TW201717334A - 封裝結構及其製法 - Google Patents
封裝結構及其製法 Download PDFInfo
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Abstract
一種封裝結構,係包括:發光元件、螢光層、透光層以及反射層,其中該發光元件係具有相對之第一表面與第二表面、及鄰接該第一表面與該第二表面之側面;螢光層係覆蓋該發光元件之該第一表面;透光層係覆蓋該螢光層,其中該透光層外側緣形成有一斜面;以及反射層位形成於該斜面上,而遮蓋該螢光層之外側緣,俾藉由形成於該斜面上之反射層遮蓋該螢光層之外側緣,可避免光線從螢光層的外側緣外洩出去。本發明復提供該封裝結構之製法。
Description
本發明係有關一種封裝結構及其製法,尤指一種可發光的封裝結構及其製法。
發光二極體(Light Emitting Diode,簡稱LED)因具有壽命長、體積小、耐震性高及耗電量低等優點,故廣泛地應用於照明需求之電子產品中。於工業上、各式電子產品、及生活家電之應用日趨普及。
第1圖係揭示一種習知LED封裝件之剖面圖,該LED封裝件1包括有:一透光件16;一螢光層14結合於透光件16上;一發光元件10設置於螢光層14上;一包覆層12設置於螢光層14上,且覆蓋發光元件10的側面。
惟,習知LED封裝件中,當通電後,發光元件10透過螢光層14發射的光線,往往從螢光層14的側邊外洩出,造成大量的光損耗,形成發光效率不佳的缺點,此一問題於透光件16及螢光層14過薄時(約250μm)更顯嚴重。
因此,如何克服習知技術中之問題,實已成目前亟欲解決的課題。
鑑於上述習知技術之缺失,本發明提供一種封裝結構之製法,係包括:提供複數發光元件,並於該些發光元件間形成包覆層,其中,各該發光元件具有相對之第一表面與第二表面、及鄰接該第一表面與該第二表面之側面,且該包覆層係覆蓋該些發光元件之側面;形成螢光層於該些複數發光元件之第一表面與該包覆層上;於任二相鄰之該發光元件之間的包覆層形成溝槽,且令該溝槽貫穿該包覆層及螢光層;以及形成反射層於該些溝槽之槽壁上。
前述之製法中,該螢光層上復結合有一透光層;該些溝槽復延伸至該透光層。
前述之製法中,復包括沿該些溝槽進行切單製程。
本發明復提供一種封裝結構,係包括:發光元件,係具有相對之第一表面與第二表面、及鄰接該第一表面與該第二表面之側面;包覆層,係形成於該發光元件之側面上;螢光層,係形成於該包覆層與該發光元件之第一表面上,其中,該包覆層之側邊及該螢光層之側邊並共同形成為一斜面;以及反射層,係形成於該斜面上,且遮蓋該螢光層之側邊。
前述之結構中,復包括有透光層係結合於該螢光層上。
前述之製法與結構中,該包覆層係為透光材質所形成者;該反射層係為金屬層或白膠。
本發明又提供一種封裝結構之製法,係包括:提供複
數發光元件,並形成螢光層於該些發光元件上,其中,該些發光元件具有相對之第一表面與第二表面、及鄰接該第一表面與該第二表面之側面,且該螢光層係覆蓋該發光元件之第一表面與側面;於該螢光層上形成透光層,以令該透光層覆蓋該螢光層;於該透光層中形成複數位於該些發光元件之間的溝槽,其中,該溝槽的深度係超過形成在該第一表面之螢光層的高度;以及形成反射層於該些溝槽之槽壁上。
前述之製法中,復包括沿該些溝槽進行切單製程。
本發明再提供一種封裝結構,係包括:發光元件,係具有相對之第一表面與第二表面、及鄰接該第一表面與該第二表面之側面;螢光層,係覆蓋該發光元件之該第一表面與該側面;透光層,係覆蓋該螢光層,其中該透光層外側緣形成有一斜面;以及反射層,形成於該斜面上,而遮蓋該螢光層之外側緣。
前述之結構與製法中,該反射層為金屬層或白膠。
由上可知,本發明之封裝結構及其製法係藉由在複數發光元件間形成溝槽,且該溝槽之深度係至少穿透螢光層(及包覆層)或至少超過形成於發光元件第一表面上之螢光層之高度,俾於螢光層外側緣或透光層外側緣形成有斜面之結構,並使形成於該斜面上之反射層遮蓋該螢光層側邊,避免光線從螢光層的側邊外洩出去。再者,透過該些溝槽之槽壁係為斜面,使該反射層具有斜度,以利於反射光線,且可藉由調整該溝槽之深度或角度以調整光源射出
角度。
1‧‧‧LED封裝件
2,2’,3,3’‧‧‧封裝結構
10,20,30‧‧‧發光元件
20a,30a‧‧‧第一表面
20b,30b‧‧‧第二表面
20c,30c‧‧‧側面
21,31‧‧‧第一離型層
21’,31’‧‧‧第二離型層
12,22‧‧‧包覆層
23,33‧‧‧溝槽
231,331‧‧‧槽壁
14,24,34‧‧‧螢光層
16‧‧‧透光件
