JP6808944B2 - 多層プリント配線板用の接着フィルム - Google Patents

多層プリント配線板用の接着フィルム Download PDF

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Publication number
JP6808944B2
JP6808944B2 JP2016030463A JP2016030463A JP6808944B2 JP 6808944 B2 JP6808944 B2 JP 6808944B2 JP 2016030463 A JP2016030463 A JP 2016030463A JP 2016030463 A JP2016030463 A JP 2016030463A JP 6808944 B2 JP6808944 B2 JP 6808944B2
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JP
Japan
Prior art keywords
resin
resin composition
insulating layer
interlayer insulating
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016030463A
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English (en)
Japanese (ja)
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JP2017147421A (ja
JP2017147421A5 (enExample
Inventor
雅晴 松浦
雅晴 松浦
郁夫 菅原
郁夫 菅原
廣幸 横島
廣幸 横島
喬之 鈴川
喬之 鈴川
祐貴 手塚
祐貴 手塚
入野 哲朗
哲朗 入野
加藤 亮
亮 加藤
健一 富岡
健一 富岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2016030463A priority Critical patent/JP6808944B2/ja
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to KR1020247002868A priority patent/KR102864583B1/ko
Priority to PCT/JP2017/006044 priority patent/WO2017142094A1/ja
Priority to TW106105565A priority patent/TWI769148B/zh
Priority to CN201780011793.9A priority patent/CN108699408B/zh
Priority to KR1020187023539A priority patent/KR102704851B1/ko
Publication of JP2017147421A publication Critical patent/JP2017147421A/ja
Publication of JP2017147421A5 publication Critical patent/JP2017147421A5/ja
Application granted granted Critical
Publication of JP6808944B2 publication Critical patent/JP6808944B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2016030463A 2016-02-19 2016-02-19 多層プリント配線板用の接着フィルム Active JP6808944B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2016030463A JP6808944B2 (ja) 2016-02-19 2016-02-19 多層プリント配線板用の接着フィルム
PCT/JP2017/006044 WO2017142094A1 (ja) 2016-02-19 2017-02-20 多層プリント配線板用の接着フィルム
TW106105565A TWI769148B (zh) 2016-02-19 2017-02-20 樹脂組成物、層間絕緣層用樹脂膜、多層印刷配線板及半導體封裝體
CN201780011793.9A CN108699408B (zh) 2016-02-19 2017-02-20 多层印刷线路板用的粘接膜
KR1020247002868A KR102864583B1 (ko) 2016-02-19 2017-02-20 다층 프린트 배선판용의 접착 필름
KR1020187023539A KR102704851B1 (ko) 2016-02-19 2017-02-20 다층 프린트 배선판용의 접착 필름

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016030463A JP6808944B2 (ja) 2016-02-19 2016-02-19 多層プリント配線板用の接着フィルム

Publications (3)

Publication Number Publication Date
JP2017147421A JP2017147421A (ja) 2017-08-24
JP2017147421A5 JP2017147421A5 (enExample) 2019-03-28
JP6808944B2 true JP6808944B2 (ja) 2021-01-06

Family

ID=59682424

Family Applications (1)

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JP2016030463A Active JP6808944B2 (ja) 2016-02-19 2016-02-19 多層プリント配線板用の接着フィルム

Country Status (1)

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JP (1) JP6808944B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7081323B2 (ja) * 2018-06-19 2022-06-07 味の素株式会社 硬化体層、プリント配線板、半導体装置、樹脂シート、プリント配線板の製造方法、及び樹脂シートの製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5651941B2 (ja) * 2008-10-07 2015-01-14 味の素株式会社 エポキシ樹脂組成物
TWI540170B (zh) * 2009-12-14 2016-07-01 Ajinomoto Kk Resin composition
JP5728997B2 (ja) * 2011-02-16 2015-06-03 日立化成株式会社 配線板用絶縁樹脂材料、多層配線板及び多層配線板の製造方法
JP5864299B2 (ja) * 2012-02-24 2016-02-17 味の素株式会社 樹脂組成物
JP6183583B2 (ja) * 2013-02-14 2017-08-23 味の素株式会社 硬化性樹脂組成物
JP6307236B2 (ja) * 2013-09-30 2018-04-04 新日鉄住金化学株式会社 硬化性樹脂組成物、硬化物、電気・電子部品及び回路基板材料
JP6306864B2 (ja) * 2013-11-28 2018-04-04 パンパシフィック・カッパー株式会社 スラグ水砕水のpH調整方法及びその設備
JP6398283B2 (ja) * 2014-04-18 2018-10-03 味の素株式会社 樹脂組成物

Also Published As

Publication number Publication date
JP2017147421A (ja) 2017-08-24

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