JP2017200712A - 吸着ユニット、板状部材搬送ユニット、樹脂封止装置、板状部材搬送方法および樹脂封止方法 - Google Patents
吸着ユニット、板状部材搬送ユニット、樹脂封止装置、板状部材搬送方法および樹脂封止方法 Download PDFInfo
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/918—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with at least two picking-up heads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
Abstract
Description
Claims (19)
- 本体部と、
前記本体部の内部の中空の流路と、
前記本体部の吸着面側の吸着部と、を備え、
前記吸着部には貫通孔が設けられており、
前記貫通孔と前記流路とは連通しており、
前記吸着部は板状部材の湾曲に追従可能であるように構成されている、吸着ユニット。 - 前記吸着部は、吸着パッドを備え、
前記吸着パッドは、パッド開口部が設けられたパッド胴部と、前記パッド胴部から延在するパッド外周部とを備えている、請求項1に記載の吸着ユニット。 - 前記板状部材の吸着時に前記パッド外周部の遠位端の少なくとも一部の表面が前記板状部材と接触し、前記板状部材の湾曲に追従可能であるように構成されている、請求項2に記載の吸着ユニット。
- 前記パッド外周部の前記遠位端は、前記遠位端から近位側に窪む遠位端凹部を備える、請求項3に記載の吸着ユニット。
- 前記本体部の前記吸着面側には凹部が設けられており、
前記板状部材の吸着前には前記パッド外周部の前記遠位端は前記凹部から離れて位置し、前記板状部材の吸着時には前記パッド外周部の前記遠位端は前記凹部と接して位置している、請求項3または請求項4に記載の吸着ユニット。 - 前記凹部は環状の溝である、請求項5に記載の吸着ユニット。
- 前記吸着パッドは、前記パッド外周部よりも近位側の前記パッド胴部の箇所から前記パッド外周部とは異なる方向に延在するパッド内側支持部をさらに備え、
前記板状部材の吸着時には前記パッド外周部とともに前記パッド内側支持部が前記板状部材を支持する、請求項2〜請求項6のいずれか1項に記載の吸着ユニット。 - 前記パッド内側支持部には切欠部が設けられている、請求項7に記載の吸着ユニット。
- 前記吸着部は、前記吸着パッドを支持するアダプタを備え、
前記アダプタは、前記貫通孔が設けられたアダプタ胴部と、前記アダプタ胴部の前記貫通孔の一方の端から前記本体部の前記吸着面側の表面と平行方向に延在するフランジと、前記アダプタ胴部の前記貫通孔の他方の端から前記本体部の吸着面側の表面と平行方向に延在するアダプタ脚部とを備え、
前記アダプタ脚部は、前記アダプタ脚部の遠位端から前記フランジの方向に延在する突起部を備える、請求項2〜請求項8のいずれか1項に記載の吸着ユニット。 - 前記パッド開口部に前記アダプタ胴部が嵌め込まれることにより、前記吸着パッドは前記アダプタに取り付けられている、請求項9に記載の吸着ユニット。
- 前記板状部材の湾曲に合わせて前記吸着部の配置が変更可能である、請求項1〜請求項10のいずれか1項に記載の吸着ユニット。
- 所定の間隙を空けて前記板状部材の複数のそれぞれが収納された板状部材収納部の前記間隙に挿入可能である、請求項1〜請求項11のいずれか1項に記載の吸着ユニット。
- 本体部と、
前記本体部の内部の中空の流路と、
前記本体部の吸着面側の吸着部と、を備え、
前記吸着部には貫通孔が設けられており、
前記貫通孔と前記流路とは連通しており、
前記吸着部は、吸着パッドを備え、
前記吸着パッドは、パッド開口部が設けられたパッド胴部と、前記パッド胴部から延在するパッド外周部と、前記パッド外周部よりも近位側の前記パッド胴部の箇所から前記パッド外周部とは異なる方向に延在するパッド内側支持部とを備え、
前記パッド内側支持部には切欠部が設けられ、
前記流路と前記貫通孔とを介してガスを排出させ、
さらに、板状部材と前記切欠部との間からガスを排出させ、
前記吸着部に前記板状部材を吸着させ、
前記吸着部に前記板状部材を吸着させることで前記吸着パッドを弾性変形させるように構成されている、吸着ユニット。 - 請求項1〜請求項13のいずれか1項に記載の吸着ユニットと、
前記吸着ユニットを移動させるための移動ユニットと、を備えた、板状部材搬送ユニット。 - 請求項14に記載の板状部材搬送ユニットと、樹脂封止ユニットと、を備えた、樹脂封止装置。
- 前記樹脂封止ユニットの数を増減可能である、請求項15に記載の樹脂封止装置。
- 請求項1〜請求項13のいずれか1項に記載の吸着ユニットの前記吸着部を板状部材上に位置させる工程と、
前記貫通孔および前記流路を通してガスを排出させることによって前記吸着部に前記板状部材を吸着する工程と、
前記吸着部に吸着された前記板状部材を移動させる工程と、を備えた、板状部材搬送方法。 - 前記吸着部に吸着された前記板状部材を反転させる工程をさらに備えた、請求項17に記載の板状部材搬送方法。
- 請求項17または請求項18に記載の板状部材搬送方法を用いて前記板状部材を搬送する工程と、樹脂封止する工程と、を備えた、樹脂封止方法。
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JP2016092632A JP6349343B2 (ja) | 2016-05-02 | 2016-05-02 | 吸着ユニット、板状部材搬送ユニット、樹脂封止装置、板状部材搬送方法および樹脂封止方法 |
TW106109690A TWI652760B (zh) | 2016-05-02 | 2017-03-23 | Adsorption unit, plate-shaped component conveying unit, resin sealing device, plate-shaped component conveying method, and resin sealing method |
CN201710262164.5A CN107342247B (zh) | 2016-05-02 | 2017-04-20 | 吸附单元、板状构件输送单元、树脂密封装置、板状构件输送方法以及树脂密封方法 |
KR1020170051492A KR102019542B1 (ko) | 2016-05-02 | 2017-04-21 | 흡착 유닛, 판형상 부재 반송 유닛, 수지 밀봉 장치, 판형상 부재 반송 방법 및 수지 밀봉 방법 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108357920A (zh) * | 2018-01-22 | 2018-08-03 | 京东方科技集团股份有限公司 | 抓取装置及其报警方法 |
