JP2019533306A5 - - Google Patents

Download PDF

Info

Publication number
JP2019533306A5
JP2019533306A5 JP2019515489A JP2019515489A JP2019533306A5 JP 2019533306 A5 JP2019533306 A5 JP 2019533306A5 JP 2019515489 A JP2019515489 A JP 2019515489A JP 2019515489 A JP2019515489 A JP 2019515489A JP 2019533306 A5 JP2019533306 A5 JP 2019533306A5
Authority
JP
Japan
Prior art keywords
pedestal assembly
hollow core
heat shield
assembly according
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2019515489A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019533306A (ja
JP7073349B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2017/051373 external-priority patent/WO2018057369A1/en
Publication of JP2019533306A publication Critical patent/JP2019533306A/ja
Publication of JP2019533306A5 publication Critical patent/JP2019533306A5/ja
Application granted granted Critical
Publication of JP7073349B2 publication Critical patent/JP7073349B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2019515489A 2016-09-22 2017-09-13 広範囲にわたる温度制御のためのヒータペデスタルアセンブリ Active JP7073349B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662398310P 2016-09-22 2016-09-22
US62/398,310 2016-09-22
PCT/US2017/051373 WO2018057369A1 (en) 2016-09-22 2017-09-13 Heater pedestal assembly for wide range temperature control

Publications (3)

Publication Number Publication Date
JP2019533306A JP2019533306A (ja) 2019-11-14
JP2019533306A5 true JP2019533306A5 (enExample) 2020-10-22
JP7073349B2 JP7073349B2 (ja) 2022-05-23

Family

ID=61621254

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019515489A Active JP7073349B2 (ja) 2016-09-22 2017-09-13 広範囲にわたる温度制御のためのヒータペデスタルアセンブリ

Country Status (6)

Country Link
US (1) US10910238B2 (enExample)
JP (1) JP7073349B2 (enExample)
KR (1) KR102236934B1 (enExample)
CN (1) CN109716497B (enExample)
TW (2) TWI671851B (enExample)
WO (1) WO2018057369A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106607320B (zh) * 2016-12-22 2019-10-01 武汉华星光电技术有限公司 适用于柔性基板的热真空干燥装置
KR102460313B1 (ko) * 2018-12-13 2022-10-28 주식회사 원익아이피에스 기판 처리 장치의 서셉터 및 기판 처리 장치
TWI811307B (zh) * 2019-03-12 2023-08-11 鴻創應用科技有限公司 陶瓷電路複合結構及其製造方法
US12420314B2 (en) * 2019-10-18 2025-09-23 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor cleaning apparatus and method
US11515176B2 (en) * 2020-04-14 2022-11-29 Applied Materials, Inc. Thermally controlled lid stack components
US20220028710A1 (en) * 2020-07-21 2022-01-27 Applied Materials, Inc. Distribution components for semiconductor processing systems
US12020957B2 (en) * 2020-08-31 2024-06-25 Applied Materials, Inc. Heater assembly with process gap control for batch processing chambers
JP7490508B2 (ja) * 2020-09-09 2024-05-27 日本電子株式会社 三次元積層造形装置
US20230069317A1 (en) * 2021-08-25 2023-03-02 Applied Materials, Inc. Thermal choke plate
TWI890199B (zh) * 2022-12-02 2025-07-11 日商鎧俠股份有限公司 半導體裝置冷卻裝置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4256503B2 (ja) * 1997-10-30 2009-04-22 東京エレクトロン株式会社 真空処理装置
WO2000026960A1 (fr) * 1998-10-29 2000-05-11 Tokyo Electron Limited Dispositif de traitement sous vide
JP2003060973A (ja) * 2001-08-21 2003-02-28 Mitsubishi Heavy Ind Ltd 監視カメラ誘導用送信器、監視カメラ、及び、監視システム
JP4574987B2 (ja) * 2002-01-10 2010-11-04 東京エレクトロン株式会社 処理装置
WO2004090960A1 (ja) * 2003-04-07 2004-10-21 Tokyo Electron Limited 載置台構造及びこの載置台構造を有する熱処理装置
JP4761774B2 (ja) * 2005-01-12 2011-08-31 東京エレクトロン株式会社 温度/厚さ測定装置,温度/厚さ測定方法,温度/厚さ測定システム,制御システム,制御方法
CN100358098C (zh) 2005-08-05 2007-12-26 中微半导体设备(上海)有限公司 半导体工艺件处理装置
US20070169703A1 (en) * 2006-01-23 2007-07-26 Brent Elliot Advanced ceramic heater for substrate processing
US7705238B2 (en) * 2006-05-22 2010-04-27 Andrew Llc Coaxial RF device thermally conductive polymer insulator and method of manufacture
KR101560138B1 (ko) 2008-06-24 2015-10-14 어플라이드 머티어리얼스, 인코포레이티드 저온 pecvd 애플리케이션을 위한 받침대 히터
US8274017B2 (en) * 2009-12-18 2012-09-25 Applied Materials, Inc. Multifunctional heater/chiller pedestal for wide range wafer temperature control
US8733280B2 (en) 2010-12-20 2014-05-27 Intermolecular, Inc. Showerhead for processing chamber
JP6005946B2 (ja) * 2012-02-07 2016-10-12 株式会社Screenホールディングス 熱処理装置
US9089007B2 (en) 2012-04-27 2015-07-21 Applied Materials, Inc. Method and apparatus for substrate support with multi-zone heating
US10177014B2 (en) * 2012-12-14 2019-01-08 Applied Materials, Inc. Thermal radiation barrier for substrate processing chamber components
WO2014116392A1 (en) * 2013-01-25 2014-07-31 Applied Materials, Inc. Electrostatic chuck with concentric cooling base
US9698074B2 (en) 2013-09-16 2017-07-04 Applied Materials, Inc. Heated substrate support with temperature profile control
US20150194326A1 (en) * 2014-01-07 2015-07-09 Applied Materials, Inc. Pecvd ceramic heater with wide range of operating temperatures
CN204793612U (zh) * 2015-04-17 2015-11-18 李后杰 用于激光二极管的封装结构
CN104990175A (zh) * 2015-07-28 2015-10-21 珠海格力电器股份有限公司 一种辐射换热板组件

Similar Documents

Publication Publication Date Title
JP2019533306A5 (enExample)
JP2010503966A5 (enExample)
US10077946B2 (en) Three-dimensional heat conducting structure and manufacturing method thereof
US11598585B2 (en) Heat pipe
JP2013243365A5 (enExample)
JP2013514669A5 (enExample)
JP2015064560A5 (enExample)
RU2018125452A (ru) Вакуумный изолятор в камере для хранения пищевых продуктов и способы его изготовления и использования
JP3203322U (ja) 繊維状毛細管構造を有する熱管
TW201736794A (zh) 熱導結構
US20120325437A1 (en) Flat heat pipe with capilllary structure
WO2016033932A1 (zh) 蒸镀坩埚和蒸镀装置
US10208375B2 (en) Evaporation source and evaporation device
CN108344174A (zh) 一种加热管上带渗流孔的空气电加热器
CN106524286A (zh) 油汀取暖器
CN206383508U (zh) 一种3d打印机喷嘴结构
US20130084227A1 (en) Heat block with insulating collar
JP2012009702A5 (enExample)
JP2015516936A5 (enExample)
CN110484897B (zh) 晶片用调温装置及半导体设备
CN206136325U (zh) 多加热方式加热器
US20140131014A1 (en) Heat dissipating device
TWI599308B (zh) 散熱裝置
CN106338095B (zh) 油汀取暖器
KR100836717B1 (ko) 냉온 탱크