JP2017204508A5 - - Google Patents

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Publication number
JP2017204508A5
JP2017204508A5 JP2016094153A JP2016094153A JP2017204508A5 JP 2017204508 A5 JP2017204508 A5 JP 2017204508A5 JP 2016094153 A JP2016094153 A JP 2016094153A JP 2016094153 A JP2016094153 A JP 2016094153A JP 2017204508 A5 JP2017204508 A5 JP 2017204508A5
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JP
Japan
Prior art keywords
substrate
processing
unit
processing apparatus
transport path
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Application number
JP2016094153A
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English (en)
Japanese (ja)
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JP6703785B2 (ja
JP2017204508A (ja
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Priority to JP2016094153A priority Critical patent/JP6703785B2/ja
Priority claimed from JP2016094153A external-priority patent/JP6703785B2/ja
Priority to US15/585,408 priority patent/US10043697B2/en
Publication of JP2017204508A publication Critical patent/JP2017204508A/ja
Publication of JP2017204508A5 publication Critical patent/JP2017204508A5/ja
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Publication of JP6703785B2 publication Critical patent/JP6703785B2/ja
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JP2016094153A 2016-05-09 2016-05-09 基板処理装置、および物品製造方法 Active JP6703785B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016094153A JP6703785B2 (ja) 2016-05-09 2016-05-09 基板処理装置、および物品製造方法
US15/585,408 US10043697B2 (en) 2016-05-09 2017-05-03 Substrate processing apparatus and article manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016094153A JP6703785B2 (ja) 2016-05-09 2016-05-09 基板処理装置、および物品製造方法

Publications (3)

Publication Number Publication Date
JP2017204508A JP2017204508A (ja) 2017-11-16
JP2017204508A5 true JP2017204508A5 (enExample) 2019-05-09
JP6703785B2 JP6703785B2 (ja) 2020-06-03

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ID=60244087

Family Applications (1)

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JP2016094153A Active JP6703785B2 (ja) 2016-05-09 2016-05-09 基板処理装置、および物品製造方法

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US (1) US10043697B2 (enExample)
JP (1) JP6703785B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7202176B2 (ja) * 2018-12-21 2023-01-11 キヤノン株式会社 搬送装置、基板処理装置、および物品製造方法
WO2023209897A1 (ja) * 2022-04-27 2023-11-02 ヤマハ発動機株式会社 ウエハ加工装置、半導体チップの製造方法および半導体チップ

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2936885B2 (ja) 1992-03-31 1999-08-23 キヤノン株式会社 アライメント方法及びそれを用いた投影露光装置
JP3735175B2 (ja) * 1997-03-04 2006-01-18 大日本スクリーン製造株式会社 基板処理装置
US6319322B1 (en) * 1998-07-13 2001-11-20 Tokyo Electron Limited Substrate processing apparatus
TW200715448A (en) * 2005-07-25 2007-04-16 Canon Anelva Corp Vacuum processing apparatus, semiconductor device manufacturing method and semiconductor device manufacturing system
IT1399285B1 (it) * 2009-07-03 2013-04-11 Applied Materials Inc Sistema di lavorazione substrato
DE102010008233A1 (de) * 2010-02-11 2011-08-11 Schmid Technology GmbH, 68723 Vorrichtung und Verfahren zum Transport von Substraten
JP2012009831A (ja) * 2010-05-21 2012-01-12 Tokyo Electron Ltd インプリントシステム、インプリント方法、プログラム及びコンピュータ記憶媒体
JP2015079954A (ja) * 2013-09-13 2015-04-23 キヤノン株式会社 リソグラフィシステムおよび物品の製造方法
JP6285275B2 (ja) * 2014-04-30 2018-02-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

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