JP2019029346A5 - - Google Patents
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- Publication number
- JP2019029346A5 JP2019029346A5 JP2018138106A JP2018138106A JP2019029346A5 JP 2019029346 A5 JP2019029346 A5 JP 2019029346A5 JP 2018138106 A JP2018138106 A JP 2018138106A JP 2018138106 A JP2018138106 A JP 2018138106A JP 2019029346 A5 JP2019029346 A5 JP 2019029346A5
- Authority
- JP
- Japan
- Prior art keywords
- edge ring
- ring
- temperature controller
- power
- heating element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762539065P | 2017-07-31 | 2017-07-31 | |
| US62/539,065 | 2017-07-31 | ||
| US16/017,357 | 2018-06-25 | ||
| US16/017,357 US11837446B2 (en) | 2017-07-31 | 2018-06-25 | High power cable for heated components in RF environment |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019029346A JP2019029346A (ja) | 2019-02-21 |
| JP2019029346A5 true JP2019029346A5 (enExample) | 2021-09-02 |
| JP7223521B2 JP7223521B2 (ja) | 2023-02-16 |
Family
ID=65138322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018138106A Active JP7223521B2 (ja) | 2017-07-31 | 2018-07-24 | Ｒｆ環境内で加熱される構成要素のための高電力ケーブル |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US11837446B2 (enExample) |
| JP (1) | JP7223521B2 (enExample) |
| KR (2) | KR102618643B1 (enExample) |
| CN (2) | CN109326497B (enExample) |
| TW (1) | TWI811228B (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11837446B2 (en) * | 2017-07-31 | 2023-12-05 | Lam Research Corporation | High power cable for heated components in RF environment |
| US20200090907A1 (en) * | 2018-09-18 | 2020-03-19 | Applied Materials, Inc. | Systems and processes for plasma tuning |
| US12002653B2 (en) * | 2019-06-20 | 2024-06-04 | Lam Research Corporation | Systems and methods for compensating for RF power loss |
| KR20220110816A (ko) * | 2019-12-06 | 2022-08-09 | 램 리써치 코포레이션 | 통합된 rf 필터들을 가진 기판 지지부들 |
| CN119381236A (zh) * | 2024-10-29 | 2025-01-28 | 北京北方华创微电子装备有限公司 | 下电极组件及半导体工艺腔室 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4640939B2 (ja) | 2005-01-13 | 2011-03-02 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置およびプラズマ処理方法 |
| US7777152B2 (en) * | 2006-06-13 | 2010-08-17 | Applied Materials, Inc. | High AC current high RF power AC-RF decoupling filter for plasma reactor heated electrostatic chuck |
| TW200832901A (en) * | 2007-01-18 | 2008-08-01 | Asustek Comp Inc | Filter circuit for reducing EMI of differential signal |
| CN102217054B (zh) * | 2008-11-25 | 2013-05-08 | 京瓷株式会社 | 晶片加热装置、静电卡盘以及晶片加热装置的制造方法 |
| JP5643062B2 (ja) | 2009-11-24 | 2014-12-17 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| US8742666B2 (en) * | 2010-08-06 | 2014-06-03 | Lam Research Corporation | Radio frequency (RF) power filters and plasma processing systems including RF power filters |
| JP2013104945A (ja) | 2011-11-11 | 2013-05-30 | Toshiba Corp | フレキシブル光電配線モジュール |
| CN103187943B (zh) | 2011-12-28 | 2017-02-08 | 中微半导体设备(上海)有限公司 | 一种用于静电吸盘的射频滤波器 |
| JP5905735B2 (ja) * | 2012-02-21 | 2016-04-20 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び基板温度の設定可能帯域の変更方法 |
| JP5917946B2 (ja) | 2012-02-24 | 2016-05-18 | 東京エレクトロン株式会社 | 基板載置台及びプラズマエッチング装置 |
| JP6257071B2 (ja) | 2012-09-12 | 2018-01-10 | 株式会社日立国際電気 | 基板処理装置及び半導体装置の製造方法 |
| US9224583B2 (en) * | 2013-03-15 | 2015-12-29 | Lam Research Corporation | System and method for heating plasma exposed surfaces |
| US9449797B2 (en) * | 2013-05-07 | 2016-09-20 | Lam Research Corporation | Component of a plasma processing apparatus having a protective in situ formed layer on a plasma exposed surface |
| JP6050722B2 (ja) | 2013-05-24 | 2016-12-21 | 東京エレクトロン株式会社 | プラズマ処理装置及びフィルタユニット |
| JP6218650B2 (ja) * | 2014-03-11 | 2017-10-25 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP6219229B2 (ja) | 2014-05-19 | 2017-10-25 | 東京エレクトロン株式会社 | ヒータ給電機構 |
| JP6442296B2 (ja) | 2014-06-24 | 2018-12-19 | 東京エレクトロン株式会社 | 載置台及びプラズマ処理装置 |
| US9312832B2 (en) | 2014-07-23 | 2016-04-12 | Lam Research Corporation | High power filter with single adjust for multiple channels |
| JP6452449B2 (ja) * | 2015-01-06 | 2019-01-16 | 東京エレクトロン株式会社 | 載置台及び基板処理装置 |
| US10879041B2 (en) * | 2015-09-04 | 2020-12-29 | Applied Materials, Inc. | Method and apparatus of achieving high input impedance without using ferrite materials for RF filter applications in plasma chambers |
| US10044338B2 (en) * | 2015-10-15 | 2018-08-07 | Lam Research Corporation | Mutually induced filters |
| US10283330B2 (en) * | 2016-07-25 | 2019-05-07 | Lam Research Corporation | Systems and methods for achieving a pre-determined factor associated with an edge region within a plasma chamber by synchronizing main and edge RF generators |
| US11837446B2 (en) * | 2017-07-31 | 2023-12-05 | Lam Research Corporation | High power cable for heated components in RF environment |
-
2018
- 2018-06-25 US US16/017,357 patent/US11837446B2/en active Active
- 2018-07-19 KR KR1020180083886A patent/KR102618643B1/ko active Active
- 2018-07-24 JP JP2018138106A patent/JP7223521B2/ja active Active
- 2018-07-26 CN CN201810832761.1A patent/CN109326497B/zh active Active
- 2018-07-26 CN CN202311377184.9A patent/CN117577501A/zh active Pending
- 2018-07-30 TW TW107126277A patent/TWI811228B/zh active
-
2023
- 2023-12-01 US US18/526,215 patent/US12217944B2/en active Active
- 2023-12-21 KR KR1020230188979A patent/KR102818730B1/ko active Active
-
2025
- 2025-01-29 US US19/040,398 patent/US20250183015A1/en active Pending
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