26,36‧‧‧透光層
36a‧‧‧第一側
36b‧‧‧第二側
27,35,37‧‧‧反射層
S‧‧‧切割路徑
h‧‧‧螢光層之高度
第1圖係為習知LED封裝件之剖面圖;第2A至2E圖係為本發明之封裝結構之製法之第一實施例的剖面示意圖,其中第2C’、2D’與2E’圖係為對應第2C、2D與2E圖之另一實施態樣;以及第3A至3E圖係為本發明之封裝結構之製法的第二實施例之剖面示意圖,其中第3D’與3E’圖係為對應第3D與3E圖之另一實施態樣。
以下藉由特定的具體實施例說明本發明之實施方式,熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點及功效。
須知,本說明書所附圖式所繪示之結構、比例、大小等,均僅用以配合說明書所揭示之內容,以供熟悉此技藝之人士之瞭解與閱讀,並非用以限定本發明可實施之限定條件,故不具技術上之實質意義,任何結構之修飾、比例關係之改變或大小之調整,在不影響本發明所能產生之功效及所能達成之目的下,均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。同時,本說明書中所引用之如“上”、及“一”等之用語,亦僅為便於敘述之明瞭,而非用以限定本發明可實施之範圍,其相對關係之改變或調整,在無實質變更技術內容下,當亦視為本發明可實施之範疇。
請參閱第2A至2E圖,係為本發明之封裝結構及其製法之第一實施例的剖面示意圖。
如第2A圖所示,結合複數發光元件20於第一離型層21上,其中該些發光元件20具有相對之第一表面20a與第二表面20b、及鄰接該第一表面20a與該第二表面20b之側面20c。於本實施例中,該些發光元件20係為發光二極體,並透過該第二表面20b以供該些發光元件20結合於該第一離型層21上。
如第2B圖所示,形成包覆層22於該些複數發光元件20之間,且該包覆層22係覆蓋於該些發光元件20之側面20c,但不覆蓋第一表面20a。於本實施例中,該包覆層22係為透光材質所形成者,例如透明膠層(如透明矽膠),且該包覆層22係以充填方式或模封(molding)方式形成。
如第2C圖所示,形成螢光層24於發光元件20之第一表面20a與該包覆層22上。該螢光層24係為將螢光顆粒以噴灑或噴塗(spray-coating)方式形成於該發光元件20之第一表面20a與該包覆層22上,亦或預先將螢光顆粒與一膠膜結合再貼附於該發光元件20之第一表面20a與該包覆層22上,以使該些螢光顆粒均勻佈設於該於該些發光元件20之第一表面20a與該包覆層22上。由於包覆層22未覆蓋發光元件20的第一表面20a,如此當發光元件20的第一表面20a發出光線時,光線直接進入螢光層24後,可直接與其中的螢光顆粒進行反應,以產生理想的色光。
另外可選擇於該螢光層24上形成有第二離型層
21’,以於後續製程進行時,避免破壞螢光層24。
如第2D圖所示,於任二相鄰之該發光元件20之間的包覆層22形成溝槽23,其中該溝槽23之深度係至少穿透該包覆層22及螢光層24;該溝槽23之斷面例如呈倒V狀,亦即對應於覆蓋各該發光元件20之包覆層22及螢光層24之外側緣形成有一斜面,該斜面即為對應該溝槽23之槽壁231;另外,可藉由調整該倒V狀溝槽23之深度及角度以調整光源射出角度;此外,該溝槽23例如以切割方式形成。
接著形成反射層27於該些溝槽23之槽壁231上,亦即於斜面上形成反射層27。於本實施例中,該反射層27係為一金屬層。在一些實施例中,可利用電鍍、沉積、塗佈或濺鍍等方式將金屬層附著於該斜面上;此外,亦可於該些溝槽23中填入例如為白膠之反射層。另由於第一離型層21與第二離型層21’的設置,可避免反射層形成於發光元件20與螢光層24上。
如第2E圖所示,接著,移除該第一離型層21與該第二離型層21’,以外露該發光元件20之第二表面20b與該包覆層22,並沿如第2D圖所示之切割路徑S(即沿該些溝槽23)進行切單製程,以製得複數個發光式封裝結構2。
請參閱第2C’、2D’與2E’圖,為對應第2C、2D與2E圖之另一實施態樣。本實施態樣與第一實施例大致相同,主要差異在於透光層26的形成,故不再贅述相同製程部分。
如第2C’、2D’與2E’圖所示,可選擇將螢光層24結合一透光層26,其中,該透光層26係為玻璃、透明膠、或玻璃與透明膠之組合。此外,該些溝槽23可延伸至該螢光層24亦或延伸至該螢光層24及該透光層26。透過本實施態樣,可得到發光式封裝結構2’。
本發明復提供一種封裝結構2,2’,係包括:一發光元件20、一螢光層24、一包覆層22、一透光層26以及一反射層27。
