JP2017143679A - パワーモジュール - Google Patents

パワーモジュール Download PDF

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Publication number
JP2017143679A
JP2017143679A JP2016024419A JP2016024419A JP2017143679A JP 2017143679 A JP2017143679 A JP 2017143679A JP 2016024419 A JP2016024419 A JP 2016024419A JP 2016024419 A JP2016024419 A JP 2016024419A JP 2017143679 A JP2017143679 A JP 2017143679A
Authority
JP
Japan
Prior art keywords
lead
power module
package
module according
connection point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016024419A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017143679A5 (enExample
Inventor
哲次郎 角田
Tetsujiro Tsunoda
哲次郎 角田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2016024419A priority Critical patent/JP2017143679A/ja
Priority to US15/298,719 priority patent/US10389229B2/en
Priority to DE102017200440.1A priority patent/DE102017200440B4/de
Priority to CN201710078604.1A priority patent/CN107086802B/zh
Publication of JP2017143679A publication Critical patent/JP2017143679A/ja
Publication of JP2017143679A5 publication Critical patent/JP2017143679A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/32—Means for protecting converters other than automatic disconnection
    • H02M1/34—Snubber circuits
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H02M7/48—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49589—Capacitor integral with or on the leadframe
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H01L23/49844—Geometry or layout for individual devices of subclass H10D
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/18—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of the types provided for in two or more different main groups of the same subclass of H10B, H10D, H10F, H10H, H10K or H10N
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H3/00—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition with or without subsequent reconnection ; integrated protection
    • H02H3/20—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition with or without subsequent reconnection ; integrated protection responsive to excess voltage
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H02M7/48—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/53—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M7/537—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
    • H02M7/5387—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/32—Means for protecting converters other than automatic disconnection
    • H02M1/34—Snubber circuits
    • H02M1/346—Passive non-dissipative snubbers
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/32—Means for protecting converters other than automatic disconnection
    • H02M1/34—Snubber circuits
    • H02M1/348—Passive dissipative snubbers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B70/00—Technologies for an efficient end-user side electric power management and consumption
    • Y02B70/10—Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Geometry (AREA)
  • Inverter Devices (AREA)
  • Power Conversion In General (AREA)
  • Rectifiers (AREA)
JP2016024419A 2016-02-12 2016-02-12 パワーモジュール Pending JP2017143679A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016024419A JP2017143679A (ja) 2016-02-12 2016-02-12 パワーモジュール
US15/298,719 US10389229B2 (en) 2016-02-12 2016-10-20 Power module
DE102017200440.1A DE102017200440B4 (de) 2016-02-12 2017-01-12 Leistungsmodul
CN201710078604.1A CN107086802B (zh) 2016-02-12 2017-02-10 功率模块

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016024419A JP2017143679A (ja) 2016-02-12 2016-02-12 パワーモジュール

Publications (2)

Publication Number Publication Date
JP2017143679A true JP2017143679A (ja) 2017-08-17
JP2017143679A5 JP2017143679A5 (enExample) 2018-07-19

Family

ID=59410332

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016024419A Pending JP2017143679A (ja) 2016-02-12 2016-02-12 パワーモジュール

Country Status (4)

Country Link
US (1) US10389229B2 (enExample)
JP (1) JP2017143679A (enExample)
CN (1) CN107086802B (enExample)
DE (1) DE102017200440B4 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020255249A1 (ja) * 2019-06-18 2020-12-24 三菱電機株式会社 電力変換装置、冷凍サイクル装置および空気調和装置

