample) 2017-02-16
JP6195673B2 JP6195673B2 (ja) 2017-09-13

Family

ID=52394800

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016539041A Active JP6195673B2 (ja) 2013-12-09 2014-11-26 液体で物体を処理するための方法および装置

Country Status (5)

Country Link
US (1) US20160307770A1 (enExample)
EP (1) EP3080837B1 (enExample)
JP (1) JP6195673B2 (enExample)
AT (1) AT515147B1 (enExample)
WO (1) WO2015085334A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11581187B2 (en) * 2018-12-20 2023-02-14 Xia Tai Xin Semiconductor (Qing Dao) Ltd. Method of heating SOC film on wafer by electromagnetic wave generator and heating apparatus using the same
WO2021061836A1 (en) * 2019-09-23 2021-04-01 Baldwin Technology Company, Inc. System and method of sensing and processing multivariate printing process data
AT16977U3 (de) 2020-02-20 2021-03-15 4Tex Gmbh Verfahren zum Behandeln von Substraten mit Chemikalien
CN113878403B (zh) * 2021-10-13 2024-10-29 洛阳开远智能精机有限公司 一种在线工件检测系统及工件检测方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3707979A (en) * 1969-02-28 1973-01-02 Honeywell Inc Cooled temperature sensitive oscillator
US5478435A (en) * 1994-12-16 1995-12-26 National Semiconductor Corp. Point of use slurry dispensing system
TW346649B (en) * 1996-09-24 1998-12-01 Tokyo Electron Co Ltd Method for wet etching a film
JPH11283950A (ja) * 1998-03-30 1999-10-15 Ebara Corp 基板洗浄装置
KR100265286B1 (ko) * 1998-04-20 2000-10-02 윤종용 반도체장치 제조용 케미컬 순환공급장치 및 이의 구동방법
US5965813A (en) * 1998-07-23 1999-10-12 Industry Technology Research Institute Integrated flow sensor
JP2000265945A (ja) * 1998-11-10 2000-09-26 Uct Kk 薬液供給ポンプ、薬液供給装置、薬液供給システム、基板洗浄装置、薬液供給方法、及び基板洗浄方法
US6333275B1 (en) * 1999-10-01 2001-12-25 Novellus Systems, Inc. Etchant mixing system for edge bevel removal of copper from silicon wafers
US6376013B1 (en) * 1999-10-06 2002-04-23 Advanced Micro Devices, Inc. Multiple nozzles for dispensing resist
KR20010039993A (ko) * 1999-10-06 2001-05-15 오카무라 가네오 유량 및 유속 측정장치
DE60120339T2 (de) * 2001-01-05 2007-06-06 NGK Spark Plug Co., Ltd., Nagoya Gasdurchflussmessvorrichtung
WO2002089532A1 (en) * 2001-04-26 2002-11-07 Phifer Smith Corporation A method and apparatus for heating a gas-solvent solution
US20080044939A1 (en) * 2002-01-24 2008-02-21 Nassiopoulou Androula G Low power silicon thermal sensors and microfluidic devices based on the use of porous sealed air cavity technology or microchannel technology
US7300598B2 (en) * 2003-03-31 2007-11-27 Tokyo Electron Limited Substrate processing method and apparatus
KR100708037B1 (ko) * 2003-12-24 2007-04-16 마츠시타 덴끼 산교 가부시키가이샤 유체공급노즐, 기판처리장치 및 기판처리방법
TW200618108A (en) * 2004-09-07 2006-06-01 Phifer Smith Corp Copper processing using an ozone-solvent solution
JP4781834B2 (ja) * 2006-02-07 2011-09-28 大日本スクリーン製造株式会社 現像装置および現像方法
DE102009060931A1 (de) * 2009-12-23 2011-06-30 Gebr. Schmid GmbH & Co., 72250 Verfahren und Vorrichtung zur Behandlung von Siliziumsubstraten
US8932962B2 (en) * 2012-04-09 2015-01-13 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical dispensing system and method

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