所述之發光元件20係為發光二極體,其具有相對之第一表面20a與第二表面20b、及鄰接該第一表面20a與該第二表面20b之側面20c,而該包覆層22係形成於該側面20c上,另該螢光層24形成於該發光元件20及該包覆層22上且覆蓋該發光元件20之該第一表面20a,其中該包覆層22之側邊及該螢光層24之側邊並共同形成為一斜面,以供反射層27形成於該斜面上,且遮蓋該螢光層24之側邊。另所述之透光層26可選擇覆蓋該螢光層24。
該透光層26係為玻璃、透明膠、或玻璃與透明膠之組合。該反射層27係為一金屬層。
請參閱第3A至3E圖係為本發明之封裝結構之製法之第二實施例的剖面示意圖。本實施例與第一實施例主要差異在於螢光層的形成位置,故不再贅述相同製程部分。
如第3A圖所示,結合複數發光元件30於第一離型層31上,其中該些發光元件30具有相對之第一表面30a與第二表面30b、及鄰接該第一表面30a與該第二表面30b
之側面30c。於本實施例中,該些發光元件30透過該第二表面30b以供該些發光元件30結合於該第一離型層31上。接著形成螢光層34於該些發光元件30上,且該螢光層34係覆蓋該發光元件30之第一表面30a與側面30c。
於本實施例中,不需如同第一實施例於複數發光元件之間形成包覆層。
如第3B圖所示,形成透光層36於該第一離型層31與該螢光層34上,以覆蓋該螢光層34。該透光層36例如為透明膠。
如第3C圖所示,於該透光層36中形成複數位於該些發光元件30之間的溝槽33,且該溝槽33之深度係至少超過形成於該發光元件第一表面上之該螢光層34之高度h。該溝槽33例如以切割透光層36方式形成。如圖所示,該溝槽33之斷面例如呈倒V狀,亦即對應於覆蓋各該發光元件30之透光層36的外側緣形成有一斜面,該斜面即為對應該溝槽33之槽壁331。
如第3D圖所示,形成反射層35於該溝槽33之槽壁331上。在本實施例中,反射層35為一白膠,且該白膠填滿該溝槽33。
如第3E圖所示,沿如第3D圖所示之切割路徑S(即沿該些溝槽33)進行切單製程,並移除該第一離型層31,以外露該發光元件30之第二表面30b、該螢光層34與該透光層36,進而製得複數個發光式封裝結構3。
請參閱第3D’與3E’圖,為對應第3D與3E圖之另
一實施態樣。本實施態樣與第二實施例大致相同,主要差異在於反射層37的材質與形成方式,故不再贅述相同製程部分。
如第3D’與3E’圖所示,於該透光層36中形成複數位於該些發光元件30之間的溝槽33,並形成反射層37於該溝槽33之槽壁331上,該反射層37為一金屬層,在一些實施例中,可利用電鍍、沉積、塗佈或濺鍍等方式將金屬層附著於溝槽33之斷面,亦即該斜面上。此外,可於該透光層36上形成第二離型層31’,以於形成反射層37時保護透光層36。之後移除該第一離型層31與第二離型層31’,並沿如第3D’圖所示之切割路徑S(即沿該些溝槽33)進行切單製程,以製得複數個發光式封裝結構3’。
本發明復提供一種封裝結構3,3’,係包括:一發光元件30、一螢光層34、一透光層36以及一反射層35,37。
所述之發光元件30係為發光二極體,其具有相對之第一表面30a與第二表面30b、及鄰接該第一表面30a與該第二表面30b之側面30c,其中,螢光層34覆蓋該發光元件30之該第一表面30a與該側面30c。
所述之透光層36其具有相對之第一側36a與第二側36b,且該透光層36覆蓋該螢光層34,其中該透光層36之第二側36b與該發光元件30之第二表面30b共平面,且該第一側36a的面積大於第二側36b的面積,亦即於該透光層36的外側緣形成一斜面。該透光層36係為透明膠。
所述之反射層35,37係形成於該斜面上,而遮蓋住螢
光層34之外側緣。於一實施例中,所述之反射層35例如為白膠。於另一實施例中,所述之反射層37例如為金屬層。
透過前述說明可知,本發明之封裝結構及其製法係藉由在複數發光元件間形成溝槽,且該溝槽之深度係至少穿透螢光層(及包覆層)或至少超過形成於發光元件第一表面上之螢光層之高度,俾於螢光層外側緣或透光層外側緣形成有斜面之結構,並使形成於該斜面上之反射層遮蓋該螢光層側邊,避免光線從螢光層的側邊外洩出去,再者,透過該些溝槽之槽壁係為斜面,使該反射層具有斜度,以利於反射光線,且可藉由調整該溝槽之深度或角度以調整光源射出角度。
上述實施例係用以例示性說明本發明之原理及其功效,而非用於限制本發明。任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下,對上述實施例進行修改。因此本發明之權利保護範圍,應如後述之申請專利範圍所列。
3’‧‧‧封裝結構
