JP2017011170A - 半導体チップおよびそれを用いた半導体モジュール - Google Patents
半導体チップおよびそれを用いた半導体モジュール Download PDFInfo
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- JP2017011170A JP2017011170A JP2015126785A JP2015126785A JP2017011170A JP 2017011170 A JP2017011170 A JP 2017011170A JP 2015126785 A JP2015126785 A JP 2015126785A JP 2015126785 A JP2015126785 A JP 2015126785A JP 2017011170 A JP2017011170 A JP 2017011170A
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Abstract
【解決手段】ゲート電極と電気的に接続される第1制御パッド71と、スイッチング素子11a〜16aのオン時に、第1制御パッド71との間に制御電流を流す電流経路を構成する第2制御パッド72とを備え、第1制御パッド71および第2制御パッド71は、いずれか一方の制御パッドが他方の制御パッドに挟まれて配置されるようにする。これによれば、制御電流が第2制御パッド72から第1制御パッド71に流れるように、制御端子を第1制御パッド71および第2制御パッド72に接続できる。したがって、制御電流によってスイッチング素子が誤作動することを抑制できる。
【選択図】図3
Description
本発明の第1実施形態について説明する。本実施形態では、本発明を三相モータ駆動用のインバータを構成する半導体モジュールに適用した例について説明する。
本発明の第2実施形態について説明する。本実施形態は、第1実施形態に対して、半導体チップ21a、21bにケルビンエミッタパッド72を1つ備えると共に当該ケルビンエミッタパッド72を挟むように2つのゲートパッド71を備えるものであり、その他に関しては第1実施形態と同様であるため、ここでは説明を省略する。
本発明の第3実施形態について説明する。本実施形態は、第1実施形態に対して、IGBT素子11a、12aとFWD素子11b、12bとを異なるチップに形成したものであり、その他に関しては第1実施形態と同様であるため、ここでは説明を省略する。
本発明は上記した実施形態に限定されるものではなく、特許請求の範囲に記載した範囲内において適宜変更が可能である。
57 ゲート電極
71 ゲートパッド(第1制御パッド)
72 ケルビンエミッタパッド(第2制御パッド)
Claims (3)
- 複数のパッド(71、72)と、
ゲート電極(57)を有するスイッチング素子(11a〜16a)と、を備える半導体チップにおいて、
前記複数のパッドは、
前記ゲート電極と電気的に接続され、前記スイッチング素子のオン、オフを制御する電圧が印加される第1制御パッド(71)と、
前記スイッチング素子のオン時に、前記第1制御パッドとの間に制御電流を流す電流経路を構成する第2制御パッド(72)と、を有し、
前記第1制御パッドおよび前記第2制御パッドは、いずれか一方の制御パッドが他方の制御パッドに挟まれて配置されていることを特徴とする半導体チップ。 - ゲート電極(57)を有するスイッチング素子(11a、13a、15a)が形成され、表面に第1主パッド(59)が形成されていると共に複数の制御パッド(71、72)が隣り合って形成され、裏面に第2主パッド(63)が形成されており、上アームを構成する第1半導体チップ(21a)と、
ゲート電極(57)を有するスイッチング素子(12a、14a、16a)が形成されていると共に前記第1半導体チップと共通の構成とされ、前記第1半導体チップと隣り合って配置されており、下アームを構成する第2半導体チップ(21b)と、
前記第1半導体チップの第2主パッドと電気的に接続される正極端子(22)と、
前記第2半導体チップの第1主パッドと電気的に接続される負極端子(24)と、
前記第1半導体チップの第1主パッドおよび前記第2半導体チップの第2主パッドと電気的に接続されることにより、前記上アームおよび前記下アームの中間電位とされた出力端子(23)と、
前記複数の制御パッドと接続される複数の制御端子(25a、25b、26a、26b)と、を備え、
前記第1半導体チップおよび前記第2半導体チップの表面に対する法線方向から視たとき、前記正極端子、前記負極端子、前記出力端子は、前記第1半導体チップおよび第2半導体チップに対して同方向に延設されていると共に、前記正極端子と前記出力端子との間に前記負極端子が配置され、
前記複数の制御パッドは、前記ゲート電極と電気的に接続され、前記スイッチング素子のオン、オフを制御する電圧が印加される第1制御パッド(71)と、
前記スイッチング素子のオン時に、前記第1制御パッドとの間に制御電流を流す電流経路を構成する第2制御パッド(72)と、を有し、
前記第1制御パッドおよび前記第2制御パッドは、いずれか一方の制御パッドが他方の制御パッドに挟まれて配置されており、
前記制御端子は、前記第1制御パッドと接続される第1制御端子と、前記第2制御パッドと接続される第2制御端子と、を有し、
前記第1制御端子および第2制御端子は、前記制御電流が前記第2制御端子から前記第1制御端子に向かって流れるように、前記第1半導体チップおよび前記第2半導体チップにおける前記第1制御パッドおよび前記第2制御パッドとそれぞれ電気的に接続されていることを特徴とする半導体モジュール。 - 前記第1半導体チップと接続される前記第1制御端子および前記第2制御端子の配列と、前記第2半導体チップと接続される前記第1制御端子および前記第2制御端子の配列とが反対とされていることを特徴とする請求項2に記載の半導体モジュール。
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JP2015126785A JP6256419B2 (ja) | 2015-06-24 | 2015-06-24 | 半導体チップおよびそれを用いた半導体モジュール |
