JP2016540249A - 透過率可変フィルムおよびその製造方法 - Google Patents
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Abstract
Description
透過率変化度(%)=最終透過率(%)−初期透過率(%)
本発明の一具現例によれば、透明基材と、前記透明基材の上部に形成される線電極と、前記線電極の上部に形成される絶縁層と、前記線電極の両側に位置する複数の隔壁と、前記複数の隔壁の上部に形成される透明電極と、前記複数の隔壁、絶縁層、および透明電極により囲まれて形成されるセルと、前記セルの内部に含まれる帯電粒子流体と、を含み、前記絶縁層が0.4μm〜1μmの厚さに形成されている、透過率可変フィルムを提供する。
透過率変化度(%)=最終透過率(%)−初期透過率(%)
本発明の他の具現例によれば、透明基材を準備するステップと、前記透明基材上に印刷(printing)またはエッチング(etching)工程により線電極を形成するステップと、前記透明基材および線電極上に、ロール(roll)工程により絶縁層と複数の隔壁を一体に形成するステップと、前記絶縁層および複数の隔壁を硬化させるステップと、前記複数の隔壁の上部に透明電極を形成するステップと、前記複数の隔壁、絶縁層、および透明電極により囲まれて形成されるセルに帯電粒子流体を注入するステップと、を含み、前記絶縁層が0.4μm〜1μmの厚さに形成される、透過率可変フィルムの製造方法を提供する。
(実施例1)
透明基材として、厚さが120μmのポリエチレンテレフタレート(PET)フィルムを準備した。次いで、前記透明基材の上部に銀粉末を含有するインク溶液をジェッティングしてメタル‐メッシュパターンを印刷することで、線電極を形成した。次いで、複数の隔壁構造がデザインされているインプリンティングモールドが巻かれたロールに、無溶剤型のウレタンアクリレートを含む樹脂を塗布した後、前記透明基材および線電極の上部にローリングすることで、厚さ0.4μmの絶縁層と複数の隔壁を一体に形成した。次いで、前記絶縁層および隔壁を約350mJ/cm2のエネルギーで光硬化させた。次いで、前記複数の隔壁上にインジウム‐スズ酸化物(ITO)を含む透明電極を積層した。その後、前記複数の隔壁、絶縁層、および透明電極により囲まれて形成されるセルの内部に、ノルマルドデカンを含む炭化水素系媒体に(−)電荷を有する複数の帯電粒子が分散された帯電粒子流体を注入することで、透過率可変フィルムを製造した。
厚さ0.8μmの絶縁層を製造したことを除き、実施例1と同様にして透過率可変フィルムを製造した。
厚さ1μmの絶縁層を製造したことを除き、実施例1と同様にして透過率可変フィルムを製造した。
厚さ2μmの絶縁層を製造したことを除き、実施例1と同様にして透過率可変フィルムを製造した。
厚さ3μmの絶縁層を製造したことを除き、比較例1と同様にして透過率可変フィルムを製造した。
(実験例1:透過率変化度の測定)
前記実施例1〜3および比較例1〜2の透過率可変フィルムに対して、透過率測定装置(BYK社製、「haze‐gard plus」)を用いて、500nmの波長で初期透過率および最終透過率を測定し、下記一般式1により透過率変化度を計算して下記表1に示す。前記初期透過率は、電圧を印加する前の透過率可変フィルムの透過率であり、前記最終透過率は、約40Vの電圧を印加した後の透過率可変フィルムの透過率である。
透過率変化度(%)=最終透過率(%)−初期透過率(%)
110 透明基材
120 線電極
130 絶縁層
140 隔壁
150 透明電極
160 セル
170 帯電粒子流体
171 炭化水素系媒体
172 帯電粒子
d1 透明基材の厚さ
d2 隔壁の幅
d3 隔壁の間隔
d4 隔壁の高さ
Claims (14)
