AT515147B1 - Verfahren und Vorrichtung zum Behandeln von Gegenständen mit einer Flüssigkeit - Google Patents
Verfahren und Vorrichtung zum Behandeln von Gegenständen mit einer Flüssigkeit Download PDFInfo
- Publication number
- AT515147B1 AT515147B1 ATA946/2013A AT9462013A AT515147B1 AT 515147 B1 AT515147 B1 AT 515147B1 AT 9462013 A AT9462013 A AT 9462013A AT 515147 B1 AT515147 B1 AT 515147B1
- Authority
- AT
- Austria
- Prior art keywords
- medium
- treated
- temperature
- temperature sensor
- liquid
- Prior art date
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 40
- 238000000034 method Methods 0.000 title claims description 32
- 239000004065 semiconductor Substances 0.000 claims abstract description 27
- 230000001105 regulatory effect Effects 0.000 claims abstract description 13
- 238000010438 heat treatment Methods 0.000 claims description 32
- 238000001816 cooling Methods 0.000 claims description 12
- 230000001276 controlling effect Effects 0.000 claims description 6
- 230000006698 induction Effects 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 abstract description 18
- 238000004140 cleaning Methods 0.000 abstract description 5
- 235000012431 wafers Nutrition 0.000 description 26
- 238000012546 transfer Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000000110 cooling liquid Substances 0.000 description 3
- 229910021397 glassy carbon Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 230000002000 scavenging effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- 229920006169 Perfluoroelastomer Polymers 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000003251 chemically resistant material Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000002500 effect on skin Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000005405 multipole Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
- G01K13/02—Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
- G01K13/02—Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow
- G01K13/026—Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow of moving liquids
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Robotics (AREA)
- Weting (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ATA946/2013A AT515147B1 (de) | 2013-12-09 | 2013-12-09 | Verfahren und Vorrichtung zum Behandeln von Gegenständen mit einer Flüssigkeit |
| EP14830366.2A EP3080837B1 (de) | 2013-12-09 | 2014-11-26 | Verfahren und vorrichtung zum behandeln von gegenständen mit einem medium, insbesondere einer flüssigkeit |
| JP2016539041A JP6195673B2 (ja) | 2013-12-09 | 2014-11-26 | 液体で物体を処理するための方法および装置 |
| PCT/AT2014/000209 WO2015085334A1 (de) | 2013-12-09 | 2014-11-26 | Verfahren und vorrichtung zum behandeln von gegenständen mit einer flüssigkeit |
| US15/103,025 US20160307770A1 (en) | 2013-12-09 | 2014-11-26 | Method and device for treating objects with a liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ATA946/2013A AT515147B1 (de) | 2013-12-09 | 2013-12-09 | Verfahren und Vorrichtung zum Behandeln von Gegenständen mit einer Flüssigkeit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| AT515147A1 AT515147A1 (de) | 2015-06-15 |
| AT515147B1 true AT515147B1 (de) | 2016-10-15 |
Family
ID=52394800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ATA946/2013A AT515147B1 (de) | 2013-12-09 | 2013-12-09 | Verfahren und Vorrichtung zum Behandeln von Gegenständen mit einer Flüssigkeit |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20160307770A1 (enExample) |
| EP (1) | EP3080837B1 (enExample) |
| JP (1) | JP6195673B2 (enExample) |
| AT (1) | AT515147B1 (enExample) |
| WO (1) | WO2015085334A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021165308A1 (de) | 2020-02-20 | 2021-08-26 | 4Tex Gmbh | Verfahren zum behandeln von substraten mit chemikalien |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11581187B2 (en) * | 2018-12-20 | 2023-02-14 | Xia Tai Xin Semiconductor (Qing Dao) Ltd. | Method of heating SOC film on wafer by electromagnetic wave generator and heating apparatus using the same |
