KR101975316B1 - 원통형 이방적 열 전도성을 갖는 복합 장치 - Google Patents

원통형 이방적 열 전도성을 갖는 복합 장치 Download PDF

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Publication number
KR101975316B1
KR101975316B1 KR1020187013853A KR20187013853A KR101975316B1 KR 101975316 B1 KR101975316 B1 KR 101975316B1 KR 1020187013853 A KR1020187013853 A KR 1020187013853A KR 20187013853 A KR20187013853 A KR 20187013853A KR 101975316 B1 KR101975316 B1 KR 101975316B1
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South Korea
Prior art keywords
base support
thermally conductive
arcuate members
thermal conductivity
conductive arcuate
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Korean (ko)
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KR20180071307A (ko
Inventor
산홍 장
케빈 프타시엔스키
케빈 알. 스미스
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와틀로 일렉트릭 매뉴팩츄어링 컴파니
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H05B1/0233—Industrial applications for semiconductors manufacturing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/267—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an organic material, e.g. plastic

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Resistance Heating (AREA)
  • Drying Of Semiconductors (AREA)
KR1020187013853A 2015-10-19 2016-10-12 원통형 이방적 열 전도성을 갖는 복합 장치 Active KR101975316B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/886,783 2015-10-19
US14/886,783 US10154542B2 (en) 2015-10-19 2015-10-19 Composite device with cylindrical anisotropic thermal conductivity
PCT/US2016/056547 WO2017069977A1 (en) 2015-10-19 2016-10-12 Composite device with cylindrical anisotropic thermal conductivity

Publications (2)

Publication Number Publication Date
KR20180071307A KR20180071307A (ko) 2018-06-27
KR101975316B1 true KR101975316B1 (ko) 2019-05-07

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KR1020187013853A Active KR101975316B1 (ko) 2015-10-19 2016-10-12 원통형 이방적 열 전도성을 갖는 복합 장치

Country Status (7)

Country Link
US (1) US10154542B2 (enExample)
EP (1) EP3365913B1 (enExample)
JP (1) JP6538974B2 (enExample)
KR (1) KR101975316B1 (enExample)
CN (1) CN108701628B (enExample)
TW (1) TWI654699B (enExample)
WO (1) WO2017069977A1 (enExample)

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WO2020040725A1 (en) * 2018-08-20 2020-02-27 Comet Ag Multi-stack cooling structure for radiofrequency component
US11515190B2 (en) 2019-08-27 2022-11-29 Watlow Electric Manufacturing Company Thermal diffuser for a semiconductor wafer holder
US12046502B2 (en) * 2019-09-09 2024-07-23 Watlow Electric Manufacturing Company Electrostatic puck and method of manufacture
KR102144079B1 (ko) * 2020-04-03 2020-08-13 (주)유진기업 Psc구조물에 긴장재를 삽입하는 방법 및 이를 이용하여 제작된 psc구조물
DE102020123546A1 (de) 2020-09-09 2022-03-10 Aixtron Se CVD-Reaktor mit einer Kühlfläche mit bereichsweise vergrößerter Emissivität
CN112382589A (zh) * 2020-11-10 2021-02-19 泉芯集成电路制造(济南)有限公司 一种去除芯片表面氧化硅的装置及方法
JP2023180522A (ja) * 2022-06-09 2023-12-21 新光電気工業株式会社 基板固定装置及び基板固定装置の製造方法
JP2023183628A (ja) * 2022-06-16 2023-12-28 新光電気工業株式会社 基板固定装置及び基板固定装置の製造方法
JP2024000905A (ja) * 2022-06-21 2024-01-09 新光電気工業株式会社 基板固定装置及び基板固定装置の製造方法

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US20080066676A1 (en) 2006-09-19 2008-03-20 General Electric Company Heating apparatus with enhanced thermal uniformity and method for making thereof

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WO2002089531A1 (en) 2001-04-30 2002-11-07 Lam Research, Corporation Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support
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KR20160015510A (ko) * 2014-07-30 2016-02-15 삼성전자주식회사 정전척 어셈블리, 이를 구비하는 반도체 제조장치, 및 이를 이용한 플라즈마 처리방법
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US20060076109A1 (en) 2004-10-07 2006-04-13 John Holland Method and apparatus for controlling temperature of a substrate
US20080066676A1 (en) 2006-09-19 2008-03-20 General Electric Company Heating apparatus with enhanced thermal uniformity and method for making thereof

Also Published As

Publication number Publication date
CN108701628B (zh) 2019-10-08
US10154542B2 (en) 2018-12-11
WO2017069977A1 (en) 2017-04-27
CN108701628A (zh) 2018-10-23
EP3365913A1 (en) 2018-08-29
KR20180071307A (ko) 2018-06-27
EP3365913B1 (en) 2021-06-16
JP2018533216A (ja) 2018-11-08
TW201719792A (zh) 2017-06-01
TWI654699B (zh) 2019-03-21
JP6538974B2 (ja) 2019-07-03
US20170111958A1 (en) 2017-04-20

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