- 透明基材と、
前記透明基材の上部に形成される線電極と、
前記線電極の上部に形成される絶縁層と、
前記線電極の両側に位置する複数の隔壁と、
前記複数の隔壁の上部に形成される透明電極と、
前記複数の隔壁、絶縁層、および透明電極により囲まれて形成されるセルと、
前記セルの内部に含まれる帯電粒子流体と、を含み、
前記絶縁層は0.4μm〜1μmの厚さに形成される、透過率可変フィルム。 - 前記絶縁層および隔壁は、一体化となって同一の材質を含む、請求項1に記載の透過率可変フィルム。
- 前記絶縁層および隔壁は、ウレタンアクリレート、エポキシアクリレート、ポリエステルアクリレート、ポリエーテル、およびこれらの組み合わせからなる群から選択された1つ以上を含む、請求項1に記載の透過率可変フィルム。
- 前記線電極は、銀、銅、またはアルミニウムを含むメタル‐メッシュ(Metal‐mesh)で形成される、請求項1に記載の透過率可変フィルム。
- 前記メタル‐メッシュは、線幅が2μm〜20μmであり、線間隔が40μm〜300μmである、請求項4に記載の透過率可変フィルム。
- 前記透明基材は、ポリエチレンテレフタレート(PET)、ポリビニルクロライド(PVC)、熱可塑性ポリウレタン(TPU)、およびこれらの組み合わせからなる群から選択された1つ以上を含む、請求項1に記載の透過率可変フィルム。
- 前記帯電粒子流体は、炭化水素系媒体に複数の帯電粒子が分散されているものである、請求項1に記載の透過率可変フィルム。
- 前記炭化水素系媒体は、ノルマルドデカン(n‐dodecane)、メチルメタクリレート(Methylmethacrylate、MMA)、ウンデカン(undecane)、およびこれらの組み合わせからなる群から選択された1つ以上を含む、請求項7に記載の透過率可変フィルム。
- 前記複数の帯電粒子は、互いに同一の電荷を有する、請求項7に記載の透過率可変フィルム。
- 前記透明電極は、インジウム‐スズ酸化物(ITO)、フッ素‐スズ酸化物(FTO)、アルミニウム‐亜鉛酸化物(AZO)、またはガリウム‐亜鉛酸化物(GZO)を含む、請求項1に記載の透過率可変フィルム。
- 前記透過率可変フィルムは、下記一般式1により計算された透過率変化度が20%〜70%である、請求項1に記載の透過率可変フィルム。
[一般式1]
透過率変化度(%)=最終透過率(%)−初期透過率(%) - 透明基材を準備するステップと、
前記透明基材上に印刷(printing)またはエッチング(etching)工程により線電極を形成するステップと、
前記透明基材および線電極上に、ロール(roll)工程により絶縁層と複数の隔壁を一体に形成するステップと、
前記絶縁層および複数の隔壁を硬化させるステップと、
前記複数の隔壁の上部に透明電極を形成するステップと、
前記複数の隔壁、絶縁層、および透明電極により囲まれて形成されるセルに帯電粒子流体を注入するステップと、を含み、
前記絶縁層が0.4μm〜1μmの厚さに形成される、透過率可変フィルムの製造方法。 - 前記絶縁層と複数の隔壁を一体に形成するステップは、
前記複数の隔壁の構造がインプリンティング(imprinting)されているモールドが巻かれたロール(roll)を準備するステップと、
前記ロールに樹脂組成物を塗布するステップと、
前記透明基材および線電極上に前記ロールをローリング(rolling)するステップと、を含む、請求項12に記載の透過率可変フィルムの製造方法。 - 前記樹脂組成物は、ウレタンアクリレート、エポキシアクリレート、ポリエステルアクリレート、ポリエーテル、およびこれらの組み合わせからなる群から選択された1つを含む、請求項13に記載の透過率可変フィルムの製造方法。
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