30‧‧‧發光元件
34‧‧‧螢光層
36‧‧‧透光層
37‧‧‧反射層
Claims (15)
- 一種封裝結構之製法,係包括:提供複數發光元件,並於該些發光元件間形成包覆層,其中,各該發光元件具有相對之第一表面與第二表面、及鄰接該第一表面與該第二表面之側面,且該包覆層係形成於任二相鄰之該發光元件之側面間;形成螢光層於該些複數發光元件之第一表面與該包覆層上;於任二相鄰之該發光元件之間的包覆層形成溝槽,且令該溝槽貫穿該包覆層及螢光層;以及形成反射層於該些溝槽之槽壁上。
- 如申請專利範圍第1項所述之封裝結構之製法,其中,該螢光層上復結合有一透光層。
- 如申請專利範圍第2項所述之封裝結構之製法,其中,該些溝槽復延伸至該透光層。
- 如申請專利範圍第1項所述之封裝結構之製法,其中,該包覆層係為透光材質所形成者。
- 如申請專利範圍第1項所述之封裝結構之製法,其中,該反射層係為金屬層或白膠。
- 如申請專利範圍第1或2項所述之封裝結構之製法,復包括沿該些溝槽進行切單製程。
- 一種封裝結構,係包括:發光元件,係具有相對之第一表面與第二表面、及鄰接該第一表面與該第二表面之側面; 包覆層,係形成於該發光元件之側面上;螢光層,係形成於該包覆層與該發光元件之第一表面上,其中,該包覆層之側邊及該螢光層之側邊並共同形成為一斜面;以及反射層,係形成於該斜面上,且遮蓋該螢光層之側邊。
- 如申請專利範圍第7項所述之封裝結構,復包括有透光層,係結合於該螢光層上。
- 如申請專利範圍第7項所述之封裝結構,其中,該包覆層係為透光材質所形成者。
- 如申請專利範圍第7項所述之封裝結構,其中,該反射層係為金屬層或白膠。
- 一種封裝結構之製法,係包括:提供複數發光元件,並形成螢光層於該些發光元件上,其中,該些發光元件具有相對之第一表面與第二表面、及鄰接該第一表面與該第二表面之側面,且該螢光層係覆蓋該發光元件之第一表面與側面;於該螢光層上形成透光層,以令該透光層覆蓋該螢光層;於該透光層中形成複數位於任二相鄰之該發光元件之間的溝槽,其中,該溝槽的深度係超過形成在該第一表面之螢光層的高度;以及形成反射層於該些溝槽之槽壁上。
- 如申請專利範圍第11項所述之封裝結構之製法,其 中,該反射層係為金屬層或白膠。
- 如申請專利範圍第11項所述之封裝結構之製法,復包括沿該些溝槽進行切單製程。
- 一種封裝結構,係包括:發光元件,係具有相對之第一表面與第二表面、及鄰接該第一表面與該第二表面之側面;螢光層,係覆蓋該發光元件之該第一表面與該側面;透光層,係覆蓋該螢光層,其中該透光層外側緣形成有一斜面;以及反射層,位形成於該斜面上,而遮蓋住該螢光層之外側緣。
- 如申請專利範圍第14項所述之封裝結構,其中,該反射層係為金屬層或白膠。
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- 2016-06-14 CN CN201610421876.2A patent/CN106684225A/zh active Pending
- 2016-08-25 JP JP2016164311A patent/JP2017092449A/ja active Pending
- 2016-11-01 US US15/340,028 patent/US20170133562A1/en not_active Abandoned
- 2016-11-04 KR KR1020160146457A patent/KR20170053131A/ko not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI712185B (zh) * | 2017-08-02 | 2020-12-01 | 吳裕朝 | 發光裝置、應用其的背光模組、光源模組及其製備方法 |
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Publication number | Publication date |
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JP2017092449A (ja) | 2017-05-25 |
US20170133562A1 (en) | 2017-05-11 |
CN106684225A (zh) | 2017-05-17 |
KR20170053131A (ko) | 2017-05-15 |
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