JP2017052078A5 - - Google Patents

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Publication number
JP2017052078A5
JP2017052078A5 JP2016125338A JP2016125338A JP2017052078A5 JP 2017052078 A5 JP2017052078 A5 JP 2017052078A5 JP 2016125338 A JP2016125338 A JP 2016125338A JP 2016125338 A JP2016125338 A JP 2016125338A JP 2017052078 A5 JP2017052078 A5 JP 2017052078A5
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JP
Japan
Prior art keywords
chemical mechanical
mechanical polishing
liquid component
polyols
molecular weight
Prior art date
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Granted
Application number
JP2016125338A
Other languages
English (en)
Japanese (ja)
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JP2017052078A (ja
JP6870928B2 (ja
Filing date
Publication date
Priority claimed from US14/751,340 external-priority patent/US9586305B2/en
Priority claimed from US15/163,152 external-priority patent/US9776300B2/en
Application filed filed Critical
Publication of JP2017052078A publication Critical patent/JP2017052078A/ja
Publication of JP2017052078A5 publication Critical patent/JP2017052078A5/ja
Application granted granted Critical
Publication of JP6870928B2 publication Critical patent/JP6870928B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2016125338A 2015-06-26 2016-06-24 ケミカルメカニカル研磨パッド及び同研磨パッドの製造方法 Active JP6870928B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US14/751,340 US9586305B2 (en) 2015-06-26 2015-06-26 Chemical mechanical polishing pad and method of making same
US14/751,340 2015-06-26
US15/163,152 2016-05-24
US15/163,152 US9776300B2 (en) 2015-06-26 2016-05-24 Chemical mechanical polishing pad and method of making same

Publications (3)

Publication Number Publication Date
JP2017052078A JP2017052078A (ja) 2017-03-16
JP2017052078A5 true JP2017052078A5 (enExample) 2019-07-18
JP6870928B2 JP6870928B2 (ja) 2021-05-12

Family

ID=57537165

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016125338A Active JP6870928B2 (ja) 2015-06-26 2016-06-24 ケミカルメカニカル研磨パッド及び同研磨パッドの製造方法

Country Status (7)

Country Link
US (1) US9776300B2 (enExample)
JP (1) JP6870928B2 (enExample)
KR (1) KR102477528B1 (enExample)
CN (1) CN107695868A (enExample)
DE (1) DE102016007775A1 (enExample)
FR (1) FR3037834B1 (enExample)
TW (1) TWI692494B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10092998B2 (en) 2015-06-26 2018-10-09 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making composite polishing layer for chemical mechanical polishing pad
US10144115B2 (en) 2015-06-26 2018-12-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making polishing layer for chemical mechanical polishing pad

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1916330A1 (de) 1969-03-29 1970-10-08 Richard Zippel & Co Kg Farbspr Anlage zur Herstellung von grossen oder kompliziert geformten Formteilen aus fluessigen Mehrkomponenten-Kunststoffen
US3705821A (en) 1970-08-07 1972-12-12 Bayer Ag Process and apparatus for applying polyurethane foam-forming composition
US3954544A (en) 1974-06-20 1976-05-04 Thomas Hooker Foam applying apparatus
DE2538437C3 (de) 1975-08-29 1980-05-08 Elastogran Maschinenbau Gmbh & Co, 8021 Strasslach Mischvorrichtung für Mehrkomponentenkunststoffe mit Poren- oder Zellenstruktur, insbesondere Polyurethan
US4158535A (en) 1977-01-25 1979-06-19 Olin Corporation Generation of polyurethane foam
US5163584A (en) 1990-12-18 1992-11-17 Polyfoam Products, Inc. Method and apparatus for mixing and dispensing foam with injected low pressure gas
US5789451A (en) * 1996-07-29 1998-08-04 The Dow Chemcial Company Alkanolamine/carbon dioxide adduct and polyurethane foam therewith
US6315820B1 (en) 1999-10-19 2001-11-13 Ford Global Technologies, Inc. Method of manufacturing thin metal alloy foils
EP1354913B1 (en) * 2000-12-08 2016-10-26 Kuraray Co., Ltd. Thermoplastic polyurethane foam, process for production thereof and polishing pads made of the foam
CN1318469C (zh) * 2002-11-18 2007-05-30 东省A&T株式会社 具有微孔的聚氨酯泡沫的制备方法和由此获得的抛光垫
CN100349267C (zh) * 2002-11-27 2007-11-14 东洋橡胶工业株式会社 研磨垫及半导体器件的制造方法
JP3776428B2 (ja) 2002-12-27 2006-05-17 株式会社加平 ポリウレタン発泡体シート及びそれを用いた積層体シートの製造方法
US20040224622A1 (en) * 2003-04-15 2004-11-11 Jsr Corporation Polishing pad and production method thereof
US20050171224A1 (en) * 2004-02-03 2005-08-04 Kulp Mary J. Polyurethane polishing pad
US20060089093A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
DE102005058292A1 (de) 2005-12-07 2007-06-14 Hennecke Gmbh Verfahren und Vorrichtung zur Herstellung von beschichteten Formteilen
CN102672630B (zh) * 2006-04-19 2015-03-18 东洋橡胶工业株式会社 抛光垫的制造方法
JP4954762B2 (ja) * 2007-03-27 2012-06-20 東洋ゴム工業株式会社 ポリウレタン発泡体の製造方法
US20090094900A1 (en) 2007-10-15 2009-04-16 Ppg Industries Ohio, Inc. Method of forming a polyurea polyurethane elastomer containing chemical mechanical polishing pad
US8551201B2 (en) * 2009-08-07 2013-10-08 Praxair S.T. Technology, Inc. Polyurethane composition for CMP pads and method of manufacturing same
US9144880B2 (en) * 2012-11-01 2015-09-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad
WO2014153048A1 (en) 2013-03-14 2014-09-25 Zte Wistron Telecom Ab Method and apparatus to adapt the number of harq processes in a distributed network topology
US9630293B2 (en) 2015-06-26 2017-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad composite polishing layer formulation
US10005172B2 (en) 2015-06-26 2018-06-26 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Controlled-porosity method for forming polishing pad
US9586305B2 (en) 2015-06-26 2017-03-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and method of making same
US10144115B2 (en) 2015-06-26 2018-12-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making polishing layer for chemical mechanical polishing pad
US9457449B1 (en) 2015-06-26 2016-10-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with composite polishing layer
US10105825B2 (en) 2015-06-26 2018-10-23 Rohm and Haas Electronics Materials CMP Holdings, Inc. Method of making polishing layer for chemical mechanical polishing pad
US9539694B1 (en) 2015-06-26 2017-01-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Composite polishing layer chemical mechanical polishing pad
US10092998B2 (en) 2015-06-26 2018-10-09 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making composite polishing layer for chemical mechanical polishing pad

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