JP2017195291A - 貫通孔の封止構造及び封止方法、並びに、貫通孔を封止するための転写基板 - Google Patents
貫通孔の封止構造及び封止方法、並びに、貫通孔を封止するための転写基板 Download PDFInfo
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Abstract
Description
図1は、本実施形態における転写基板の製造工程を説明する図である。まず、シリコンウエハ製の基板を用意し、封止する基材の貫通孔の径及び位置(ピッチ)に合わせた突起部をドライエッチングにより形成した(図1(a))。突起部の寸法は、直径500μm、高さ10μmの円柱状の突起である。
本実施形態で封止処理を行う基材は、シリコンウエハ(上部基材)とガラスウエハ(下部基材)であって、2枚一組で封止空間を形成する(図2(a))。基材の厚さは、いずれも0.5mmである。シリコンウエハに封止空間となるキャビティが複数(72個)形成されており、このキャビティに連通する貫通孔が形成されている。一方、ガラスウエハは、平坦な板材である。シリコンウエハのキャビティの寸法は2mm角であり、貫通孔は直径0.1μmの断面円形の孔である。
(i)で製造した転写基板を用いて、基材の封止空間の貫通孔を封止した。転写基板と基材の位置あわせには、ボンドアライナー(BA8,ズースマイクロテック社製)を用いて、図3(a)のように、転写基板の突起部が貫通孔に対応するように位置決めした。その後、ウエハボンダー(SB8e,ズースマイクロテック社製)を用いて、真空雰囲気(10Pa)に減圧後、転写基板を基材に押し当てて加圧、転写基板と基材をヒーター付治具で加熱した。このときの転写条件は、突起部頂面の圧力が100MPa、加熱条件は、昇温速度30℃/minで200℃まで加熱した。
Claims (9)
- 封止空間を形成する一組の基材と、前記一組の基材の少なくとも一つに形成され前記封止空間と連通する少なくとも一つの貫通孔と、前記貫通孔を封止する封止部材と、を含む封止構造であって、
前記貫通孔が形成される前記基材の表面上に、金、銀、パラジウム、白金の少なくともいずれかよりなるバルク状金属からなり、少なくとも前記貫通孔の周辺部を包囲するように形成された下地金属膜を備え、
前記封止部材は、前記下地金属膜に接合しつつ前記貫通孔を封止しており、
前記封止部材は、前記下地金属膜に接合される、純度99.9質量%以上の金、銀、パラジウム、白金から選択される一種以上の金属粉末の圧縮体からなる封止材料と、
前記封止材料に接合される、金、銀、パラジウム、白金の少なくともいずれかよりなるバルク状金属からなる蓋状金属膜と、からなり、
前記封止材料は、前記下地金属膜と接する外周側の緻密化領域と、前記貫通孔に接する中心側の多孔質領域からなり、
前記緻密化領域は、任意断面における空隙率が面積率で10%以下である、封止構造。 - 下地金属膜の厚さが、0.01μm以上10μm以下である請求項1記載の封止構造。
- 蓋状金属膜の厚さが、0.01μm以上10μm以下である請求項1又は請求項2記載の封止構造。
- 封止材料の横断面の断面積が、貫通孔の横断面の断面積の1.2倍以上6倍以下である請求項1〜請求項3のいずれかに記載の封止構造。
- 封止材料の厚さが、0.1μm以上10μm以下である請求項1〜請求項4のいずれかに記載の封止構造。
- 封止材料は、純度が99.9質量%以上であり、平均粒径が0.01μm以上1.0μm以下である金、銀、パラジウム、白金から選択される一種以上の金属粉末の焼結体を圧縮することで形成されたものである請求項1〜請求項5のいずれかに記載の封止構造。
- 請求項1〜請求項6のいずれかに記載の封止構造を形成する封止方法であって、
封止領域を形成する基材の貫通孔の位置に対応する位置に、蓋状金属膜と純度が99.9質量%以上であり平均粒径が0.01μm以上1.0μm以下である金、銀、パラジウム、白金から選択される一種以上の金属粉末が焼結してなる金属粉末焼結体とを備える転写基板を用意する工程と、
貫通孔が形成された前記基材の表面に、少なくとも貫通孔の周辺部を包囲するように下地金属膜を形成する工程と、
前記金属粉末焼結体が前記下地金属膜に接しつつ、前記貫通孔を封止するように、前記転写基板と前記基材とを対向させて重ねる工程と、
前記転写用基板を押圧し、前記封金属粉末焼結体から封止材料を形成すると共に前記下地金属に接合させる工程と、を含む封止方法。 - 転写基板及び基材の少なくともいずれかを80℃以上300℃以下で加熱しながら押圧する請求項7記載の封止方法。
- 請求項7又は請求項8に記載の封止方法で使用される転写基板であって、
基板と、
前記基板上の基材の貫通孔の位置に対応する位置に形成され突起部と、
少なくとも前記突起部の上に形成され、金、銀、パラジウム、白金の少なくともいずれかよりなるバルク状金属からなる蓋状金属膜と、
前記蓋状金属膜の上に形成され、純度が99.9質量%以上であり平均粒径が0.01μm以上1.0μm以下である金、銀、パラジウム、白金から選択される一種以上の金属粉末が焼結してなる金属粉末焼結体と、を備え、
更に、前記突起部と前記蓋状金属膜との間に形成され、クロム、チタン、タングステン、及びこれらの金属の合金からなり、前記蓋状金属膜側の表面に酸化皮膜が形成されている転写膜と、を備える、転写基板。
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