JP6703785B2 - 基板処理装置、および物品製造方法 - Google Patents

基板処理装置、および物品製造方法 Download PDF

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Publication number
JP6703785B2
JP6703785B2 JP2016094153A JP2016094153A JP6703785B2 JP 6703785 B2 JP6703785 B2 JP 6703785B2 JP 2016094153 A JP2016094153 A JP 2016094153A JP 2016094153 A JP2016094153 A JP 2016094153A JP 6703785 B2 JP6703785 B2 JP 6703785B2
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Japan
Prior art keywords
substrate
unit
processing
processing units
adjustment
Prior art date
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JP2016094153A
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English (en)
Japanese (ja)
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JP2017204508A (ja
JP2017204508A5 (enExample
Inventor
誠人 佐藤
誠人 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2016094153A priority Critical patent/JP6703785B2/ja
Priority to US15/585,408 priority patent/US10043697B2/en
Publication of JP2017204508A publication Critical patent/JP2017204508A/ja
Publication of JP2017204508A5 publication Critical patent/JP2017204508A5/ja
Application granted granted Critical
Publication of JP6703785B2 publication Critical patent/JP6703785B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2016094153A 2016-05-09 2016-05-09 基板処理装置、および物品製造方法 Active JP6703785B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016094153A JP6703785B2 (ja) 2016-05-09 2016-05-09 基板処理装置、および物品製造方法
US15/585,408 US10043697B2 (en) 2016-05-09 2017-05-03 Substrate processing apparatus and article manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016094153A JP6703785B2 (ja) 2016-05-09 2016-05-09 基板処理装置、および物品製造方法

Publications (3)

Publication Number Publication Date
JP2017204508A JP2017204508A (ja) 2017-11-16
JP2017204508A5 JP2017204508A5 (enExample) 2019-05-09
JP6703785B2 true JP6703785B2 (ja) 2020-06-03

Family

ID=60244087

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016094153A Active JP6703785B2 (ja) 2016-05-09 2016-05-09 基板処理装置、および物品製造方法

Country Status (2)

Country Link
US (1) US10043697B2 (enExample)
JP (1) JP6703785B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7202176B2 (ja) * 2018-12-21 2023-01-11 キヤノン株式会社 搬送装置、基板処理装置、および物品製造方法
WO2023209897A1 (ja) * 2022-04-27 2023-11-02 ヤマハ発動機株式会社 ウエハ加工装置、半導体チップの製造方法および半導体チップ

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2936885B2 (ja) 1992-03-31 1999-08-23 キヤノン株式会社 アライメント方法及びそれを用いた投影露光装置
JP3735175B2 (ja) * 1997-03-04 2006-01-18 大日本スクリーン製造株式会社 基板処理装置
US6319322B1 (en) * 1998-07-13 2001-11-20 Tokyo Electron Limited Substrate processing apparatus
TW200715448A (en) * 2005-07-25 2007-04-16 Canon Anelva Corp Vacuum processing apparatus, semiconductor device manufacturing method and semiconductor device manufacturing system
IT1399285B1 (it) * 2009-07-03 2013-04-11 Applied Materials Inc Sistema di lavorazione substrato
DE102010008233A1 (de) * 2010-02-11 2011-08-11 Schmid Technology GmbH, 68723 Vorrichtung und Verfahren zum Transport von Substraten
JP2012009831A (ja) * 2010-05-21 2012-01-12 Tokyo Electron Ltd インプリントシステム、インプリント方法、プログラム及びコンピュータ記憶媒体
JP2015079954A (ja) * 2013-09-13 2015-04-23 キヤノン株式会社 リソグラフィシステムおよび物品の製造方法
JP6285275B2 (ja) * 2014-04-30 2018-02-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

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Publication number Publication date
US20170323816A1 (en) 2017-11-09
JP2017204508A (ja) 2017-11-16
US10043697B2 (en) 2018-08-07

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