| WO2021061836A1 (en) * | 2019-09-23 | 2021-04-01 | Baldwin Technology Company, Inc. | System and method of sensing and processing multivariate printing process data |
| CN113878403B (zh) * | 2021-10-13 | 2024-10-29 | 洛阳开远智能精机有限公司 | 一种在线工件检测系统及工件检测方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3707979A (en) * | 1969-02-28 | 1973-01-02 | Honeywell Inc | Cooled temperature sensitive oscillator |
| US5478435A (en) * | 1994-12-16 | 1995-12-26 | National Semiconductor Corp. | Point of use slurry dispensing system |
| TW346649B (en) * | 1996-09-24 | 1998-12-01 | Tokyo Electron Co Ltd | Method for wet etching a film |
| JPH11283950A (ja) * | 1998-03-30 | 1999-10-15 | Ebara Corp | 基板洗浄装置 |
| KR100265286B1 (ko) * | 1998-04-20 | 2000-10-02 | 윤종용 | 반도체장치 제조용 케미컬 순환공급장치 및 이의 구동방법 |
| US5965813A (en) * | 1998-07-23 | 1999-10-12 | Industry Technology Research Institute | Integrated flow sensor |
| JP2000265945A (ja) * | 1998-11-10 | 2000-09-26 | Uct Kk | 薬液供給ポンプ、薬液供給装置、薬液供給システム、基板洗浄装置、薬液供給方法、及び基板洗浄方法 |
| US6333275B1 (en) * | 1999-10-01 | 2001-12-25 | Novellus Systems, Inc. | Etchant mixing system for edge bevel removal of copper from silicon wafers |
| US6376013B1 (en) * | 1999-10-06 | 2002-04-23 | Advanced Micro Devices, Inc. | Multiple nozzles for dispensing resist |
| KR20010039993A (ko) * | 1999-10-06 | 2001-05-15 | 오카무라 가네오 | 유량 및 유속 측정장치 |
| DE60120339T2 (de) * | 2001-01-05 | 2007-06-06 | NGK Spark Plug Co., Ltd., Nagoya | Gasdurchflussmessvorrichtung |
| WO2002089532A1 (en) * | 2001-04-26 | 2002-11-07 | Phifer Smith Corporation | A method and apparatus for heating a gas-solvent solution |
| US20080044939A1 (en) * | 2002-01-24 | 2008-02-21 | Nassiopoulou Androula G | Low power silicon thermal sensors and microfluidic devices based on the use of porous sealed air cavity technology or microchannel technology |
| US7300598B2 (en) * | 2003-03-31 | 2007-11-27 | Tokyo Electron Limited | Substrate processing method and apparatus |
| KR100708037B1 (ko) * | 2003-12-24 | 2007-04-16 | 마츠시타 덴끼 산교 가부시키가이샤 | 유체공급노즐, 기판처리장치 및 기판처리방법 |
| TW200618108A (en) * | 2004-09-07 | 2006-06-01 | Phifer Smith Corp | Copper processing using an ozone-solvent solution |
| JP4781834B2 (ja) * | 2006-02-07 | 2011-09-28 | 大日本スクリーン製造株式会社 | 現像装置および現像方法 |
| DE102009060931A1 (de) * | 2009-12-23 | 2011-06-30 | Gebr. Schmid GmbH & Co., 72250 | Verfahren und Vorrichtung zur Behandlung von Siliziumsubstraten |
| US8932962B2 (en) * | 2012-04-09 | 2015-01-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical dispensing system and method |
-
2013
- 2013-12-09 AT ATA946/2013A patent/AT515147B1/de active
-
2014
- 2014-11-26 EP EP14830366.2A patent/EP3080837B1/de active Active
- 2014-11-26 JP JP2016539041A patent/JP6195673B2/ja active Active
- 2014-11-26 US US15/103,025 patent/US20160307770A1/en not_active Abandoned
- 2014-11-26 WO PCT/AT2014/000209 patent/WO2015085334A1/de not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021165308A1 (de) | 2020-02-20 | 2021-08-26 | 4Tex Gmbh | Verfahren zum behandeln von substraten mit chemikalien |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3080837B1 (de) | 2025-06-11 |
| WO2015085334A1 (de) | 2015-06-18 |
| US20160307770A1 (en) | 2016-10-20 |
| JP6195673B2 (ja) | 2017-09-13 |
| JP2017500742A (ja) | 2017-01-05 |
| EP3080837A1 (de) | 2016-10-19 |
| AT515147A1 (de) | 2015-06-15 |
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Legal Events
| Date | Code | Title | Description |
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| HA | Change or addition of new inventor |
Inventor name: JOERG HOFER-MOSER, AT Effective date: 20210630 Inventor name: MANUEL LINDER, AT Effective date: 20210630 Inventor name: KLAUS SMOLINER, AT Effective date: 20210630 |