JP2017147422A5 - - Google Patents
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- Publication number
- JP2017147422A5 JP2017147422A5 JP2016030465A JP2016030465A JP2017147422A5 JP 2017147422 A5 JP2017147422 A5 JP 2017147422A5 JP 2016030465 A JP2016030465 A JP 2016030465A JP 2016030465 A JP2016030465 A JP 2016030465A JP 2017147422 A5 JP2017147422 A5 JP 2017147422A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin composition
- layer
- interlayer insulation
- insulation layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000010410 layer Substances 0.000 claims 21
- 239000011342 resin composition Substances 0.000 claims 17
- 229920005989 resin Polymers 0.000 claims 11
- 239000011347 resin Substances 0.000 claims 11
- 239000011229 interlayer Substances 0.000 claims 10
- 238000009413 insulation Methods 0.000 claims 8
- -1 phosphine compound Chemical class 0.000 claims 5
- 229910052698 phosphorus Inorganic materials 0.000 claims 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 4
- 239000011574 phosphorus Substances 0.000 claims 4
- 125000004432 carbon atom Chemical group C* 0.000 claims 3
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims 3
- 239000003822 epoxy resin Substances 0.000 claims 3
- 239000011256 inorganic filler Substances 0.000 claims 3
- 229910003475 inorganic filler Inorganic materials 0.000 claims 3
- 229920000647 polyepoxide Polymers 0.000 claims 3
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Natural products P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims 2
- 238000007259 addition reaction Methods 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 2
- 239000007795 chemical reaction product Substances 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 150000002148 esters Chemical class 0.000 claims 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N para-benzoquinone Natural products O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 claims 2
- 239000013034 phenoxy resin Substances 0.000 claims 2
- 229920006287 phenoxy resin Polymers 0.000 claims 2
- 229910000073 phosphorus hydride Inorganic materials 0.000 claims 2
- 239000000047 product Substances 0.000 claims 2
- 239000007787 solid Substances 0.000 claims 2
- 239000005062 Polybutadiene Substances 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 claims 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 125000004437 phosphorous atom Chemical group 0.000 claims 1
- 229920006122 polyamide resin Polymers 0.000 claims 1
- 229920002857 polybutadiene Polymers 0.000 claims 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016030465A JP6808945B2 (ja) | 2016-02-19 | 2016-02-19 | 多層プリント配線板用の接着フィルム |
| PCT/JP2017/006044 WO2017142094A1 (ja) | 2016-02-19 | 2017-02-20 | 多層プリント配線板用の接着フィルム |
| TW106105565A TWI769148B (zh) | 2016-02-19 | 2017-02-20 | 樹脂組成物、層間絕緣層用樹脂膜、多層印刷配線板及半導體封裝體 |
| CN201780011793.9A CN108699408B (zh) | 2016-02-19 | 2017-02-20 | 多层印刷线路板用的粘接膜 |
| KR1020247002868A KR102864583B1 (ko) | 2016-02-19 | 2017-02-20 | 다층 프린트 배선판용의 접착 필름 |
| KR1020187023539A KR102704851B1 (ko) | 2016-02-19 | 2017-02-20 | 다층 프린트 배선판용의 접착 필름 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016030465A JP6808945B2 (ja) | 2016-02-19 | 2016-02-19 | 多層プリント配線板用の接着フィルム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017147422A JP2017147422A (ja) | 2017-08-24 |
| JP2017147422A5 true JP2017147422A5 (enExample) | 2019-03-28 |
| JP6808945B2 JP6808945B2 (ja) | 2021-01-06 |
Family
ID=59681533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016030465A Active JP6808945B2 (ja) | 2016-02-19 | 2016-02-19 | 多層プリント配線板用の接着フィルム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6808945B2 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019157027A (ja) * | 2018-03-15 | 2019-09-19 | 日立化成株式会社 | 熱硬化性樹脂組成物、層間絶縁用樹脂フィルム、複合フィルム、プリント配線板及びその製造方法 |
| WO2019216247A1 (ja) * | 2018-05-09 | 2019-11-14 | 日立化成株式会社 | 支持体付き層間絶縁層用樹脂フィルム、多層プリント配線板及び多層プリント配線板の製造方法 |
| JP6589172B1 (ja) * | 2019-01-11 | 2019-10-16 | 吉川工業株式会社 | 積層鉄心 |
| CN110016206B (zh) * | 2019-03-18 | 2020-10-27 | 广东生益科技股份有限公司 | 一种树脂组合物、包含其的预浸料以及层压板和印制电路板 |
| KR20210048012A (ko) * | 2019-10-22 | 2021-05-03 | 주식회사 엘지화학 | 반도체용 접착제 조성물 및 이를 이용한 반도체용 접착 필름 |
| JP7676842B2 (ja) * | 2021-03-16 | 2025-05-15 | 東レ株式会社 | 積層体を用いた成型体の製造方法 |
| TWI856873B (zh) * | 2023-11-16 | 2024-09-21 | 南亞塑膠工業股份有限公司 | 低介電樹脂組成物 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011179008A (ja) * | 2000-06-22 | 2011-09-15 | Hitachi Chem Co Ltd | エポキシ樹脂組成物及び電子部品装置 |
| JP5987329B2 (ja) * | 2011-01-28 | 2016-09-07 | 味の素株式会社 | 樹脂ワニスの製造方法 |
| JP5728997B2 (ja) * | 2011-02-16 | 2015-06-03 | 日立化成株式会社 | 配線板用絶縁樹脂材料、多層配線板及び多層配線板の製造方法 |
| JP5864299B2 (ja) * | 2012-02-24 | 2016-02-17 | 味の素株式会社 | 樹脂組成物 |
| TWI602873B (zh) * | 2012-06-11 | 2017-10-21 | 味之素股份有限公司 | Resin composition |
| JP6343884B2 (ja) * | 2012-09-03 | 2018-06-20 | 味の素株式会社 | 硬化体、積層体、プリント配線板及び半導体装置 |
| JP6398283B2 (ja) * | 2014-04-18 | 2018-10-03 | 味の素株式会社 | 樹脂組成物 |
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2016
- 2016-02-19 JP JP2016030465A patent/JP6808945B2/ja active Active