JP2018188611A5 - - Google Patents
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- Publication number
- JP2018188611A5 JP2018188611A5 JP2017163515A JP2017163515A JP2018188611A5 JP 2018188611 A5 JP2018188611 A5 JP 2018188611A5 JP 2017163515 A JP2017163515 A JP 2017163515A JP 2017163515 A JP2017163515 A JP 2017163515A JP 2018188611 A5 JP2018188611 A5 JP 2018188611A5
- Authority
- JP
- Japan
- Prior art keywords
- hollow structure
- filler
- molding material
- gan
- sic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000945 filler Substances 0.000 claims 14
- 239000012778 molding material Substances 0.000 claims 9
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims 6
- 239000003795 chemical substances by application Substances 0.000 claims 5
- 239000003822 epoxy resin Substances 0.000 claims 5
- 229920000647 polyepoxide Polymers 0.000 claims 5
- 229920005989 resin Polymers 0.000 claims 4
- 239000011347 resin Substances 0.000 claims 4
- 238000007789 sealing Methods 0.000 claims 4
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims 3
- 125000004432 carbon atom Chemical group C* 0.000 claims 3
- 150000002430 hydrocarbons Chemical group 0.000 claims 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 238000000465 moulding Methods 0.000 claims 2
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 125000002947 alkylene group Chemical group 0.000 claims 1
- 125000005843 halogen group Chemical group 0.000 claims 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 150000002894 organic compounds Chemical class 0.000 claims 1
- 125000004430 oxygen atom Chemical group O* 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107121348A TWI696655B (zh) | 2017-08-28 | 2018-06-21 | SiC及GaN元件密封用成形材料組合物、電子零件裝置 |
| CN201880030381.4A CN110603294B (zh) | 2017-08-28 | 2018-06-21 | SiC和GaN元件密封用成型材料组合物、电子部件装置 |
| PCT/JP2018/023651 WO2019044133A1 (ja) | 2017-08-28 | 2018-06-21 | ＳｉＣ及びＧａＮ素子封止用成形材料組成物、電子部品装置 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017089980 | 2017-04-28 | ||
| JP2017089980 | 2017-04-28 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018188611A JP2018188611A (ja) | 2018-11-29 |
| JP2018188611A5 true JP2018188611A5 (enExample) | 2020-05-21 |
| JP6992967B2 JP6992967B2 (ja) | 2022-01-13 |
Family
ID=64478022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017163515A Active JP6992967B2 (ja) | 2017-04-28 | 2017-08-28 | 封止成形材料用組成物及び電子部品装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6992967B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3702390B1 (en) | 2017-10-27 | 2023-12-27 | ENEOS Corporation | Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device |
| US12441833B2 (en) | 2018-12-10 | 2025-10-14 | Eneos Corporation | Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device |
| CN111621152A (zh) * | 2019-02-28 | 2020-09-04 | 京瓷株式会社 | 元件密封用成型材料组合物及电子部件装置 |
| US12258472B2 (en) | 2019-04-26 | 2025-03-25 | Eneos Corporation | Composition for curable resins, cured product of said composition, production method for said composition and said cured product, and semiconductor device |
| JP7774943B2 (ja) * | 2023-01-18 | 2025-11-25 | 信越化学工業株式会社 | 熱硬化性マレイミド樹脂組成物、接着剤、プライマー、チップコード剤及び半導体装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6126837B2 (ja) | 2012-12-21 | 2017-05-10 | 株式会社日本触媒 | 液状硬化性樹脂組成物及びその用途 |
| JP6185342B2 (ja) | 2013-09-05 | 2017-08-23 | 信越化学工業株式会社 | 封止材積層複合体、封止後半導体素子搭載基板又は封止後半導体素子形成ウエハ、及び半導体装置の製造方法 |
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2017
- 2017-08-28 JP JP2017163515A patent/JP6992967B2/ja active Active
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