JP2017157769A - 樹脂封止型車載制御装置 - Google Patents
樹脂封止型車載制御装置 Download PDFInfo
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H—ELECTRICITY
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
- H05K5/0056—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by features for protecting electronic components against vibration and moisture, e.g. potting, holders for relatively large capacitors
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0069—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having connector relating features for connecting the connector pins with the PCB or for mounting the connector body with the housing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
- H05K2201/10303—Pin-in-hole mounted pins
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
Abstract
Description
図1は、実施例1の樹脂封止型車載制御装置1の主要構造を示す分解斜視図である。
ベース部材11は、一方側が開放されたお椀状の形状を有しており、回路基板15が実装される板状部11aおよび板状部11aから突出する側壁11b、回路基板15の座面となる台座部11c、板状部11aの外周に延設された車両組付固定部11d、板状部11aの四隅に設けられた隅台座部11e、板上部11aにコネクタを挿入するためのコネクタ用窓11fおよび、側壁11bに設けられた開口11gを備えている。側壁11bは、板状部11aの隅から突出して壁状に設けられることで、ベース部材11全体がケース状の形状となっており、この中に回路基板15が収容される形となっている。
図7は実施例2の樹脂封止型車載制御装置1であり、ベース部材11の開口11gと回路基板15との位置関係および開口11gの形状を示す概略図である。
図8は、実施例3の樹脂封止型車載制御装置1であり、ベース部材11の開口11gと回路基板15との位置関係および開口11gの形状を示す概略図である。
図9は、実施例4の樹脂封止型車載制御装置1であり、ベース部材11の開口11gと回路基板15との位置関係および開口11gの形状を示す概略図である。
図10は、実施例5の樹脂封止型車載制御装置1であり、ベース部材11の開口11gと回路基板15との位置関係および開口11gの形状を示す概略図である。
開口11gの形状としては、楕円形状に限らず、四角、円形状などいずれの形状も採用することができる。
図11は、実施例6の樹脂封止型車載制御装置1であり、ベース部材11の開口11gと回路基板15との位置関係および開口11gの形状を示す概略図である。
開口11gの形状としては、四角状に限らず、半楕円形状などいずれの形状も採用することができる。
図12は、実施例7の樹脂封止型車載制御装置1の概念図である。
図13は、実施例8の樹脂封止型車載制御装置1の概念図である。
図14は、実施例8の樹脂封止型車載制御装置1の概念図である。
11 ベース部材
11a 板状部
11b 側壁
11c 台座部
11d 車両組付固定部
11e 隅台座部
11f コネクタ用窓
11g 開口
111g 第一の開口
112g 第二の開口
11h フィン
12 コネクタ
12a ピン端子
12b ハウジング
13 高熱伝導層
14 電子部品
14a 回路配線
15 回路基板
16 止めねじ
17 サーマルビア
20 樹脂材料
21 回路基板切り欠き
30 金型
30a 樹脂挿入口
31 ノズル
Claims (8)
- 一対の幅広面と側面とを有する回路基板と、
前記回路基板を収容するベース部材と、
前記回路基板の前記幅広面の両面に充填された樹脂を有し、
前記ベース部材は、前記樹脂を介して前記幅広面と対向する板状部と、
前記板状部から突出して設けられ、前記側面と対向する側壁と、を有し、
前記側壁は、開口を有する車載制御装置。 - 請求項1において、
前記側壁の前記開口は、前記回路基板の前記側面と対向する位置よりも前記板状部側に設けられた車載制御装置。 - 請求項2において、
前記開口は、前記側面と対向する位置よりも前記板状部側から、前記側面と対向する位置よりも前記側壁の端部側にかけて設けられた車載制御装置。 - 請求項3において、
前記開口は、前記側壁の端部側から前記板状部に向かって切り欠き状に設けられた車載制御装置。 - 請求項4において、
前記開口は、前記側壁に複数設けられた車載制御装置。 - 請求項2において、
前記側壁は、前記側面と対向する位置よりも前記板状部側のいずれかに前記開口として第一の開口を有し、
前記側面と対向する位置よりも前記板状部側のいずれかに前記開口として第一の開口を有する車載制御装置。 - 請求項6において、
前記第一の開口と前記第二の開口は、それぞれ複数設けられた車載制御装置。 - 請求項5または請求項7において、
前記回路基板は、前記開口と対向する位置に切り欠きを有する車載制御装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016041707A JP6634316B2 (ja) | 2016-03-04 | 2016-03-04 | 樹脂封止型車載制御装置 |
PCT/JP2017/003512 WO2017150053A1 (ja) | 2016-03-04 | 2017-02-01 | 樹脂封止型車載制御装置 |
DE112017000446.2T DE112017000446T5 (de) | 2016-03-04 | 2017-02-01 | Kunstharzversiegelte fahrzeugmontierte Steuervorrichtung |
CN201780007412.XA CN108476590B (zh) | 2016-03-04 | 2017-02-01 | 树脂封固型车载控制装置 |
US16/081,515 US10699917B2 (en) | 2016-03-04 | 2017-02-01 | Resin-sealed vehicle-mounted control device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016041707A JP6634316B2 (ja) | 2016-03-04 | 2016-03-04 | 樹脂封止型車載制御装置 |
Publications (2)
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JP2017157769A true JP2017157769A (ja) | 2017-09-07 |
JP6634316B2 JP6634316B2 (ja) | 2020-01-22 |
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JP2016041707A Active JP6634316B2 (ja) | 2016-03-04 | 2016-03-04 | 樹脂封止型車載制御装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10699917B2 (ja) |