CN201680036701.8A CN107750392B (zh) | 2015-06-24 | 2016-05-27 | 半导体芯片以及使用了该半导体芯片的半导体模块 |
PCT/JP2016/002581 WO2016208122A1 (ja) | 2015-06-24 | 2016-05-27 | 半導体チップおよびそれを用いた半導体モジュール |
US15/570,876 US10256212B2 (en) | 2015-06-24 | 2016-05-27 | Semiconductor chip having multiple pads and semiconductor module including the same |
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WO2018131276A1 (ja) * | 2017-01-16 | 2018-07-19 | 株式会社デンソー | 半導体装置 |
JP2019140157A (ja) * | 2018-02-06 | 2019-08-22 | トヨタ自動車株式会社 | 半導体装置 |
JP2019140175A (ja) * | 2018-02-07 | 2019-08-22 | トヨタ自動車株式会社 | 半導体モジュール |
JP2019201159A (ja) * | 2018-05-18 | 2019-11-21 | 富士電機株式会社 | 逆導通型半導体装置 |
JP2021034525A (ja) * | 2019-08-22 | 2021-03-01 | 株式会社デンソー | 半導体モジュール |
WO2021065259A1 (ja) * | 2019-10-01 | 2021-04-08 | 株式会社デンソー | 半導体装置 |
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JP7010167B2 (ja) * | 2018-07-25 | 2022-01-26 | 株式会社デンソー | 半導体装置 |
US11342257B2 (en) * | 2020-01-22 | 2022-05-24 | Delta Electronics (Shanghai) Co., Ltd. | Carrier board and power module using same |
US11350519B2 (en) | 2020-01-22 | 2022-05-31 | Delta Electronics (Shanghai) Co., Ltd. | Power module |
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JP2015015301A (ja) * | 2013-07-03 | 2015-01-22 | 株式会社デンソー | 半導体装置 |
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JP2013149684A (ja) * | 2012-01-17 | 2013-08-01 | Denso Corp | 半導体装置及びその製造方法 |
JP2014099444A (ja) * | 2012-11-13 | 2014-05-29 | Renesas Electronics Corp | 半導体装置 |
JP2015015301A (ja) * | 2013-07-03 | 2015-01-22 | 株式会社デンソー | 半導体装置 |
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WO2018131276A1 (ja) * | 2017-01-16 | 2018-07-19 | 株式会社デンソー | 半導体装置 |
JP2018117419A (ja) * | 2017-01-16 | 2018-07-26 | 株式会社デンソー | 半導体装置 |
JP2019140157A (ja) * | 2018-02-06 | 2019-08-22 | トヨタ自動車株式会社 | 半導体装置 |
JP7119399B2 (ja) | 2018-02-06 | 2022-08-17 | 株式会社デンソー | 半導体装置 |
JP2019140175A (ja) * | 2018-02-07 | 2019-08-22 | トヨタ自動車株式会社 | 半導体モジュール |
JP7010036B2 (ja) | 2018-02-07 | 2022-01-26 | 株式会社デンソー | 半導体モジュール |
JP2019201159A (ja) * | 2018-05-18 | 2019-11-21 | 富士電機株式会社 | 逆導通型半導体装置 |
JP7106981B2 (ja) | 2018-05-18 | 2022-07-27 | 富士電機株式会社 | 逆導通型半導体装置 |
JP2021034525A (ja) * | 2019-08-22 | 2021-03-01 | 株式会社デンソー | 半導体モジュール |
WO2021065259A1 (ja) * | 2019-10-01 | 2021-04-08 | 株式会社デンソー | 半導体装置 |
JP2021057534A (ja) * | 2019-10-01 | 2021-04-08 | 株式会社デンソー | 半導体装置 |
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US10256212B2 (en) | 2019-04-09 |
US20180294250A1 (en) | 2018-10-11 |
CN107750392A (zh) | 2018-03-02 |
WO2016208122A1 (ja) | 2016-12-29 |
CN107750392B (zh) | 2020-04-28 |
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