JP6992967B2 - 封止成形材料用組成物及び電子部品装置 - Google Patents

封止成形材料用組成物及び電子部品装置 Download PDF

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JP6992967B2
JP6992967B2 JP2017163515A JP2017163515A JP6992967B2 JP 6992967 B2 JP6992967 B2 JP 6992967B2 JP 2017163515 A JP2017163515 A JP 2017163515A JP 2017163515 A JP2017163515 A JP 2017163515A JP 6992967 B2 JP6992967 B2 JP 6992967B2
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JP2018188611A5 (enExample
JP2018188611A (ja
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尚紀 渡辺
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Kyocera Corp
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Kyocera Corp
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Priority to TW107121348A priority Critical patent/TWI696655B/zh
Priority to CN201880030381.4A priority patent/CN110603294B/zh
Priority to PCT/JP2018/023651 priority patent/WO2019044133A1/ja
Publication of JP2018188611A publication Critical patent/JP2018188611A/ja
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  • Sealing Material Composition (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2017163515A 2017-04-28 2017-08-28 封止成形材料用組成物及び電子部品装置 Active JP6992967B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW107121348A TWI696655B (zh) 2017-08-28 2018-06-21 SiC及GaN元件密封用成形材料組合物、電子零件裝置
CN201880030381.4A CN110603294B (zh) 2017-08-28 2018-06-21 SiC和GaN元件密封用成型材料组合物、电子部件装置
PCT/JP2018/023651 WO2019044133A1 (ja) 2017-08-28 2018-06-21 ＳｉＣ及びＧａＮ素子封止用成形材料組成物、電子部品装置

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JP2017089980 2017-04-28
JP2017089980 2017-04-28

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JP2018188611A JP2018188611A (ja) 2018-11-29
JP2018188611A5 JP2018188611A5 (enExample) 2020-05-21
JP6992967B2 true JP6992967B2 (ja) 2022-01-13

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3702390B1 (en) 2017-10-27 2023-12-27 ENEOS Corporation Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device
US12441833B2 (en) 2018-12-10 2025-10-14 Eneos Corporation Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device
CN111621152A (zh) * 2019-02-28 2020-09-04 京瓷株式会社 元件密封用成型材料组合物及电子部件装置
US12258472B2 (en) 2019-04-26 2025-03-25 Eneos Corporation Composition for curable resins, cured product of said composition, production method for said composition and said cured product, and semiconductor device
JP7774943B2 (ja) * 2023-01-18 2025-11-25 信越化学工業株式会社 熱硬化性マレイミド樹脂組成物、接着剤、プライマー、チップコード剤及び半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014122292A (ja) 2012-12-21 2014-07-03 Nippon Shokubai Co Ltd 液状硬化性樹脂組成物及びその用途
JP2015053341A (ja) 2013-09-05 2015-03-19 信越化学工業株式会社 封止材積層複合体、封止後半導体素子搭載基板又は封止後半導体素子形成ウエハ、半導体装置、及び半導体装置の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014122292A (ja) 2012-12-21 2014-07-03 Nippon Shokubai Co Ltd 液状硬化性樹脂組成物及びその用途
JP2015053341A (ja) 2013-09-05 2015-03-19 信越化学工業株式会社 封止材積層複合体、封止後半導体素子搭載基板又は封止後半導体素子形成ウエハ、半導体装置、及び半導体装置の製造方法

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