JP2017036501A5 - - Google Patents
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- Publication number
- JP2017036501A5 JP2017036501A5 JP2016150558A JP2016150558A JP2017036501A5 JP 2017036501 A5 JP2017036501 A5 JP 2017036501A5 JP 2016150558 A JP2016150558 A JP 2016150558A JP 2016150558 A JP2016150558 A JP 2016150558A JP 2017036501 A5 JP2017036501 A5 JP 2017036501A5
- Authority
- JP
- Japan
- Prior art keywords
- photoresist
- substrate
- feature
- features
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920002120 photoresistant polymer Polymers 0.000 claims description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 18
- 229910052802 copper Inorganic materials 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 12
- 239000000758 substrate Substances 0.000 description 21
- 238000007747 plating Methods 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 9
- 238000009713 electroplating Methods 0.000 description 8
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 230000005855 radiation Effects 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562201860P | 2015-08-06 | 2015-08-06 | |
| US62/201,860 | 2015-08-06 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017036501A JP2017036501A (ja) | 2017-02-16 |
| JP2017036501A5 true JP2017036501A5 (enExample) | 2017-12-14 |
| JP6322672B2 JP6322672B2 (ja) | 2018-05-09 |
Family
ID=56567497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016150558A Active JP6322672B2 (ja) | 2015-08-06 | 2016-07-29 | アルファアミノ酸とビスエポキシドとの反応生成物を含有する電気銅めっき浴からフォトレジスト画定フィーチャを電気めっきする方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9932684B2 (enExample) |
| EP (1) | EP3128043B1 (enExample) |
| JP (1) | JP6322672B2 (enExample) |
| KR (1) | KR101799857B1 (enExample) |
| CN (1) | CN106435661B (enExample) |
| TW (1) | TWI618820B (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI608132B (zh) * | 2015-08-06 | 2017-12-11 | 羅門哈斯電子材料有限公司 | 自含有吡啶基烷基胺及雙環氧化物之反應產物的銅電鍍覆浴液電鍍覆光阻劑限定之特徵的方法 |
| US10190228B2 (en) * | 2016-03-29 | 2019-01-29 | Rohm And Haas Electronic Materials Llc | Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features |
| US10508349B2 (en) * | 2016-06-27 | 2019-12-17 | Rohm And Haas Electronic Materials Llc | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyrazole compounds and bisepoxides |
| US10711360B2 (en) * | 2017-07-14 | 2020-07-14 | Rohm And Haas Electronic Materials Llc | Nickel electroplating compositions with copolymers of arginine and bisepoxides and methods of electroplating nickel |
| US20190259722A1 (en) * | 2018-02-21 | 2019-08-22 | Rohm And Haas Electronic Materials Llc | Copper pillars having improved integrity and methods of making the same |
| CN111108235B (zh) * | 2018-08-28 | 2022-05-03 | 株式会社杰希优 | 电镀铜浴 |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4356277A (en) * | 1977-03-08 | 1982-10-26 | Ppg Industries, Inc. | Reaction products of a polyglycidyl ether of a polyphenol and an amino acid and aqueous solubilized products therefrom |
| JPH0997791A (ja) | 1995-09-27 | 1997-04-08 | Internatl Business Mach Corp <Ibm> | バンプ構造、バンプの形成方法、実装接続体 |
| JP2000119233A (ja) * | 1998-08-12 | 2000-04-25 | Ajinomoto Co Inc | 新規ポリアミノ酸誘導体 |
| JP4559635B2 (ja) * | 1999-01-21 | 2010-10-13 | ケムガード・インコーポレーテッド | ペルフルオロアルキル置換アミノ酸オリゴマーまたはポリマー、ならびに水性消火泡剤中の泡安定剤としておよび撥油紙および織物の仕上げ剤としてのその使用 |
| US6578754B1 (en) | 2000-04-27 | 2003-06-17 | Advanpack Solutions Pte. Ltd. | Pillar connections for semiconductor chips and method of manufacture |
| US6610192B1 (en) | 2000-11-02 | 2003-08-26 | Shipley Company, L.L.C. | Copper electroplating |
| US6800188B2 (en) | 2001-05-09 | 2004-10-05 | Ebara-Udylite Co., Ltd. | Copper plating bath and plating method for substrate using the copper plating bath |
| JP4809546B2 (ja) | 2001-06-07 | 2011-11-09 | 石原薬品株式会社 | 有機溶媒を用いたボイドフリー銅メッキ方法 |
