JP6738224B2 - Ｌｅｄパッケージ - Google Patents

Ｌｅｄパッケージ Download PDF

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Publication number
JP6738224B2
JP6738224B2 JP2016142006A JP2016142006A JP6738224B2 JP 6738224 B2 JP6738224 B2 JP 6738224B2 JP 2016142006 A JP2016142006 A JP 2016142006A JP 2016142006 A JP2016142006 A JP 2016142006A JP 6738224 B2 JP6738224 B2 JP 6738224B2
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JP
Japan
Prior art keywords
led package
package according
led
case
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP2016142006A
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English (en)
Japanese (ja)
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JP2017059818A (ja
JP2017059818A5 (enExample
Inventor
邦夫 岩城
邦夫 岩城
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to US15/264,215 priority Critical patent/US10355183B2/en
Publication of JP2017059818A publication Critical patent/JP2017059818A/ja
Publication of JP2017059818A5 publication Critical patent/JP2017059818A5/ja
Application granted granted Critical
Publication of JP6738224B2 publication Critical patent/JP6738224B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Led Device Packages (AREA)
JP2016142006A 2015-09-18 2016-07-20 Ｌｅｄパッケージ Active JP6738224B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US15/264,215 US10355183B2 (en) 2015-09-18 2016-09-13 LED package

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015185522 2015-09-18
JP2015185522 2015-09-18

Publications (3)

Publication Number Publication Date
JP2017059818A JP2017059818A (ja) 2017-03-23
JP2017059818A5 JP2017059818A5 (enExample) 2019-06-20
JP6738224B2 true JP6738224B2 (ja) 2020-08-12

Family

ID=58391824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016142006A Active JP6738224B2 (ja) 2015-09-18 2016-07-20 Ｌｅｄパッケージ

Country Status (1)

Country Link
JP (1) JP6738224B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6944660B2 (ja) * 2018-02-27 2021-10-06 東芝ライテック株式会社 車両用照明装置、および車両用灯具
US10461231B2 (en) * 2018-02-27 2019-10-29 Lumens Co., Ltd. Method for fabricating LED package
KR102094402B1 (ko) * 2018-08-24 2020-03-27 주식회사 케이티앤지 발광 소자 및 이를 포함하는 에어로졸 생성 장치
JP6675032B1 (ja) * 2019-07-08 2020-04-01 御田　護 半導体発光装置
KR102415673B1 (ko) * 2020-09-24 2022-07-05 주식회사 엠엘케이 초소형 led 플렉서블 서킷보드
JP7626947B2 (ja) 2022-06-24 2025-02-05 日亜化学工業株式会社 発光モジュール
KR20240075261A (ko) * 2022-11-22 2024-05-29 엘지디스플레이 주식회사 발광 다이오드 패키지와 그의 제조 방법, 및 발광 장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001338505A (ja) * 2000-05-26 2001-12-07 Matsushita Electric Works Ltd 照明装置
JP4789673B2 (ja) * 2005-10-27 2011-10-12 京セラ株式会社 発光素子収納用パッケージならびにこれを用いた光源および発光装置
JP5233170B2 (ja) * 2007-05-31 2013-07-10 日亜化学工業株式会社 発光装置、発光装置を構成する樹脂成形体及びそれらの製造方法
JP2009277705A (ja) * 2008-05-12 2009-11-26 Koa Corp パッケージ発光部品およびその製造法
JP2012015438A (ja) * 2010-07-05 2012-01-19 Citizen Holdings Co Ltd 半導体発光装置
KR20130098048A (ko) * 2012-02-27 2013-09-04 엘지이노텍 주식회사 발광소자 패키지
CN104752369B (zh) * 2013-12-27 2018-02-16 展晶科技(深圳)有限公司 光电元件模组

Also Published As

Publication number Publication date
JP2017059818A (ja) 2017-03-23

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