JP2014082318A5 - - Google Patents
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- Publication number
- JP2014082318A5 JP2014082318A5 JP2012229139A JP2012229139A JP2014082318A5 JP 2014082318 A5 JP2014082318 A5 JP 2014082318A5 JP 2012229139 A JP2012229139 A JP 2012229139A JP 2012229139 A JP2012229139 A JP 2012229139A JP 2014082318 A5 JP2014082318 A5 JP 2014082318A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- processing apparatus
- heater
- base portion
- holding means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 62
- 239000007788 liquid Substances 0.000 claims description 14
- 230000020169 heat generation Effects 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 description 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012229139A JP6168273B2 (ja) | 2012-10-16 | 2012-10-16 | 基板処理装置および基板処理方法 |
| KR1020157012879A KR102132051B1 (ko) | 2012-10-16 | 2013-08-29 | 기판 처리 장치 |
| PCT/JP2013/073195 WO2014061353A1 (ja) | 2012-10-16 | 2013-08-29 | 基板処理装置 |
| US14/435,558 US20150258582A1 (en) | 2012-10-16 | 2013-08-29 | Substrate processing device |
| TW102132773A TWI508793B (zh) | 2012-10-16 | 2013-09-11 | Substrate processing device |
| US15/401,892 US10497581B2 (en) | 2012-10-16 | 2017-01-09 | Substrate processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012229139A JP6168273B2 (ja) | 2012-10-16 | 2012-10-16 | 基板処理装置および基板処理方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014082318A JP2014082318A (ja) | 2014-05-08 |
| JP2014082318A5 true JP2014082318A5 (enExample) | 2015-10-01 |
| JP6168273B2 JP6168273B2 (ja) | 2017-07-26 |
Family
ID=50487930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012229139A Active JP6168273B2 (ja) | 2012-10-16 | 2012-10-16 | 基板処理装置および基板処理方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US20150258582A1 (enExample) |
| JP (1) | JP6168273B2 (enExample) |
| KR (1) | KR102132051B1 (enExample) |
| TW (1) | TWI508793B (enExample) |
| WO (1) | WO2014061353A1 (enExample) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6271304B2 (ja) * | 2013-03-29 | 2018-01-31 | 芝浦メカトロニクス株式会社 | 基板処理装置及び基板処理方法 |
| KR102229786B1 (ko) * | 2014-05-26 | 2021-03-19 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
| KR101919122B1 (ko) * | 2014-08-12 | 2018-11-15 | 주식회사 제우스 | 공정 분리형 기판 처리장치 및 처리방법 |
| KR102343226B1 (ko) * | 2014-09-04 | 2021-12-23 | 삼성전자주식회사 | 스팟 히터 및 이를 이용한 웨이퍼 클리닝 장치 |
| JP6742708B2 (ja) * | 2015-09-29 | 2020-08-19 | 芝浦メカトロニクス株式会社 | 基板処理方法 |
| JP6586697B2 (ja) * | 2015-12-25 | 2019-10-09 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| JP6689719B2 (ja) * | 2016-09-23 | 2020-04-28 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置 |
| KR102408105B1 (ko) * | 2017-03-06 | 2022-06-14 | 에이씨엠 리서치 (상하이) 인코포레이티드 | 반도체 기판을 세정하기 위한 장치 |
| JP6945314B2 (ja) | 2017-03-24 | 2021-10-06 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置 |
| JP6967922B2 (ja) * | 2017-09-22 | 2021-11-17 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法および基板処理装置 |
| KR102030068B1 (ko) | 2017-10-12 | 2019-10-08 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
| JP7004579B2 (ja) * | 2018-01-15 | 2022-01-21 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法および記憶媒体 |
| JP7263078B2 (ja) * | 2018-09-27 | 2023-04-24 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
| GB201901637D0 (en) * | 2019-02-06 | 2019-03-27 | Lam Res Ag | Apparatus for processing a wafer, and method of controlling such an apparatus |
| KR102188261B1 (ko) * | 2019-08-02 | 2020-12-09 | 세미기어, 인코포레이션 | 기판 냉각 장치 및 방법 |
| KR102395805B1 (ko) * | 2019-08-26 | 2022-05-11 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
| JP6886546B2 (ja) * | 2020-05-12 | 2021-06-16 | 芝浦メカトロニクス株式会社 | 基板処理装置 |
| US20220390840A1 (en) * | 2021-06-03 | 2022-12-08 | Mks Instruments, Inc. | Light-Enhanced Ozone Wafer Processing System and Method of Use |
| KR102577853B1 (ko) * | 2021-06-22 | 2023-09-13 | 티오에스주식회사 | 기판 처리 장비용 고토크형 매뉴퓰레이터 |
| KR20230102300A (ko) * | 2021-12-30 | 2023-07-07 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
| JP2023125797A (ja) * | 2022-02-28 | 2023-09-07 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および処理カップ洗浄方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020096196A1 (en) * | 2001-01-23 | 2002-07-25 | Takayuki Toshima | Substrate processing apparatus and substrate processing method |
| JP3837026B2 (ja) * | 2001-01-23 | 2006-10-25 | 東京エレクトロン株式会社 | 基板洗浄装置及び基板洗浄方法 |
| JP2005217226A (ja) * | 2004-01-30 | 2005-08-11 | Matsushita Electric Ind Co Ltd | 半導体基板の洗浄方法及び洗浄装置 |
| JP2005277268A (ja) * | 2004-03-26 | 2005-10-06 | Dainippon Screen Mfg Co Ltd | 基板処理装置及び基板処理方法 |
| TWI343840B (en) * | 2005-07-06 | 2011-06-21 | Applied Materials Inc | Apparatus for electroless deposition of metals onto semiconductor substrates |
| US7914626B2 (en) * | 2005-11-24 | 2011-03-29 | Tokyo Electron Limited | Liquid processing method and liquid processing apparatus |
| JP2007173432A (ja) * | 2005-12-21 | 2007-07-05 | Seiko Epson Corp | 半導体基板処理装置及び半導体装置の製造方法 |
| JP4787089B2 (ja) | 2006-06-26 | 2011-10-05 | 大日本スクリーン製造株式会社 | 基板処理方法および基板処理装置 |
| JP5474840B2 (ja) * | 2011-01-25 | 2014-04-16 | 東京エレクトロン株式会社 | 液処理装置および液処理方法 |
| US20130087309A1 (en) * | 2011-10-11 | 2013-04-11 | Applied Materials, Inc. | Substrate support with temperature control |
| JP6317547B2 (ja) * | 2012-08-28 | 2018-04-25 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法 |
-
2012
- 2012-10-16 JP JP2012229139A patent/JP6168273B2/ja active Active
-
2013
- 2013-08-29 US US14/435,558 patent/US20150258582A1/en not_active Abandoned
- 2013-08-29 WO PCT/JP2013/073195 patent/WO2014061353A1/ja not_active Ceased
- 2013-08-29 KR KR1020157012879A patent/KR102132051B1/ko active Active
- 2013-09-11 TW TW102132773A patent/TWI508793B/zh active
-
2017
- 2017-01-09 US US15/401,892 patent/US10497581B2/en active Active