JP2017059818A5 - - Google Patents

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Publication number
JP2017059818A5
JP2017059818A5 JP2016142006A JP2016142006A JP2017059818A5 JP 2017059818 A5 JP2017059818 A5 JP 2017059818A5 JP 2016142006 A JP2016142006 A JP 2016142006A JP 2016142006 A JP2016142006 A JP 2016142006A JP 2017059818 A5 JP2017059818 A5 JP 2017059818A5
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JP
Japan
Prior art keywords
led package
package according
led
conductive portion
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016142006A
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English (en)
Japanese (ja)
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JP2017059818A (ja
JP6738224B2 (ja
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Publication date
Application filed filed Critical
Priority to US15/264,215 priority Critical patent/US10355183B2/en
Publication of JP2017059818A publication Critical patent/JP2017059818A/ja
Publication of JP2017059818A5 publication Critical patent/JP2017059818A5/ja
Application granted granted Critical
Publication of JP6738224B2 publication Critical patent/JP6738224B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2016142006A 2015-09-18 2016-07-20 Ｌｅｄパッケージ Active JP6738224B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US15/264,215 US10355183B2 (en) 2015-09-18 2016-09-13 LED package

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015185522 2015-09-18
JP2015185522 2015-09-18

Publications (3)

Publication Number Publication Date
JP2017059818A JP2017059818A (ja) 2017-03-23
JP2017059818A5 true JP2017059818A5 (enExample) 2019-06-20
JP6738224B2 JP6738224B2 (ja) 2020-08-12

Family

ID=58391824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016142006A Active JP6738224B2 (ja) 2015-09-18 2016-07-20 Ｌｅｄパッケージ

Country Status (1)

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JP (1) JP6738224B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6944660B2 (ja) * 2018-02-27 2021-10-06 東芝ライテック株式会社 車両用照明装置、および車両用灯具
US10461231B2 (en) * 2018-02-27 2019-10-29 Lumens Co., Ltd. Method for fabricating LED package
KR102094402B1 (ko) * 2018-08-24 2020-03-27 주식회사 케이티앤지 발광 소자 및 이를 포함하는 에어로졸 생성 장치
JP6675032B1 (ja) * 2019-07-08 2020-04-01 御田　護 半導体発光装置
KR102415673B1 (ko) * 2020-09-24 2022-07-05 주식회사 엠엘케이 초소형 led 플렉서블 서킷보드
JP7626947B2 (ja) 2022-06-24 2025-02-05 日亜化学工業株式会社 発光モジュール
KR20240075261A (ko) * 2022-11-22 2024-05-29 엘지디스플레이 주식회사 발광 다이오드 패키지와 그의 제조 방법, 및 발광 장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001338505A (ja) * 2000-05-26 2001-12-07 Matsushita Electric Works Ltd 照明装置
JP4789673B2 (ja) * 2005-10-27 2011-10-12 京セラ株式会社 発光素子収納用パッケージならびにこれを用いた光源および発光装置
JP5233170B2 (ja) * 2007-05-31 2013-07-10 日亜化学工業株式会社 発光装置、発光装置を構成する樹脂成形体及びそれらの製造方法
JP2009277705A (ja) * 2008-05-12 2009-11-26 Koa Corp パッケージ発光部品およびその製造法
JP2012015438A (ja) * 2010-07-05 2012-01-19 Citizen Holdings Co Ltd 半導体発光装置
KR20130098048A (ko) * 2012-02-27 2013-09-04 엘지이노텍 주식회사 발광소자 패키지
CN104752369B (zh) * 2013-12-27 2018-02-16 展晶科技(深圳)有限公司 光电元件模组

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