JP2016536803A5 - - Google Patents
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- Publication number
- JP2016536803A5 JP2016536803A5 JP2016542065A JP2016542065A JP2016536803A5 JP 2016536803 A5 JP2016536803 A5 JP 2016536803A5 JP 2016542065 A JP2016542065 A JP 2016542065A JP 2016542065 A JP2016542065 A JP 2016542065A JP 2016536803 A5 JP2016536803 A5 JP 2016536803A5
- Authority
- JP
- Japan
- Prior art keywords
- shaft
- heater
- substrate support
- layer
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 16
- 229910010293 ceramic material Inorganic materials 0.000 claims 9
- 239000004020 conductor Substances 0.000 claims 5
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims 1
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361878370P | 2013-09-16 | 2013-09-16 | |
| US61/878,370 | 2013-09-16 | ||
| US14/481,283 | 2014-09-09 | ||
| US14/481,283 US9698074B2 (en) | 2013-09-16 | 2014-09-09 | Heated substrate support with temperature profile control |
| PCT/US2014/054945 WO2015038610A1 (en) | 2013-09-16 | 2014-09-10 | Heated substrate support with temperature profile control |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016536803A JP2016536803A (ja) | 2016-11-24 |
| JP2016536803A5 true JP2016536803A5 (OSRAM) | 2017-11-30 |
| JP6404355B2 JP6404355B2 (ja) | 2018-10-10 |
Family
ID=52666222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016542065A Expired - Fee Related JP6404355B2 (ja) | 2013-09-16 | 2014-09-10 | 温度プロファイル制御装置を有する加熱基板支持体 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9698074B2 (OSRAM) |
| JP (1) | JP6404355B2 (OSRAM) |
| KR (1) | KR102244625B1 (OSRAM) |
| CN (1) | CN105556656B (OSRAM) |
| TW (1) | TWI645498B (OSRAM) |
| WO (1) | WO2015038610A1 (OSRAM) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9972477B2 (en) | 2014-06-28 | 2018-05-15 | Applied Materials, Inc. | Multiple point gas delivery apparatus for etching materials |
| US10186437B2 (en) * | 2015-10-05 | 2019-01-22 | Lam Research Corporation | Substrate holder having integrated temperature measurement electrical devices |
| WO2017139353A1 (en) * | 2016-02-08 | 2017-08-17 | Watlow Electric Manufacturing Company | Temperature sensing system for rotatable wafer support assembly |
| US10184183B2 (en) * | 2016-06-21 | 2019-01-22 | Applied Materials, Inc. | Substrate temperature monitoring |
| TWI671851B (zh) | 2016-09-22 | 2019-09-11 | 美商應用材料股份有限公司 | 用於寬範圍溫度控制的加熱器基座組件 |
| JP6704834B2 (ja) * | 2016-10-28 | 2020-06-03 | 日本特殊陶業株式会社 | 加熱装置 |
| WO2018159189A1 (ja) * | 2017-02-28 | 2018-09-07 | 日本発條株式会社 | 基板支持ユニット、および基板支持ユニットを有する成膜装置 |
| US11978646B2 (en) | 2017-05-18 | 2024-05-07 | Applied Materials, Inc. | Thermal chamber with improved thermal uniformity |
| JP7049818B2 (ja) * | 2017-12-13 | 2022-04-07 | 東京エレクトロン株式会社 | 成膜装置 |
| CN111886672A (zh) * | 2018-03-19 | 2020-11-03 | 日新电机株式会社 | 基板加热系统以及基板处理装置 |
| JP6952633B2 (ja) * | 2018-03-23 | 2021-10-20 | 東京エレクトロン株式会社 | 基板加熱装置及びこれを用いた基板処理装置 |
| WO2019181500A1 (ja) * | 2018-03-23 | 2019-09-26 | 日本碍子株式会社 | マルチゾーンヒータ |
| KR102098556B1 (ko) * | 2018-07-09 | 2020-04-17 | 주식회사 테스 | 기판지지유닛 및 이를 구비한 기판처리장치 |