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0368386U (enExample) * 1989-11-08 1991-07-04
JPH07122708A (ja) * 1993-10-28 1995-05-12 Fuji Electric Co Ltd 電力用半導体装置のパッケージ
JPH0833346A (ja) * 1994-07-20 1996-02-02 Nippondenso Co Ltd インバータ装置
JP2001144248A (ja) * 1999-11-12 2001-05-25 Fuji Electric Co Ltd 半導体モジュール
JP2001286158A (ja) * 2000-03-30 2001-10-12 Hitachi Ltd 半導体装置及び電力変換装置
JP2005094882A (ja) * 2003-09-16 2005-04-07 Toyota Motor Corp パワーモジュール
JP2007143336A (ja) * 2005-11-21 2007-06-07 Fuji Electric Device Technology Co Ltd 半導体装置
JP2014225706A (ja) * 2012-03-01 2014-12-04 三菱電機株式会社 電力用半導体モジュール及び電力変換装置
JP2015223047A (ja) * 2014-05-23 2015-12-10 三菱電機株式会社 半導体装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000058372A (ja) 1998-08-04 2000-02-25 Toshiba Corp セラミックコンデンサ実装構造
US7046518B2 (en) 2001-04-02 2006-05-16 International Rectifier Corporation Power module
JP2009219268A (ja) 2008-03-11 2009-09-24 Daikin Ind Ltd 電力変換装置
JP5169353B2 (ja) 2008-03-18 2013-03-27 三菱電機株式会社 パワーモジュール
JP5168603B2 (ja) 2010-01-26 2013-03-21 株式会社デンソー スイッチング装置
CN102906874B (zh) * 2010-05-21 2015-11-25 三菱电机株式会社 功率半导体模块
JP5280410B2 (ja) * 2010-06-21 2013-09-04 三菱電機株式会社 半導体装置、スナバデバイス
JP5351907B2 (ja) 2011-01-13 2013-11-27 アイシン・エィ・ダブリュ株式会社 半導体装置
DE102011076324B4 (de) 2011-05-24 2014-04-10 Semikron Elektronik Gmbh & Co. Kg Leistungselektronisches System mit Verbindungseinrichtung erster und zweiter Subsysteme
CN104704729B (zh) * 2013-10-02 2016-10-05 三菱电机株式会社 Cr缓冲电路
JP2018107858A (ja) * 2016-12-22 2018-07-05 富士電機株式会社 電力変換装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0368386U (enExample) * 1989-11-08 1991-07-04
JPH07122708A (ja) * 1993-10-28 1995-05-12 Fuji Electric Co Ltd 電力用半導体装置のパッケージ
JPH0833346A (ja) * 1994-07-20 1996-02-02 Nippondenso Co Ltd インバータ装置
JP2001144248A (ja) * 1999-11-12 2001-05-25 Fuji Electric Co Ltd 半導体モジュール
JP2001286158A (ja) * 2000-03-30 2001-10-12 Hitachi Ltd 半導体装置及び電力変換装置
JP2005094882A (ja) * 2003-09-16 2005-04-07 Toyota Motor Corp パワーモジュール
JP2007143336A (ja) * 2005-11-21 2007-06-07 Fuji Electric Device Technology Co Ltd 半導体装置
JP2014225706A (ja) * 2012-03-01 2014-12-04 三菱電機株式会社 電力用半導体モジュール及び電力変換装置
JP2015223047A (ja) * 2014-05-23 2015-12-10 三菱電機株式会社 半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020255249A1 (ja) * 2019-06-18 2020-12-24 三菱電機株式会社 電力変換装置、冷凍サイクル装置および空気調和装置
JPWO2020255249A1 (ja) * 2019-06-18 2021-11-25 三菱電機株式会社 電力変換装置、冷凍サイクル装置および空気調和装置
JP7170867B2 (ja) 2019-06-18 2022-11-14 三菱電機株式会社 電力変換装置、冷凍サイクル装置および空気調和装置

Also Published As

Publication number Publication date
DE102017200440A1 (de) 2017-08-17
DE102017200440B4 (de) 2025-01-09
CN107086802A (zh) 2017-08-22
US20170237335A1 (en) 2017-08-17
CN107086802B (zh) 2019-06-21
US10389229B2 (en) 2019-08-20

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