| CN1410601A (zh) * | 2001-09-27 | 2003-04-16 | 长春石油化学股份有限公司 | 用于铜集成电路内连线的铜电镀液组合物 |
| JP2003171464A (ja) * | 2001-12-06 | 2003-06-20 | Chisso Corp | ポリリジン及びその製造方法 |
| US7128822B2 (en) | 2003-06-04 | 2006-10-31 | Shipley Company, L.L.C. | Leveler compounds |
| US7276801B2 (en) | 2003-09-22 | 2007-10-02 | Intel Corporation | Designs and methods for conductive bumps |
| US7462942B2 (en) | 2003-10-09 | 2008-12-09 | Advanpack Solutions Pte Ltd | Die pillar structures and a method of their formation |
| JP2005272874A (ja) * | 2004-03-23 | 2005-10-06 | Sumitomo Bakelite Co Ltd | 回路基板の製造方法 |
| TW200613586A (en) * | 2004-07-22 | 2006-05-01 | Rohm & Haas Elect Mat | Leveler compounds |
| EP1741804B1 (en) * | 2005-07-08 | 2016-04-27 | Rohm and Haas Electronic Materials, L.L.C. | Electrolytic copper plating method |
| US7662981B2 (en) * | 2005-07-16 | 2010-02-16 | Rohm And Haas Electronic Materials Llc | Leveler compounds |
| US7829380B2 (en) | 2006-10-31 | 2010-11-09 | Qimonda Ag | Solder pillar bumping and a method of making the same |
| JP2008291287A (ja) | 2007-05-22 | 2008-12-04 | Nippon New Chrome Kk | 耐連続衝撃性に優れた銅−錫合金めっき製品の製造方法 |
| EP2199315B1 (en) | 2008-12-19 | 2013-12-11 | Basf Se | Composition for metal electroplating comprising leveling agent |
| US8262894B2 (en) | 2009-04-30 | 2012-09-11 | Moses Lake Industries, Inc. | High speed copper plating bath |
| US8592995B2 (en) | 2009-07-02 | 2013-11-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and structure for adhesion of intermetallic compound (IMC) on Cu pillar bump |
| JP5471276B2 (ja) | 2009-10-15 | 2014-04-16 | 上村工業株式会社 | 電気銅めっき浴及び電気銅めっき方法 |
| MY156200A (en) * | 2009-11-27 | 2016-01-29 | Basf Se | Composition for metal electroplating comprising leveling agent |
| US8268157B2 (en) | 2010-03-15 | 2012-09-18 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| SG183821A1 (en) | 2010-03-18 | 2012-10-30 | Basf Se | Composition for metal electroplating comprising leveling agent |
| KR101891473B1 (ko) | 2010-06-01 | 2018-08-27 | 바스프 에스이 | 레벨링제를 포함하는 금속 전기도금용 조성물 |
| US8546254B2 (en) | 2010-08-19 | 2013-10-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Mechanisms for forming copper pillar bumps using patterned anodes |
| EP2465976B1 (en) * | 2010-12-15 | 2013-04-03 | Rohm and Haas Electronic Materials LLC | Method of electroplating uniform copper layer on the edge and walls of though holes of a substrate. |
| US8669137B2 (en) | 2011-04-01 | 2014-03-11 | International Business Machines Corporation | Copper post solder bumps on substrate |
| US8454815B2 (en) | 2011-10-24 | 2013-06-04 | Rohm And Haas Electronics Materials Llc | Plating bath and method |
| TWI637467B (zh) | 2012-05-24 | 2018-10-01 | 欣興電子股份有限公司 | 中介基材及其製作方法 |
| US10204876B2 (en) | 2013-03-07 | 2019-02-12 | Maxim Integrated Products, Inc. | Pad defined contact for wafer level package |
| US8957524B2 (en) | 2013-03-15 | 2015-02-17 | Globalfoundries Inc. | Pillar structure for use in packaging integrated circuit products and methods of making such a pillar structure |
| US10006136B2 (en) * | 2015-08-06 | 2018-06-26 | Dow Global Technologies Llc | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds |
| TWI608132B (zh) * | 2015-08-06 | 2017-12-11 | 羅門哈斯電子材料有限公司 | 自含有吡啶基烷基胺及雙環氧化物之反應產物的銅電鍍覆浴液電鍍覆光阻劑限定之特徵的方法 |
-
2016
- 2016-07-27 US US15/220,472 patent/US9932684B2/en active Active
- 2016-07-28 TW TW105123888A patent/TWI618820B/zh active
- 2016-07-29 CN CN201610619284.1A patent/CN106435661B/zh active Active
- 2016-07-29 JP JP2016150558A patent/JP6322672B2/ja active Active
- 2016-07-31 KR KR1020160097686A patent/KR101799857B1/ko active Active
- 2016-08-02 EP EP16182479.2A patent/EP3128043B1/en active Active
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