JP2017036502A5 - - Google Patents
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- Publication number
- JP2017036502A5 JP2017036502A5 JP2016150622A JP2016150622A JP2017036502A5 JP 2017036502 A5 JP2017036502 A5 JP 2017036502A5 JP 2016150622 A JP2016150622 A JP 2016150622A JP 2016150622 A JP2016150622 A JP 2016150622A JP 2017036502 A5 JP2017036502 A5 JP 2017036502A5
- Authority
- JP
- Japan
- Prior art keywords
- photoresist
- substrate
- features
- copper
- pillars
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920002120 photoresistant polymer Polymers 0.000 claims description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 18
- 229910052802 copper Inorganic materials 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 12
- 239000000758 substrate Substances 0.000 description 21
- 238000007747 plating Methods 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 9
- 238000009713 electroplating Methods 0.000 description 8
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 230000005855 radiation Effects 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562201867P | 2015-08-06 | 2015-08-06 | |
| US62/201,867 | 2015-08-06 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017036502A JP2017036502A (ja) | 2017-02-16 |
| JP2017036502A5 true JP2017036502A5 (enExample) | 2018-01-18 |
| JP6278535B2 JP6278535B2 (ja) | 2018-02-14 |
Family
ID=56567498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016150622A Active JP6278535B2 (ja) | 2015-08-06 | 2016-07-29 | イミダゾール化合物と、ビスエポキシドと、ハロベンジル化合物との反応生成物を含有する電気銅めっき浴からフォトレジスト画定フィーチャを電気めっきする方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10006136B2 (enExample) |
| EP (1) | EP3128044B1 (enExample) |
| JP (1) | JP6278535B2 (enExample) |
| KR (1) | KR101779408B1 (enExample) |
| CN (1) | CN106435662B (enExample) |
| TW (1) | TWI600804B (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9932684B2 (en) * | 2015-08-06 | 2018-04-03 | Rohm And Haas Electronic Materials Llc | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides |
| US10190228B2 (en) * | 2016-03-29 | 2019-01-29 | Rohm And Haas Electronic Materials Llc | Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features |
| US10508349B2 (en) * | 2016-06-27 | 2019-12-17 | Rohm And Haas Electronic Materials Llc | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyrazole compounds and bisepoxides |
| TWI703148B (zh) * | 2017-11-08 | 2020-09-01 | 美商羅門哈斯電子材料有限公司 | 銅電鍍組合物及在基板上電鍍銅之方法 |
| TWI762731B (zh) | 2017-11-08 | 2022-05-01 | 美商羅門哈斯電子材料有限公司 | 銅電鍍組合物及在基板上電鍍銅之方法 |
| US20190259722A1 (en) * | 2018-02-21 | 2019-08-22 | Rohm And Haas Electronic Materials Llc | Copper pillars having improved integrity and methods of making the same |
| JP7533916B2 (ja) * | 2019-02-01 | 2024-08-14 | 石原ケミカル株式会社 | 電気銅メッキ又は銅合金メッキ浴 |
| US11946153B2 (en) | 2019-02-01 | 2024-04-02 | Ishihara Chemical Co., Ltd. | Copper or copper alloy electroplating bath |
| CN115894908B (zh) * | 2021-09-30 | 2025-06-06 | 华为技术有限公司 | 聚合物、整平剂及其制备方法、电镀液和电镀方法 |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52130437A (en) * | 1976-04-27 | 1977-11-01 | Dipsol Chem | Brightener in alkalline zinc plating bath |
| JPH04317798A (ja) * | 1991-04-15 | 1992-11-09 | Mitsubishi Kasei Polytec Co | 活性汚泥の異常現象防止剤及び異常現象防止方法 |
| JPH0997791A (ja) | 1995-09-27 | 1997-04-08 | Internatl Business Mach Corp <Ibm> | バンプ構造、バンプの形成方法、実装接続体 |
| US6578754B1 (en) | 2000-04-27 | 2003-06-17 | Advanpack Solutions Pte. Ltd. | Pillar connections for semiconductor chips and method of manufacture |
| US6610192B1 (en) | 2000-11-02 | 2003-08-26 | Shipley Company, L.L.C. | Copper electroplating |