JP2020161585A (ja) * | 2019-03-26 | 2020-10-01 | 株式会社ダイヘン | ワーク搬送用ハンド |
JP2022542539A (ja) * | 2019-07-30 | 2022-10-05 | セムシスコ ゲーエムベーハー | ウェハ用の基板処理装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108461574A (zh) * | 2018-01-23 | 2018-08-28 | 无锡奥特维科技股份有限公司 | 电池片堆叠装置及方法 |
TWI672763B (zh) * | 2018-06-14 | 2019-09-21 | 旺矽科技股份有限公司 | 晶圓取放件以及晶圓取放件與晶圓匣之總成 |
CN109719087B (zh) * | 2019-01-04 | 2021-06-18 | Oppo(重庆)智能科技有限公司 | 屏幕活化设备 |
KR102556368B1 (ko) * | 2020-10-30 | 2023-07-18 | 세메스 주식회사 | 반송 핸드 및 기판 처리 장치 |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0438391U (ja) * | 1990-07-25 | 1992-03-31 | ||
JPH0629370A (ja) * | 1992-04-06 | 1994-02-04 | American Teleph & Telegr Co <Att> | 半導体ウェーハ転送装置 |
JPH08236597A (ja) * | 1995-02-27 | 1996-09-13 | Hitachi Ltd | 移載装置 |
JP2003094370A (ja) * | 2001-09-25 | 2003-04-03 | Sharp Corp | 真空吸着パッド及びそれを用いた真空吸着装置 |
JP2004223650A (ja) * | 2003-01-23 | 2004-08-12 | Matsushita Electric Ind Co Ltd | 吸着保持装置 |
JP2011116085A (ja) * | 2009-12-07 | 2011-06-16 | Towa Corp | 樹脂封止装置及び樹脂封止方法 |
JP2012009751A (ja) * | 2010-06-28 | 2012-01-12 | Fujikura Ltd | 真空ピンセット |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5634033B2 (ja) * | 2008-08-29 | 2014-12-03 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 樹脂封止型半導体装置とその製造方法 |
JP5793806B2 (ja) | 2011-08-17 | 2015-10-14 | アピックヤマダ株式会社 | 樹脂モールド装置 |
-
2016
- 2016-05-02 JP JP2016092632A patent/JP6349343B2/ja active Active
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- 2017-04-20 CN CN201710262164.5A patent/CN107342247B/zh active Active
- 2017-04-21 KR KR1020170051492A patent/KR102019542B1/ko active IP Right Grant
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0438391U (ja) * | 1990-07-25 | 1992-03-31 | ||
JPH0629370A (ja) * | 1992-04-06 | 1994-02-04 | American Teleph & Telegr Co <Att> | 半導体ウェーハ転送装置 |
JPH08236597A (ja) * | 1995-02-27 | 1996-09-13 | Hitachi Ltd | 移載装置 |
JP2003094370A (ja) * | 2001-09-25 | 2003-04-03 | Sharp Corp | 真空吸着パッド及びそれを用いた真空吸着装置 |
JP2004223650A (ja) * | 2003-01-23 | 2004-08-12 | Matsushita Electric Ind Co Ltd | 吸着保持装置 |
JP2011116085A (ja) * | 2009-12-07 | 2011-06-16 | Towa Corp | 樹脂封止装置及び樹脂封止方法 |
JP2012009751A (ja) * | 2010-06-28 | 2012-01-12 | Fujikura Ltd | 真空ピンセット |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108357920A (zh) * | 2018-01-22 | 2018-08-03 | 京东方科技集团股份有限公司 | 抓取装置及其报警方法 |
JP2020161585A (ja) * | 2019-03-26 | 2020-10-01 | 株式会社ダイヘン | ワーク搬送用ハンド |
JP7293533B2 (ja) | 2019-03-26 | 2023-06-20 | 株式会社ダイヘン | ワーク搬送用ハンド |
JP2022542539A (ja) * | 2019-07-30 | 2022-10-05 | セムシスコ ゲーエムベーハー | ウェハ用の基板処理装置 |
JP7268208B2 (ja) | 2019-07-30 | 2023-05-02 | セムシスコ ゲーエムベーハー | ウェハ用の基板処理装置 |
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KR102019542B1 (ko) | 2019-09-06 |
CN107342247A (zh) | 2017-11-10 |
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CN107342247B (zh) | 2021-02-12 |
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JP6349343B2 (ja) | 2018-06-27 |
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