JP2017147421A5 - - Google Patents
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- Publication number
- JP2017147421A5 JP2017147421A5 JP2016030463A JP2016030463A JP2017147421A5 JP 2017147421 A5 JP2017147421 A5 JP 2017147421A5 JP 2016030463 A JP2016030463 A JP 2016030463A JP 2016030463 A JP2016030463 A JP 2016030463A JP 2017147421 A5 JP2017147421 A5 JP 2017147421A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin composition
- layer
- interlayer insulation
- insulation layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000010410 layer Substances 0.000 claims 21
- 239000011342 resin composition Substances 0.000 claims 14
- 229920005989 resin Polymers 0.000 claims 11
- 239000011347 resin Substances 0.000 claims 11
- 239000011229 interlayer Substances 0.000 claims 10
- 238000009413 insulation Methods 0.000 claims 8
- 125000002723 alicyclic group Chemical group 0.000 claims 3
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims 3
- 239000003822 epoxy resin Substances 0.000 claims 3
- 239000013034 phenoxy resin Substances 0.000 claims 3
- 229920006287 phenoxy resin Polymers 0.000 claims 3
- 229920000647 polyepoxide Polymers 0.000 claims 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims 2
- -1 imidazole compound Chemical class 0.000 claims 2
- 239000011256 inorganic filler Substances 0.000 claims 2
- 229910003475 inorganic filler Inorganic materials 0.000 claims 2
- MEBONNVPKOBPEA-UHFFFAOYSA-N 1,1,2-trimethylcyclohexane Chemical group CC1CCCCC1(C)C MEBONNVPKOBPEA-UHFFFAOYSA-N 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 239000005062 Polybutadiene Substances 0.000 claims 1
- 150000001412 amines Chemical class 0.000 claims 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 239000012766 organic filler Substances 0.000 claims 1
- 125000002524 organometallic group Chemical group 0.000 claims 1
- 150000002989 phenols Chemical class 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- 229920006122 polyamide resin Polymers 0.000 claims 1
- 229920002857 polybutadiene Polymers 0.000 claims 1
- 125000002298 terpene group Chemical group 0.000 claims 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016030463A JP6808944B2 (ja) | 2016-02-19 | 2016-02-19 | 多層プリント配線板用の接着フィルム |
| PCT/JP2017/006044 WO2017142094A1 (ja) | 2016-02-19 | 2017-02-20 | 多層プリント配線板用の接着フィルム |
| TW106105565A TWI769148B (zh) | 2016-02-19 | 2017-02-20 | 樹脂組成物、層間絕緣層用樹脂膜、多層印刷配線板及半導體封裝體 |
| CN201780011793.9A CN108699408B (zh) | 2016-02-19 | 2017-02-20 | 多层印刷线路板用的粘接膜 |
| KR1020247002868A KR102864583B1 (ko) | 2016-02-19 | 2017-02-20 | 다층 프린트 배선판용의 접착 필름 |
| KR1020187023539A KR102704851B1 (ko) | 2016-02-19 | 2017-02-20 | 다층 프린트 배선판용의 접착 필름 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016030463A JP6808944B2 (ja) | 2016-02-19 | 2016-02-19 | 多層プリント配線板用の接着フィルム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017147421A JP2017147421A (ja) | 2017-08-24 |
| JP2017147421A5 true JP2017147421A5 (enExample) | 2019-03-28 |
| JP6808944B2 JP6808944B2 (ja) | 2021-01-06 |
Family
ID=59682424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016030463A Active JP6808944B2 (ja) | 2016-02-19 | 2016-02-19 | 多層プリント配線板用の接着フィルム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6808944B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7081323B2 (ja) * | 2018-06-19 | 2022-06-07 | 味の素株式会社 | 硬化体層、プリント配線板、半導体装置、樹脂シート、プリント配線板の製造方法、及び樹脂シートの製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5651941B2 (ja) * | 2008-10-07 | 2015-01-14 | 味の素株式会社 | エポキシ樹脂組成物 |
| TWI540170B (zh) * | 2009-12-14 | 2016-07-01 | Ajinomoto Kk | Resin composition |
| JP5728997B2 (ja) * | 2011-02-16 | 2015-06-03 | 日立化成株式会社 | 配線板用絶縁樹脂材料、多層配線板及び多層配線板の製造方法 |
| JP5864299B2 (ja) * | 2012-02-24 | 2016-02-17 | 味の素株式会社 | 樹脂組成物 |
| JP6183583B2 (ja) * | 2013-02-14 | 2017-08-23 | 味の素株式会社 | 硬化性樹脂組成物 |
| JP6307236B2 (ja) * | 2013-09-30 | 2018-04-04 | 新日鉄住金化学株式会社 | 硬化性樹脂組成物、硬化物、電気・電子部品及び回路基板材料 |
| JP6306864B2 (ja) * | 2013-11-28 | 2018-04-04 | パンパシフィック・カッパー株式会社 | スラグ水砕水のｐＨ調整方法及びその設備 |
| JP6398283B2 (ja) * | 2014-04-18 | 2018-10-03 | 味の素株式会社 | 樹脂組成物 |
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2016
- 2016-02-19 JP JP2016030463A patent/JP6808944B2/ja active Active