JP (1) | JP6634316B2 (ja) |
CN (1) | CN108476590B (ja) |
DE (1) | DE112017000446T5 (ja) |
WO (1) | WO2017150053A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019110149A (ja) * | 2017-12-15 | 2019-07-04 | 株式会社ケーヒン | 電子制御装置 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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US10158357B1 (en) | 2016-04-05 | 2018-12-18 | Vlt, Inc. | Method and apparatus for delivering power to semiconductors |
US11336167B1 (en) | 2016-04-05 | 2022-05-17 | Vicor Corporation | Delivering power to semiconductor loads |
US10903734B1 (en) | 2016-04-05 | 2021-01-26 | Vicor Corporation | Delivering power to semiconductor loads |
US10785871B1 (en) | 2018-12-12 | 2020-09-22 | Vlt, Inc. | Panel molded electronic assemblies with integral terminals |
DE102021204069A1 (de) * | 2021-04-23 | 2022-10-27 | Vitesco Technologies GmbH | Leiterplattenbaugruppe und Steckverbindung |
DE102021121465A1 (de) * | 2021-08-18 | 2023-02-23 | Borgwarner Inc. | Leiterplattenverbindungsvorrichtung und Leiterplattenanordnung |
US11910544B2 (en) * | 2022-05-02 | 2024-02-20 | Vitesco Technologies USA, LLC | Assembly of printed circuit board with overmolded epoxy to baseplate |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4845406Y1 (ja) * | 1969-11-21 | 1973-12-27 | ||
JPH11150214A (ja) * | 1997-11-19 | 1999-06-02 | Nec Corp | 半導体集積回路装置及びその半導体ベアチップ実装方法 |
JP2010056355A (ja) * | 2008-08-29 | 2010-03-11 | Hitachi Ltd | トランスファーモールド型電子制御装置 |
JP2010199152A (ja) * | 2009-02-23 | 2010-09-09 | Denso Corp | 電子部品の成形封止方法及びそれによる電子部品 |
JP2013138129A (ja) * | 2011-12-28 | 2013-07-11 | Panasonic Corp | 半導体装置およびその製造方法 |
JP2014015080A (ja) * | 2012-07-06 | 2014-01-30 | Hitachi Automotive Systems Ltd | 車載用電子制御装置 |
JP2014203871A (ja) * | 2013-04-02 | 2014-10-27 | 三菱電機株式会社 | 半導体装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4845406U (ja) | 1971-09-30 | 1973-06-14 | ||
JP2000183277A (ja) * | 1998-12-17 | 2000-06-30 | Toshiba Corp | 半導体装置 |
JP2003332754A (ja) * | 2002-05-15 | 2003-11-21 | Internatl Business Mach Corp <Ibm> | 多層プリント配線板 |
JP4083652B2 (ja) * | 2003-09-19 | 2008-04-30 | 本田技研工業株式会社 | ガスセンサの制御装置 |
JP5146382B2 (ja) * | 2009-03-25 | 2013-02-20 | 株式会社デンソー | 電子装置の製造方法 |
EP2832281B1 (en) * | 2012-03-30 | 2017-07-12 | Olympus Corporation | Sealing structure and antenna device |
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Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4845406Y1 (ja) * | 1969-11-21 | 1973-12-27 | ||
JPH11150214A (ja) * | 1997-11-19 | 1999-06-02 | Nec Corp | 半導体集積回路装置及びその半導体ベアチップ実装方法 |
JP2010056355A (ja) * | 2008-08-29 | 2010-03-11 | Hitachi Ltd | トランスファーモールド型電子制御装置 |
JP2010199152A (ja) * | 2009-02-23 | 2010-09-09 | Denso Corp | 電子部品の成形封止方法及びそれによる電子部品 |
JP2013138129A (ja) * | 2011-12-28 | 2013-07-11 | Panasonic Corp | 半導体装置およびその製造方法 |
JP2014015080A (ja) * | 2012-07-06 | 2014-01-30 | Hitachi Automotive Systems Ltd | 車載用電子制御装置 |
JP2014203871A (ja) * | 2013-04-02 | 2014-10-27 | 三菱電機株式会社 | 半導体装置 |
Cited By (2)
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JP2019110149A (ja) * | 2017-12-15 | 2019-07-04 | 株式会社ケーヒン | 電子制御装置 |
JP7105061B2 (ja) | 2017-12-15 | 2022-07-22 | 日立Astemo株式会社 | 電子制御装置 |
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CN108476590B (zh) | 2020-08-04 |
US10699917B2 (en) | 2020-06-30 |
CN108476590A (zh) | 2018-08-31 |
DE112017000446T5 (de) | 2018-10-11 |
US20190080931A1 (en) | 2019-03-14 |
JP6634316B2 (ja) | 2020-01-22 |
WO2017150053A1 (ja) | 2017-09-08 |
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