JP6808945B2 - 多層プリント配線板用の接着フィルム - Google Patents

多層プリント配線板用の接着フィルム Download PDF

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Publication number
JP6808945B2
JP6808945B2 JP2016030465A JP2016030465A JP6808945B2 JP 6808945 B2 JP6808945 B2 JP 6808945B2 JP 2016030465 A JP2016030465 A JP 2016030465A JP 2016030465 A JP2016030465 A JP 2016030465A JP 6808945 B2 JP6808945 B2 JP 6808945B2
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JP
Japan
Prior art keywords
resin
resin composition
mass
insulating layer
interlayer insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016030465A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017147422A (ja
JP2017147422A5 (enExample
Inventor
喬之 鈴川
喬之 鈴川
雅晴 松浦
雅晴 松浦
郁夫 菅原
郁夫 菅原
廣幸 横島
廣幸 横島
祐貴 手塚
祐貴 手塚
加藤 亮
亮 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2016030465A priority Critical patent/JP6808945B2/ja
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to KR1020247002868A priority patent/KR102864583B1/ko
Priority to PCT/JP2017/006044 priority patent/WO2017142094A1/ja
Priority to TW106105565A priority patent/TWI769148B/zh
Priority to CN201780011793.9A priority patent/CN108699408B/zh
Priority to KR1020187023539A priority patent/KR102704851B1/ko
Publication of JP2017147422A publication Critical patent/JP2017147422A/ja
Publication of JP2017147422A5 publication Critical patent/JP2017147422A5/ja
Application granted granted Critical
Publication of JP6808945B2 publication Critical patent/JP6808945B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2016030465A 2016-02-19 2016-02-19 多層プリント配線板用の接着フィルム Active JP6808945B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2016030465A JP6808945B2 (ja) 2016-02-19 2016-02-19 多層プリント配線板用の接着フィルム
PCT/JP2017/006044 WO2017142094A1 (ja) 2016-02-19 2017-02-20 多層プリント配線板用の接着フィルム
TW106105565A TWI769148B (zh) 2016-02-19 2017-02-20 樹脂組成物、層間絕緣層用樹脂膜、多層印刷配線板及半導體封裝體
CN201780011793.9A CN108699408B (zh) 2016-02-19 2017-02-20 多层印刷线路板用的粘接膜
KR1020247002868A KR102864583B1 (ko) 2016-02-19 2017-02-20 다층 프린트 배선판용의 접착 필름
KR1020187023539A KR102704851B1 (ko) 2016-02-19 2017-02-20 다층 프린트 배선판용의 접착 필름

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016030465A JP6808945B2 (ja) 2016-02-19 2016-02-19 多層プリント配線板用の接着フィルム

Publications (3)

Publication Number Publication Date
JP2017147422A JP2017147422A (ja) 2017-08-24
JP2017147422A5 JP2017147422A5 (enExample) 2019-03-28
JP6808945B2 true JP6808945B2 (ja) 2021-01-06

Family

ID=59681533

Family Applications (1)

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JP2016030465A Active JP6808945B2 (ja) 2016-02-19 2016-02-19 多層プリント配線板用の接着フィルム

Country Status (1)

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JP (1) JP6808945B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019157027A (ja) * 2018-03-15 2019-09-19 日立化成株式会社 熱硬化性樹脂組成物、層間絶縁用樹脂フィルム、複合フィルム、プリント配線板及びその製造方法
WO2019216247A1 (ja) * 2018-05-09 2019-11-14 日立化成株式会社 支持体付き層間絶縁層用樹脂フィルム、多層プリント配線板及び多層プリント配線板の製造方法
JP6589172B1 (ja) * 2019-01-11 2019-10-16 吉川工業株式会社 積層鉄心
CN110016206B (zh) * 2019-03-18 2020-10-27 广东生益科技股份有限公司 一种树脂组合物、包含其的预浸料以及层压板和印制电路板
KR20210048012A (ko) * 2019-10-22 2021-05-03 주식회사 엘지화학 반도체용 접착제 조성물 및 이를 이용한 반도체용 접착 필름
JP7676842B2 (ja) * 2021-03-16 2025-05-15 東レ株式会社 積層体を用いた成型体の製造方法
TWI856873B (zh) * 2023-11-16 2024-09-21 南亞塑膠工業股份有限公司 低介電樹脂組成物

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011179008A (ja) * 2000-06-22 2011-09-15 Hitachi Chem Co Ltd エポキシ樹脂組成物及び電子部品装置
JP5987329B2 (ja) * 2011-01-28 2016-09-07 味の素株式会社 樹脂ワニスの製造方法
JP5728997B2 (ja) * 2011-02-16 2015-06-03 日立化成株式会社 配線板用絶縁樹脂材料、多層配線板及び多層配線板の製造方法
JP5864299B2 (ja) * 2012-02-24 2016-02-17 味の素株式会社 樹脂組成物
TWI602873B (zh) * 2012-06-11 2017-10-21 味之素股份有限公司 Resin composition
JP6343884B2 (ja) * 2012-09-03 2018-06-20 味の素株式会社 硬化体、積層体、プリント配線板及び半導体装置
JP6398283B2 (ja) * 2014-04-18 2018-10-03 味の素株式会社 樹脂組成物

Also Published As

Publication number Publication date
JP2017147422A (ja) 2017-08-24

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