| WO2020086122A1 (en) * | 2018-10-24 | 2020-04-30 | Applied Materials, Inc. | Substrate support designs for a deposition chamber |
| CN111383891B (zh) | 2018-12-29 | 2023-03-10 | 中微半导体设备(上海)股份有限公司 | 用于半导体处理设备的温度控制装置及其温度控制方法 |
| CN113632588B (zh) * | 2019-03-18 | 2024-06-25 | 日本碍子株式会社 | 陶瓷加热器及其制法 |
| CN110060913A (zh) * | 2019-04-22 | 2019-07-26 | 德淮半导体有限公司 | 离子植入机以及监测离子植入机中离子束的方法 |
| WO2021002169A1 (ja) | 2019-07-01 | 2021-01-07 | 日本碍子株式会社 | シャフト付きセラミックヒータ |
| WO2021010063A1 (ja) * | 2019-07-16 | 2021-01-21 | 日本碍子株式会社 | シャフト付きセラミックヒータ |
| CN114175851B (zh) * | 2019-07-16 | 2024-06-25 | 日本碍子株式会社 | 带轴的陶瓷加热器 |
| JP7430617B2 (ja) * | 2020-10-16 | 2024-02-13 | 日本碍子株式会社 | ウエハ載置台 |
| JP7375069B2 (ja) * | 2022-03-07 | 2023-11-07 | 株式会社Kokusai Electric | 基板処理装置、半導体装置の製造方法及びプログラム |
| US20250125181A1 (en) * | 2023-10-12 | 2025-04-17 | Applied Materials, Inc. | Low temperature electrostatic chuck |
| US20250227851A1 (en) * | 2024-01-08 | 2025-07-10 | Tokyo Electron Limited | Substrate support with printed heater |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69432383D1 (de) * | 1993-05-27 | 2003-05-08 | Applied Materials Inc | Verbesserungen betreffend Substrathalter geeignet für den Gebrauch in Vorrichtungen für die chemische Abscheidung aus der Dampfphase |
| JP2001118662A (ja) * | 1999-08-09 | 2001-04-27 | Ibiden Co Ltd | セラミックヒータ |
| JP4637316B2 (ja) * | 2000-02-24 | 2011-02-23 | 京セラ株式会社 | 筒状体を有するセラミックヒーター及びこれを用いた加熱装置 |
| US7273526B2 (en) * | 2004-04-15 | 2007-09-25 | Asm Japan K.K. | Thin-film deposition apparatus |
| US7126092B2 (en) * | 2005-01-13 | 2006-10-24 | Watlow Electric Manufacturing Company | Heater for wafer processing and methods of operating and manufacturing the same |
| JP4435742B2 (ja) * | 2005-08-09 | 2010-03-24 | 信越化学工業株式会社 | 加熱素子 |
| JP4889385B2 (ja) | 2006-07-07 | 2012-03-07 | 日本発條株式会社 | ヒータユニットおよびシャフト |
| JP4294661B2 (ja) * | 2006-07-26 | 2009-07-15 | 国立大学法人東北大学 | 基板ステージ、熱処理装置および基板ステージの製造方法 |
| JP5135915B2 (ja) * | 2007-06-28 | 2013-02-06 | 東京エレクトロン株式会社 | 載置台構造及び熱処理装置 |
| KR101305760B1 (ko) * | 2008-03-21 | 2013-09-17 | 엔지케이 인슐레이터 엘티디 | 세라믹스 히터 |
| JP5358543B2 (ja) * | 2009-09-17 | 2013-12-04 | 日本碍子株式会社 | セラミックスヒーター及びその製造方法 |
| US8274017B2 (en) | 2009-12-18 | 2012-09-25 | Applied Materials, Inc. | Multifunctional heater/chiller pedestal for wide range wafer temperature control |
| JP5666167B2 (ja) * | 2010-05-07 | 2015-02-12 | 日本発條株式会社 | ステージヒータ及びシャフトの製造方法 |
| US20120211484A1 (en) | 2011-02-23 | 2012-08-23 | Applied Materials, Inc. | Methods and apparatus for a multi-zone pedestal heater |
| US9706605B2 (en) | 2012-03-30 | 2017-07-11 | Applied Materials, Inc. | Substrate support with feedthrough structure |
-
2014
- 2014-09-09 US US14/481,283 patent/US9698074B2/en active Active
- 2014-09-10 KR KR1020167009634A patent/KR102244625B1/ko active Active
- 2014-09-10 WO PCT/US2014/054945 patent/WO2015038610A1/en not_active Ceased
- 2014-09-10 CN CN201480049638.2A patent/CN105556656B/zh not_active Expired - Fee Related
- 2014-09-10 JP JP2016542065A patent/JP6404355B2/ja not_active Expired - Fee Related
- 2014-09-11 TW TW103131407A patent/TWI645498B/zh not_active IP Right Cessation
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