JP2016525792A - 印刷電子装置作製技術に基づいて印刷回路基板アセンブリを製造する方法及び印刷回路基板アセンブリ - Google Patents

印刷電子装置作製技術に基づいて印刷回路基板アセンブリを製造する方法及び印刷回路基板アセンブリ Download PDF

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Publication number
JP2016525792A
JP2016525792A JP2016524732A JP2016524732A JP2016525792A JP 2016525792 A JP2016525792 A JP 2016525792A JP 2016524732 A JP2016524732 A JP 2016524732A JP 2016524732 A JP2016524732 A JP 2016524732A JP 2016525792 A JP2016525792 A JP 2016525792A
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JP
Japan
Prior art keywords
substrate
electronic component
conductive material
printed circuit
electrical connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016524732A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016525792A5 (enExample
Inventor
ヴァン アドリアヌス ヨハネス ステファヌス マリア デ
ヴァン アドリアヌス ヨハネス ステファヌス マリア デ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips NV filed Critical Koninklijke Philips NV
Publication of JP2016525792A publication Critical patent/JP2016525792A/ja
Publication of JP2016525792A5 publication Critical patent/JP2016525792A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Led Device Packages (AREA)
  • Electroluminescent Light Sources (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
JP2016524732A 2013-07-09 2014-06-27 印刷電子装置作製技術に基づいて印刷回路基板アセンブリを製造する方法及び印刷回路基板アセンブリ Pending JP2016525792A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP13175646 2013-07-09
EP13175646.2 2013-07-09
PCT/EP2014/063708 WO2015003929A1 (en) 2013-07-09 2014-06-27 Method for manufacturing a printed circuit board assembly based on printed electronics and printed circuit board assembly

Publications (2)

Publication Number Publication Date
JP2016525792A true JP2016525792A (ja) 2016-08-25
JP2016525792A5 JP2016525792A5 (enExample) 2017-08-03

Family

ID=48746378

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016524732A Pending JP2016525792A (ja) 2013-07-09 2014-06-27 印刷電子装置作製技術に基づいて印刷回路基板アセンブリを製造する方法及び印刷回路基板アセンブリ

Country Status (5)

Country Link
US (1) US10257935B2 (enExample)
EP (1) EP3020258A1 (enExample)
JP (1) JP2016525792A (enExample)
CN (1) CN105379432B (enExample)
WO (1) WO2015003929A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015101494A1 (en) 2014-01-02 2015-07-09 Koninklijke Philips N.V. Method for manufacturing a non-planar printed circuit board assembly
US11237103B2 (en) 2018-05-31 2022-02-01 Socovar Sec Electronic device testing system, electronic device production system including same and method of testing an electronic device
CN212390187U (zh) * 2020-05-25 2021-01-22 漳州立达信光电子科技有限公司 一种智能灯

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0927516A (ja) * 1995-07-12 1997-01-28 Nippondenso Co Ltd 電子部品の接続構造
JPH1197610A (ja) * 1997-09-25 1999-04-09 Hitachi Ltd 電子部品の実装方法および電子部品
WO2001086716A1 (en) * 2000-05-12 2001-11-15 Matsushita Electric Industrial Co., Ltd. Semiconductor device mounting circuit board, method of producing the same, and method of producing mounting structure using the same
JP2009129801A (ja) * 2007-11-27 2009-06-11 Denki Kagaku Kogyo Kk 金属ベース回路基板

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Publication number Priority date Publication date Assignee Title
DE1243746B (de) 1965-05-15 1967-07-06 Telefunken Patent Verfahren zur Herstellung einer gedruckten Schaltung auf einer Traegerplatte, deren Oberflaeche von einer Ebene abweicht
US4710419A (en) * 1984-07-16 1987-12-01 Gregory Vernon C In-mold process for fabrication of molded plastic printed circuit boards
JPH0712111B2 (ja) 1985-09-04 1995-02-08 ユーエフイー・インコーポレイテッド 電気回路埋設方法及びプラスチック製品
JP2747096B2 (ja) 1990-07-24 1998-05-06 北川工業株式会社 ３次元回路基板の製造方法
EP0477981A3 (en) 1990-09-27 1992-05-06 Toshiba Lighting & Technology Corporation Multi-layer circuit substrate having a non-planar shape, and a method for the manufacture thereof
US6482289B1 (en) * 1995-10-06 2002-11-19 Motorola, Inc. Nonconductive laminate for coupling substrates and method therefor
DE19807202A1 (de) 1998-02-20 1999-08-26 Zeiss Carl Jena Gmbh Verfahren und Anordnung zum Kontaktieren von elektronischen Bauelementen
JP3351410B2 (ja) * 1999-12-20 2002-11-25 株式会社村田製作所 インバータ用コンデンサモジュール、インバータ及びコンデンサモジュール
TW200821694A (en) * 2006-11-01 2008-05-16 Au Optronics Corp Reflective light source device and manufacture method thereof
JPWO2008136419A1 (ja) * 2007-04-27 2010-07-29 日本電気株式会社 半導体装置及び製造方法並びにリペア方法
US7874065B2 (en) * 2007-10-31 2011-01-25 Nguyen Vinh T Process for making a multilayer circuit board
WO2009079216A1 (en) * 2007-12-18 2009-06-25 3M Innovative Properties Company Conductive adhesive precursor, method of using the same, and article
TWM339879U (en) * 2008-02-12 2008-09-01 Hsien-Ching Chang LED solderless promptly assmble and connected structure
WO2010002156A2 (ko) 2008-06-30 2010-01-07 Park Chang Soo 다면다각형상 구현이 용이한 엘이디조명용 인쇄회로기판
DE102008042810A1 (de) 2008-10-14 2010-04-15 Robert Bosch Gmbh Verfahren zur Herstellung eines mit elektrischen Elementen versehenen Substrats
KR101608745B1 (ko) 2009-12-30 2016-04-05 삼성전자 주식회사 인쇄회로기판조립체의 제조방법
KR101138542B1 (ko) * 2010-08-09 2012-04-25 삼성전기주식회사 다층 인쇄회로기판의 제조방법
US20120175667A1 (en) 2011-10-03 2012-07-12 Golle Aaron J Led light disposed on a flexible substrate and connected with a printed 3d conductor
WO2015101494A1 (en) 2014-01-02 2015-07-09 Koninklijke Philips N.V. Method for manufacturing a non-planar printed circuit board assembly

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0927516A (ja) * 1995-07-12 1997-01-28 Nippondenso Co Ltd 電子部品の接続構造
JPH1197610A (ja) * 1997-09-25 1999-04-09 Hitachi Ltd 電子部品の実装方法および電子部品
WO2001086716A1 (en) * 2000-05-12 2001-11-15 Matsushita Electric Industrial Co., Ltd. Semiconductor device mounting circuit board, method of producing the same, and method of producing mounting structure using the same
JP2009129801A (ja) * 2007-11-27 2009-06-11 Denki Kagaku Kogyo Kk 金属ベース回路基板

Also Published As

Publication number Publication date
US20160150648A1 (en) 2016-05-26
EP3020258A1 (en) 2016-05-18
US10257935B2 (en) 2019-04-09
CN105379432A (zh) 2016-03-02
CN105379432B (zh) 2019-06-07
WO2015003929A1 (en) 2015-01-15

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