JP2016525792A5 - - Google Patents

Download PDF

Info

Publication number
JP2016525792A5
JP2016525792A5 JP2016524732A JP2016524732A JP2016525792A5 JP 2016525792 A5 JP2016525792 A5 JP 2016525792A5 JP 2016524732 A JP2016524732 A JP 2016524732A JP 2016524732 A JP2016524732 A JP 2016524732A JP 2016525792 A5 JP2016525792 A5 JP 2016525792A5
Authority
JP
Japan
Prior art keywords
electronic component
conductive material
substrate
insulating material
electrical connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016524732A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016525792A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/EP2014/063708 external-priority patent/WO2015003929A1/en
Publication of JP2016525792A publication Critical patent/JP2016525792A/ja
Publication of JP2016525792A5 publication Critical patent/JP2016525792A5/ja
Pending legal-status Critical Current

Links

JP2016524732A 2013-07-09 2014-06-27 印刷電子装置作製技術に基づいて印刷回路基板アセンブリを製造する方法及び印刷回路基板アセンブリ Pending JP2016525792A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP13175646.2 2013-07-09
EP13175646 2013-07-09
PCT/EP2014/063708 WO2015003929A1 (en) 2013-07-09 2014-06-27 Method for manufacturing a printed circuit board assembly based on printed electronics and printed circuit board assembly

Publications (2)

Publication Number Publication Date
JP2016525792A JP2016525792A (ja) 2016-08-25
JP2016525792A5 true JP2016525792A5 (enExample) 2017-08-03

Family

ID=48746378

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016524732A Pending JP2016525792A (ja) 2013-07-09 2014-06-27 印刷電子装置作製技術に基づいて印刷回路基板アセンブリを製造する方法及び印刷回路基板アセンブリ

Country Status (5)

Country Link
US (1) US10257935B2 (enExample)
EP (1) EP3020258A1 (enExample)
JP (1) JP2016525792A (enExample)
CN (1) CN105379432B (enExample)
WO (1) WO2015003929A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105027687B (zh) 2014-01-02 2017-03-08 皇家飞利浦有限公司 用于制造非平面印刷电路板组件的方法
US11237103B2 (en) 2018-05-31 2022-02-01 Socovar Sec Electronic device testing system, electronic device production system including same and method of testing an electronic device
CN212390187U (zh) * 2020-05-25 2021-01-22 漳州立达信光电子科技有限公司 一种智能灯

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1243746B (de) 1965-05-15 1967-07-06 Telefunken Patent Verfahren zur Herstellung einer gedruckten Schaltung auf einer Traegerplatte, deren Oberflaeche von einer Ebene abweicht
US4710419A (en) * 1984-07-16 1987-12-01 Gregory Vernon C In-mold process for fabrication of molded plastic printed circuit boards
US4912288A (en) 1985-09-04 1990-03-27 Allen-Bradley International Limited Moulded electric circuit package
JP2747096B2 (ja) 1990-07-24 1998-05-06 北川工業株式会社 ３次元回路基板の製造方法
EP0477981A3 (en) 1990-09-27 1992-05-06 Toshiba Lighting & Technology Corporation Multi-layer circuit substrate having a non-planar shape, and a method for the manufacture thereof
JPH0927516A (ja) * 1995-07-12 1997-01-28 Nippondenso Co Ltd 電子部品の接続構造
US6482289B1 (en) * 1995-10-06 2002-11-19 Motorola, Inc. Nonconductive laminate for coupling substrates and method therefor
JPH1197610A (ja) * 1997-09-25 1999-04-09 Hitachi Ltd 電子部品の実装方法および電子部品
DE19807202A1 (de) 1998-02-20 1999-08-26 Zeiss Carl Jena Gmbh Verfahren und Anordnung zum Kontaktieren von elektronischen Bauelementen
JP3351410B2 (ja) * 1999-12-20 2002-11-25 株式会社村田製作所 インバータ用コンデンサモジュール、インバータ及びコンデンサモジュール
EP1223612A4 (en) * 2000-05-12 2005-06-29 Matsushita Electric Industrial Co Ltd PRINTED CIRCUIT BOARD FOR MOUNTING A SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR MANUFACTURING THE MOUNTING STRUCTURE THEREOF
TW200821694A (en) * 2006-11-01 2008-05-16 Au Optronics Corp Reflective light source device and manufacture method thereof
US20100052163A1 (en) * 2007-04-27 2010-03-04 Nec Corporation Semiconductor device, method of manufacturing same and method of repairing same
US7874065B2 (en) * 2007-10-31 2011-01-25 Nguyen Vinh T Process for making a multilayer circuit board
JP2009129801A (ja) * 2007-11-27 2009-06-11 Denki Kagaku Kogyo Kk 金属ベース回路基板
CN101903485B (zh) * 2007-12-18 2012-12-05 3M创新有限公司 导电粘合剂前体及其使用方法和制品
TWM339879U (en) * 2008-02-12 2008-09-01 Hsien-Ching Chang LED solderless promptly assmble and connected structure
WO2010002156A2 (ko) 2008-06-30 2010-01-07 Park Chang Soo 다면다각형상 구현이 용이한 엘이디조명용 인쇄회로기판
DE102008042810A1 (de) 2008-10-14 2010-04-15 Robert Bosch Gmbh Verfahren zur Herstellung eines mit elektrischen Elementen versehenen Substrats
KR101608745B1 (ko) * 2009-12-30 2016-04-05 삼성전자 주식회사 인쇄회로기판조립체의 제조방법
KR101138542B1 (ko) * 2010-08-09 2012-04-25 삼성전기주식회사 다층 인쇄회로기판의 제조방법
US20120175667A1 (en) 2011-10-03 2012-07-12 Golle Aaron J Led light disposed on a flexible substrate and connected with a printed 3d conductor
CN105027687B (zh) * 2014-01-02 2017-03-08 皇家飞利浦有限公司 用于制造非平面印刷电路板组件的方法

Similar Documents

Publication Publication Date Title
JP2015109449A5 (enExample)
JP2016192568A5 (enExample)
JP2016207957A5 (enExample)
JP2011023751A5 (enExample)
JP2016131152A5 (enExample)
JP2011515862A5 (enExample)
MX2021011276A (es) Paquete de dispositivo emisor de luz y su aplicacion.
JP2015130484A5 (enExample)
JP2017516308A5 (enExample)
JP2012019192A (ja) 電子部品モジュール及びその製造方法
JP2012227529A5 (enExample)
KR101435451B1 (ko) 메탈 인쇄회로기판 및 그 제조방법
IN2014CN01630A (enExample)
TW200634915A (en) Manufacturing method of semiconductor device, semiconductor device, circuit board, electro-optic device, and electronic apparatus
JP2016092259A5 (enExample)
CN102883544A (zh) 线路板无铅喷锡时防止过孔掉油的方法
JP2016525792A5 (enExample)
US20130269994A1 (en) Printed circuit board with strengthened pad
JP2017011075A5 (enExample)
JP2017510075A5 (enExample)
JP2010123830A5 (enExample)
JP2016149517A5 (enExample)
JP2017032956A5 (enExample)
JP2007150180A5 (enExample)
CN105282972B (zh) 器件内置型印刷电路板、半导体封装及其制造方法