JP2018533216A5 - - Google Patents

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Publication number
JP2018533216A5
JP2018533216A5 JP2018520156A JP2018520156A JP2018533216A5 JP 2018533216 A5 JP2018533216 A5 JP 2018533216A5 JP 2018520156 A JP2018520156 A JP 2018520156A JP 2018520156 A JP2018520156 A JP 2018520156A JP 2018533216 A5 JP2018533216 A5 JP 2018533216A5
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JP
Japan
Prior art keywords
base support
thermally conductive
thermal conductivity
heater
arcuate members
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2018520156A
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English (en)
Japanese (ja)
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JP2018533216A (ja
JP6538974B2 (ja
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Publication date
Priority claimed from US14/886,783 external-priority patent/US10154542B2/en
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Publication of JP2018533216A publication Critical patent/JP2018533216A/ja
Publication of JP2018533216A5 publication Critical patent/JP2018533216A5/ja
Application granted granted Critical
Publication of JP6538974B2 publication Critical patent/JP6538974B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2018520156A 2015-10-19 2016-10-12 円筒異方性熱伝導率を備える複合デバイス Active JP6538974B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/886,783 2015-10-19
US14/886,783 US10154542B2 (en) 2015-10-19 2015-10-19 Composite device with cylindrical anisotropic thermal conductivity
PCT/US2016/056547 WO2017069977A1 (en) 2015-10-19 2016-10-12 Composite device with cylindrical anisotropic thermal conductivity

Publications (3)

Publication Number Publication Date
JP2018533216A JP2018533216A (ja) 2018-11-08
JP2018533216A5 true JP2018533216A5 (enExample) 2018-12-20
JP6538974B2 JP6538974B2 (ja) 2019-07-03

Family

ID=57227091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018520156A Active JP6538974B2 (ja) 2015-10-19 2016-10-12 円筒異方性熱伝導率を備える複合デバイス

Country Status (7)

Country Link
US (1) US10154542B2 (enExample)
EP (1) EP3365913B1 (enExample)
JP (1) JP6538974B2 (enExample)
KR (1) KR101975316B1 (enExample)
CN (1) CN108701628B (enExample)
TW (1) TWI654699B (enExample)
WO (1) WO2017069977A1 (enExample)

Families Citing this family (9)

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WO2020040725A1 (en) * 2018-08-20 2020-02-27 Comet Ag Multi-stack cooling structure for radiofrequency component
US11515190B2 (en) 2019-08-27 2022-11-29 Watlow Electric Manufacturing Company Thermal diffuser for a semiconductor wafer holder
US12046502B2 (en) * 2019-09-09 2024-07-23 Watlow Electric Manufacturing Company Electrostatic puck and method of manufacture
KR102144079B1 (ko) * 2020-04-03 2020-08-13 (주)유진기업 Psc구조물에 긴장재를 삽입하는 방법 및 이를 이용하여 제작된 psc구조물
DE102020123546A1 (de) 2020-09-09 2022-03-10 Aixtron Se CVD-Reaktor mit einer Kühlfläche mit bereichsweise vergrößerter Emissivität
CN112382589A (zh) * 2020-11-10 2021-02-19 泉芯集成电路制造(济南)有限公司 一种去除芯片表面氧化硅的装置及方法
JP2023180522A (ja) * 2022-06-09 2023-12-21 新光電気工業株式会社 基板固定装置及び基板固定装置の製造方法
JP2023183628A (ja) * 2022-06-16 2023-12-28 新光電気工業株式会社 基板固定装置及び基板固定装置の製造方法
JP2024000905A (ja) * 2022-06-21 2024-01-09 新光電気工業株式会社 基板固定装置及び基板固定装置の製造方法

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WO2002089531A1 (en) 2001-04-30 2002-11-07 Lam Research, Corporation Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support
US6529686B2 (en) 2001-06-06 2003-03-04 Fsi International, Inc. Heating member for combination heating and chilling apparatus, and methods
KR100443122B1 (ko) 2001-10-19 2004-08-04 삼성전자주식회사 반도체 소자 제조장치용 히터 어셈블리
US20030089457A1 (en) 2001-11-13 2003-05-15 Applied Materials, Inc. Apparatus for controlling a thermal conductivity profile for a pedestal in a semiconductor wafer processing chamber
JP2006517740A (ja) 2003-01-17 2006-07-27 ゼネラル・エレクトリック・カンパニイ ウェーハ加工装置及びその製造方法
WO2005008749A1 (ja) 2003-07-16 2005-01-27 Ibiden Co., Ltd. セラミック接合体、セラミック接合体の製造方法、セラミック温調器およびセラミック温調ユニット
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JP4749072B2 (ja) * 2005-07-26 2011-08-17 京セラ株式会社 ウェハ保持体
JP2007134088A (ja) 2005-11-08 2007-05-31 Shin Etsu Chem Co Ltd セラミックスヒーターおよびセラミックスヒーターの製造方法
US7901509B2 (en) 2006-09-19 2011-03-08 Momentive Performance Materials Inc. Heating apparatus with enhanced thermal uniformity and method for making thereof
US7723648B2 (en) 2006-09-25 2010-05-25 Tokyo Electron Limited Temperature controlled substrate holder with non-uniform insulation layer for a substrate processing system
US7425689B2 (en) * 2006-09-27 2008-09-16 Tokyo Electron Limited Inline physical shape profiling for predictive temperature correction during baking of wafers in a semiconductor photolithography process
JP5762798B2 (ja) 2011-03-31 2015-08-12 東京エレクトロン株式会社 天井電極板及び基板処理載置
JP6077301B2 (ja) * 2012-12-28 2017-02-08 日本特殊陶業株式会社 静電チャック
TWI609991B (zh) 2013-06-05 2018-01-01 維克儀器公司 具有熱一致性改善特色的晶圓舟盒
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KR20180110213A (ko) * 2013-08-06 2018-10-08 어플라이드 머티어리얼스, 인코포레이티드 국부적으로 가열되는 다-구역 기판 지지부
US20150292815A1 (en) * 2014-04-10 2015-10-15 Applied Materials, Inc. Susceptor with radiation source compensation
TWI734668B (zh) * 2014-06-23 2021-08-01 美商應用材料股份有限公司 在ｅｐｉ腔室中的基材熱控制
KR20160015510A (ko) * 2014-07-30 2016-02-15 삼성전자주식회사 정전척 어셈블리, 이를 구비하는 반도체 제조장치, 및 이를 이용한 플라즈마 처리방법
US9872341B2 (en) * 2014-11-26 2018-01-16 Applied Materials, Inc. Consolidated filter arrangement for devices in an RF environment

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