JP2017201652A - 光モジュール - Google Patents
光モジュール Download PDFInfo
- Publication number
- JP2017201652A JP2017201652A JP2016092446A JP2016092446A JP2017201652A JP 2017201652 A JP2017201652 A JP 2017201652A JP 2016092446 A JP2016092446 A JP 2016092446A JP 2016092446 A JP2016092446 A JP 2016092446A JP 2017201652 A JP2017201652 A JP 2017201652A
- Authority
- JP
- Japan
- Prior art keywords
- lens
- support member
- filter
- base member
- optical module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
- H01S5/4093—Red, green and blue [RGB] generated directly by laser action or by a combination of laser action with nonlinear frequency conversion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02315—Support members, e.g. bases or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
- H01S5/0071—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for beam steering, e.g. using a mirror outside the cavity to change the beam direction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016092446A JP2017201652A (ja) | 2016-05-02 | 2016-05-02 | 光モジュール |
| US15/640,004 US10014655B2 (en) | 2016-05-02 | 2017-06-30 | Optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016092446A JP2017201652A (ja) | 2016-05-02 | 2016-05-02 | 光モジュール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017201652A true JP2017201652A (ja) | 2017-11-09 |
| JP2017201652A5 JP2017201652A5 (enExample) | 2018-07-26 |
Family
ID=60264655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016092446A Pending JP2017201652A (ja) | 2016-05-02 | 2016-05-02 | 光モジュール |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US10014655B2 (enExample) |
| JP (1) | JP2017201652A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019186551A (ja) * | 2018-04-13 | 2019-10-24 | 住友電気工業株式会社 | 光モジュール、および光源装置 |
| JPWO2022153643A1 (enExample) * | 2021-01-18 | 2022-07-21 | ||
| CN114927934A (zh) * | 2021-02-12 | 2022-08-19 | 日亚化学工业株式会社 | 发光装置 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114514447B (zh) * | 2019-09-27 | 2024-07-16 | 富士胶片株式会社 | 光学元件、光学装置、摄像装置及光学元件的制造方法 |
| US12413040B2 (en) * | 2019-12-26 | 2025-09-09 | Nichia Corporation | Laser light source |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02194580A (ja) * | 1989-01-23 | 1990-08-01 | Nippon Telegr & Teleph Corp <Ntt> | 発光装置およびその製造方法 |
| US5016965A (en) * | 1987-10-08 | 1991-05-21 | British Telecommunications Public Limited Company | Optical package |
| JPH11174472A (ja) * | 1997-12-12 | 1999-07-02 | Canon Inc | 液晶素子 |
| JP2013110199A (ja) * | 2011-11-18 | 2013-06-06 | Citizen Electronics Co Ltd | Led発光装置 |
| JP2015015433A (ja) * | 2013-07-08 | 2015-01-22 | 住友電気工業株式会社 | 光アセンブリの製造方法 |
| JP2016015415A (ja) * | 2014-07-02 | 2016-01-28 | 住友電気工業株式会社 | 三色光光源 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL252232A (enExample) * | 1959-06-02 | 1900-01-01 | ||
| JP4581279B2 (ja) | 2001-03-29 | 2010-11-17 | 澁谷工業株式会社 | 光モジュールの製造方法 |
| US9243761B2 (en) * | 2013-02-28 | 2016-01-26 | Sumitomo Electric Industries, Ltd. | Optical assembly and method for assembling the same, and optical module implemented with optical assembly |
| JP6340902B2 (ja) | 2014-05-13 | 2018-06-13 | 住友電気工業株式会社 | 光モジュールの製造方法 |
-
2016
- 2016-05-02 JP JP2016092446A patent/JP2017201652A/ja active Pending
-
2017
- 2017-06-30 US US15/640,004 patent/US10014655B2/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5016965A (en) * | 1987-10-08 | 1991-05-21 | British Telecommunications Public Limited Company | Optical package |
| JPH02194580A (ja) * | 1989-01-23 | 1990-08-01 | Nippon Telegr & Teleph Corp <Ntt> | 発光装置およびその製造方法 |
| JPH11174472A (ja) * | 1997-12-12 | 1999-07-02 | Canon Inc | 液晶素子 |
| JP2013110199A (ja) * | 2011-11-18 | 2013-06-06 | Citizen Electronics Co Ltd | Led発光装置 |
| JP2015015433A (ja) * | 2013-07-08 | 2015-01-22 | 住友電気工業株式会社 | 光アセンブリの製造方法 |
| JP2016015415A (ja) * | 2014-07-02 | 2016-01-28 | 住友電気工業株式会社 | 三色光光源 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019186551A (ja) * | 2018-04-13 | 2019-10-24 | 住友電気工業株式会社 | 光モジュール、および光源装置 |
| JP7172817B2 (ja) | 2018-04-13 | 2022-11-16 | 住友電気工業株式会社 | 光モジュール、および光源装置 |
| JPWO2022153643A1 (enExample) * | 2021-01-18 | 2022-07-21 | ||
| WO2022153643A1 (ja) * | 2021-01-18 | 2022-07-21 | 住友電気工業株式会社 | 光モジュール |
| JP7679828B2 (ja) | 2021-01-18 | 2025-05-20 | 住友電気工業株式会社 | 光モジュール |
| CN114927934A (zh) * | 2021-02-12 | 2022-08-19 | 日亚化学工业株式会社 | 发光装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US10014655B2 (en) | 2018-07-03 |
| US20180145479A1 (en) | 2018-05-24 |
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