| JP4392168B2 (ja) | 2001-05-09 | 2009-12-24 | 荏原ユージライト株式会社 | 銅めっき浴およびこれを用いる基板のめっき方法 |
| US7128822B2 (en) | 2003-06-04 | 2006-10-31 | Shipley Company, L.L.C. | Leveler compounds |
| US7276801B2 (en) | 2003-09-22 | 2007-10-02 | Intel Corporation | Designs and methods for conductive bumps |
| US7462942B2 (en) | 2003-10-09 | 2008-12-09 | Advanpack Solutions Pte Ltd | Die pillar structures and a method of their formation |
| TW200613586A (en) | 2004-07-22 | 2006-05-01 | Rohm & Haas Elect Mat | Leveler compounds |
| EP1741804B1 (en) | 2005-07-08 | 2016-04-27 | Rohm and Haas Electronic Materials, L.L.C. | Electrolytic copper plating method |
| US7829380B2 (en) | 2006-10-31 | 2010-11-09 | Qimonda Ag | Solder pillar bumping and a method of making the same |
| EP2199315B1 (en) | 2008-12-19 | 2013-12-11 | Basf Se | Composition for metal electroplating comprising leveling agent |
| US8262894B2 (en) | 2009-04-30 | 2012-09-11 | Moses Lake Industries, Inc. | High speed copper plating bath |
| US8592995B2 (en) | 2009-07-02 | 2013-11-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and structure for adhesion of intermetallic compound (IMC) on Cu pillar bump |
| JP5471276B2 (ja) | 2009-10-15 | 2014-04-16 | 上村工業株式会社 | 電気銅めっき浴及び電気銅めっき方法 |
| JP5952738B2 (ja) | 2009-11-27 | 2016-07-13 | ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ | 平滑化剤を含む金属電気メッキのための組成物 |
| US8268157B2 (en) | 2010-03-15 | 2012-09-18 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| EP2547731B1 (en) | 2010-03-18 | 2014-07-30 | Basf Se | Composition for metal electroplating comprising leveling agent |
| CN102939339B (zh) | 2010-06-01 | 2016-02-17 | 巴斯夫欧洲公司 | 包含流平试剂的金属电镀用组合物 |
| EP2392694A1 (en) * | 2010-06-02 | 2011-12-07 | ATOTECH Deutschland GmbH | Method for etching of copper and copper alloys |
| US8546254B2 (en) | 2010-08-19 | 2013-10-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Mechanisms for forming copper pillar bumps using patterned anodes |
| EP2465976B1 (en) * | 2010-12-15 | 2013-04-03 | Rohm and Haas Electronic Materials LLC | Method of electroplating uniform copper layer on the edge and walls of though holes of a substrate. |
| US8669137B2 (en) | 2011-04-01 | 2014-03-11 | International Business Machines Corporation | Copper post solder bumps on substrate |
| CN103547631B (zh) * | 2011-06-01 | 2016-07-06 | 巴斯夫欧洲公司 | 包含用于自下向上填充硅穿孔和互联件特征的添加剂的金属电镀用组合物 |
| US8454815B2 (en) | 2011-10-24 | 2013-06-04 | Rohm And Haas Electronics Materials Llc | Plating bath and method |
| TWI637467B (zh) | 2012-05-24 | 2018-10-01 | 欣興電子股份有限公司 | 中介基材及其製作方法 |
| US10204876B2 (en) | 2013-03-07 | 2019-02-12 | Maxim Integrated Products, Inc. | Pad defined contact for wafer level package |
| US9598787B2 (en) * | 2013-03-14 | 2017-03-21 | Rohm And Haas Electronic Materials Llc | Method of filling through-holes |
| US8957524B2 (en) | 2013-03-15 | 2015-02-17 | Globalfoundries Inc. | Pillar structure for use in packaging integrated circuit products and methods of making such a pillar structure |
| US9439294B2 (en) * | 2014-04-16 | 2016-09-06 | Rohm And Haas Electronic Materials Llc | Reaction products of heterocyclic nitrogen compounds polyepoxides and polyhalogens |
-
2016
- 2016-07-27 US US15/220,476 patent/US10006136B2/en active Active
- 2016-07-28 TW TW105123889A patent/TWI600804B/zh active
- 2016-07-29 JP JP2016150622A patent/JP6278535B2/ja active Active
- 2016-07-29 CN CN201610620653.9A patent/CN106435662B/zh active Active
- 2016-07-31 KR KR1020160097687A patent/KR101779408B1/ko active Active
- 2016-08-02 EP EP16182480.0A patent/EP3128044B1/en active Active
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