JP2017174909A - 発光素子の製造方法、及び発光装置の製造方法 - Google Patents
発光素子の製造方法、及び発光装置の製造方法 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 22
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- 229920005989 resin Polymers 0.000 claims abstract description 44
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- 239000003086 colorant Substances 0.000 abstract 1
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- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
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- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
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- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
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- 238000002834 transmittance Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
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Abstract
Description
図1(a)〜(c)は、第1の実施の形態に係る発光素子1の製造工程を概略的に表す斜視図である。
このとき、樹脂膜20を完全に切断するため、透明基板11を僅かに削る程度の位置まで刃を入れることが好ましい。
第2の実施の形態は、クリア層が蛍光体含有層の側面を覆うように形成される点において、第1の実施の形態と異なる。なお、第1の実施の形態と同様の点については、説明を省略又は簡略化する。
第3の実施の形態は、第1、2の実施の形態に係る発光素子を有する発光装置についての形態である。なお、第1、2の実施の形態と同様の点については、説明を省略又は簡略化する。
上記実施の形態に係る発光装置によれば、複数の発光素子に含まれる蛍光体含有層を一括して形成するため、発光素子間の発光色のばらつきが小さい。また、個片化された発光素子の各々に蛍光体含有層を貼り付ける場合のように接着剤を使用する必要がないため、製造コストを低減することができる。
3 発光装置
10 ウエハ
11 透明基板
12 発光部
20 樹脂膜
21 蛍光体含有層
22 クリア層
31 基板
34 側壁
Claims (5)
- 透明基板とその上に形成された複数の発光部からなるウエハの前記透明基板側の表面に、蛍光体含有層を含む樹脂膜を形成する工程と、
前記樹脂膜を形成する前又は後に、スクライビングにより前記透明基板の表面に分離予定面に沿ってスクライビングラインを形成する工程と、
前記スクライビングラインを形成する前又は後に、前記分離予定面に沿って前記樹脂膜を切断する工程と、
前記スクライビングラインを形成し、かつ前記樹脂膜を切断した後、ブレイキングにより前記分離予定面に沿って前記透明基板を分離する工程と、
を含む、発光素子の製造方法。 - 前記樹脂膜が、前記蛍光体含有層上のクリア層を有する、
請求項1に記載の発光素子の製造方法。 - 前記クリア層が、前記蛍光体含有層の上面及び側面を覆うように形成される、
請求項2に記載の発光素子の製造方法。 - 前記クリア層の屈折率が前記蛍光体含有層の屈折率よりも低い、
請求項2又は3に記載の発光素子の製造方法。 - 請求項1〜4のいずれか1項に記載の発光素子の製造方法により製造された発光素子を基板上にフリップチップ実装する工程と、
フリップチップ実装された前記発光素子の側面を覆うように白色の側壁を形成する工程と、
を含む、発光装置の製造方法。
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JP2021100046A (ja) * | 2019-12-23 | 2021-07-01 | 日亜化学工業株式会社 | 発光素子の製造方法 |
JP2021197542A (ja) * | 2020-06-09 | 2021-12-27 | 日亜化学工業株式会社 | 発光装置の製造方法 |
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US11271143B2 (en) | 2019-01-29 | 2022-03-08 | Osram Opto Semiconductors Gmbh | μ-LED, μ-LED device, display and method for the same |
US11610868B2 (en) | 2019-01-29 | 2023-03-21 | Osram Opto Semiconductors Gmbh | μ-LED, μ-LED device, display and method for the same |
US11538852B2 (en) * | 2019-04-23 | 2022-12-27 | Osram Opto Semiconductors Gmbh | μ-LED, μ-LED device, display and method for the same |
US11646392B2 (en) * | 2020-06-09 | 2023-05-09 | Nichia Corporation | Method of manufacturing light-emitting device |
CN113097367A (zh) * | 2021-03-24 | 2021-07-09 | 深圳市华星光电半导体显示技术有限公司 | QD-miniLED显示面板及其制备方法 |
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