JP2020094261A5 - - Google Patents

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Publication number
JP2020094261A5
JP2020094261A5 JP2018234885A JP2018234885A JP2020094261A5 JP 2020094261 A5 JP2020094261 A5 JP 2020094261A5 JP 2018234885 A JP2018234885 A JP 2018234885A JP 2018234885 A JP2018234885 A JP 2018234885A JP 2020094261 A5 JP2020094261 A5 JP 2020094261A5
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JP
Japan
Prior art keywords
transport
substrate
carrier
alignment
mask
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Application number
JP2018234885A
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English (en)
Japanese (ja)
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JP7224165B2 (ja
JP2020094261A (ja
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Priority claimed from JP2018234885A external-priority patent/JP7224165B2/ja
Priority to JP2018234885A priority Critical patent/JP7224165B2/ja
Application filed filed Critical
Priority to KR1020190159712A priority patent/KR102712657B1/ko
Priority to US16/711,658 priority patent/US12354894B2/en
Priority to CN201911280001.5A priority patent/CN111326461B/zh
Publication of JP2020094261A publication Critical patent/JP2020094261A/ja
Publication of JP2020094261A5 publication Critical patent/JP2020094261A5/ja
Priority to JP2023016126A priority patent/JP7529824B2/ja
Publication of JP7224165B2 publication Critical patent/JP7224165B2/ja
Application granted granted Critical
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JP2018234885A 2018-12-14 2018-12-14 アライメント装置、蒸着装置、および、電子デバイスの製造装置 Active JP7224165B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2018234885A JP7224165B2 (ja) 2018-12-14 2018-12-14 アライメント装置、蒸着装置、および、電子デバイスの製造装置
KR1020190159712A KR102712657B1 (ko) 2018-12-14 2019-12-04 얼라인먼트 장치, 증착 장치, 전자 디바이스의 제조 장치, 및 얼라인먼트 방법
US16/711,658 US12354894B2 (en) 2018-12-14 2019-12-12 Alignment apparatus, deposition apparatus, electronic device manufacturing apparatus, and alignment method
CN201911280001.5A CN111326461B (zh) 2018-12-14 2019-12-13 对准装置、蒸镀装置以及电子器件的制造装置
JP2023016126A JP7529824B2 (ja) 2018-12-14 2023-02-06 アライメント装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018234885A JP7224165B2 (ja) 2018-12-14 2018-12-14 アライメント装置、蒸着装置、および、電子デバイスの製造装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023016126A Division JP7529824B2 (ja) 2018-12-14 2023-02-06 アライメント装置

Publications (3)

Publication Number Publication Date
JP2020094261A JP2020094261A (ja) 2020-06-18
JP2020094261A5 true JP2020094261A5 (enExample) 2022-01-06
JP7224165B2 JP7224165B2 (ja) 2023-02-17

Family

ID=71072863

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2018234885A Active JP7224165B2 (ja) 2018-12-14 2018-12-14 アライメント装置、蒸着装置、および、電子デバイスの製造装置
JP2023016126A Active JP7529824B2 (ja) 2018-12-14 2023-02-06 アライメント装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023016126A Active JP7529824B2 (ja) 2018-12-14 2023-02-06 アライメント装置

Country Status (4)

Country Link
US (1) US12354894B2 (enExample)
JP (2) JP7224165B2 (enExample)
KR (1) KR102712657B1 (enExample)
CN (1) CN111326461B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019182260A1 (ko) * 2018-03-23 2019-09-26 홍잉 인라인 박막 프로세싱 장치
JP7224165B2 (ja) * 2018-12-14 2023-02-17 キヤノントッキ株式会社 アライメント装置、蒸着装置、および、電子デバイスの製造装置
JP7316782B2 (ja) * 2018-12-14 2023-07-28 キヤノントッキ株式会社 蒸着装置、電子デバイスの製造装置、および、蒸着方法
CN114908329B (zh) * 2021-02-08 2024-03-08 台湾积体电路制造股份有限公司 校正方法及半导体制造设备
JP7362693B2 (ja) 2021-06-01 2023-10-17 キヤノントッキ株式会社 成膜装置及び電子デバイスの製造装置
JP7428684B2 (ja) * 2021-09-02 2024-02-06 キヤノントッキ株式会社 アライメント装置
JPWO2023085314A1 (enExample) * 2021-11-12 2023-05-19
KR20240100399A (ko) * 2021-11-12 2024-07-01 도쿄엘렉트론가부시키가이샤 기판 처리 장치 및 기판 처리 방법
KR20250028375A (ko) * 2022-06-29 2025-02-28 도쿄엘렉트론가부시키가이샤 플라즈마 처리 장치
TWI831557B (zh) * 2023-01-04 2024-02-01 日商荏原製作所股份有限公司 基板固持器及基板處理裝置
US20250236473A1 (en) * 2024-01-19 2025-07-24 Applied Materials, Inc. Substrate carrier

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2609588B2 (ja) * 1986-05-14 1997-05-14 株式会社東芝 浮上式搬送装置
EP0648698B1 (en) * 1992-07-07 1998-01-07 Ebara Corporation Magnetically levitated carrying apparatus
JP4368633B2 (ja) 2002-08-01 2009-11-18 株式会社半導体エネルギー研究所 製造装置
US7918940B2 (en) * 2005-02-07 2011-04-05 Semes Co., Ltd. Apparatus for processing substrate
JP4609759B2 (ja) * 2005-03-24 2011-01-12 三井造船株式会社 成膜装置
KR20130004830A (ko) * 2011-07-04 2013-01-14 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법
KR101329760B1 (ko) * 2011-08-16 2013-11-15 주식회사 에스에프에이 진공 증착 시스템
JP5957322B2 (ja) 2012-07-19 2016-07-27 キヤノントッキ株式会社 蒸着装置並びに蒸着方法
JP2014107412A (ja) 2012-11-28 2014-06-09 Tokyo Electron Ltd 搬送システム及び成膜装置
KR102017744B1 (ko) * 2012-12-12 2019-10-15 삼성디스플레이 주식회사 증착 장치, 이를 이용한 박막 형성 방법 및 유기 발광 표시 장치 제조 방법
KR102432348B1 (ko) * 2015-12-04 2022-08-16 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치 제조 방법
WO2017198298A1 (en) 2016-05-18 2017-11-23 Applied Materials, Inc. Apparatus and method for transport
KR20180086715A (ko) * 2017-01-23 2018-08-01 어플라이드 머티어리얼스, 인코포레이티드 반송챔버, 이를 포함하는 기판처리시스템 및 이를 이용한 기판처리시스템의 기판처리방법
JP7224165B2 (ja) 2018-12-14 2023-02-17 キヤノントッキ株式会社 アライメント装置、蒸着装置、および、電子デバイスの製造装置

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