CN105379432B - 用于制造基于印刷电子技术的印刷电路板组件的方法以及印刷电路板组件 - Google Patents

用于制造基于印刷电子技术的印刷电路板组件的方法以及印刷电路板组件 Download PDF

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Publication number
CN105379432B
CN105379432B CN201480039279.2A CN201480039279A CN105379432B CN 105379432 B CN105379432 B CN 105379432B CN 201480039279 A CN201480039279 A CN 201480039279A CN 105379432 B CN105379432 B CN 105379432B
Authority
CN
China
Prior art keywords
substrate
conductive material
electronic component
layer
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201480039279.2A
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English (en)
Chinese (zh)
Other versions
CN105379432A (zh
Inventor
A·J·S·M·德万
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Signify Holding BV
Original Assignee
Koninklijke Philips NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips NV filed Critical Koninklijke Philips NV
Publication of CN105379432A publication Critical patent/CN105379432A/zh
Application granted granted Critical
Publication of CN105379432B publication Critical patent/CN105379432B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Led Device Packages (AREA)
  • Structure Of Printed Boards (AREA)
  • Electroluminescent Light Sources (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
CN201480039279.2A 2013-07-09 2014-06-27 用于制造基于印刷电子技术的印刷电路板组件的方法以及印刷电路板组件 Expired - Fee Related CN105379432B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP13175646 2013-07-09
EP13175646.2 2013-07-09
PCT/EP2014/063708 WO2015003929A1 (en) 2013-07-09 2014-06-27 Method for manufacturing a printed circuit board assembly based on printed electronics and printed circuit board assembly

Publications (2)

Publication Number Publication Date
CN105379432A CN105379432A (zh) 2016-03-02
CN105379432B true CN105379432B (zh) 2019-06-07

Family

ID=48746378

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480039279.2A Expired - Fee Related CN105379432B (zh) 2013-07-09 2014-06-27 用于制造基于印刷电子技术的印刷电路板组件的方法以及印刷电路板组件

Country Status (5)

Country Link
US (1) US10257935B2 (enExample)
EP (1) EP3020258A1 (enExample)
JP (1) JP2016525792A (enExample)
CN (1) CN105379432B (enExample)
WO (1) WO2015003929A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3090609B1 (en) 2014-01-02 2017-06-28 Philips Lighting Holding B.V. Method for manufacturing a non-planar printed circuit board assembly
US11237103B2 (en) 2018-05-31 2022-02-01 Socovar Sec Electronic device testing system, electronic device production system including same and method of testing an electronic device
CN212390187U (zh) * 2020-05-25 2021-01-22 漳州立达信光电子科技有限公司 一种智能灯

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6482289B1 (en) * 1995-10-06 2002-11-19 Motorola, Inc. Nonconductive laminate for coupling substrates and method therefor
US20100052163A1 (en) * 2007-04-27 2010-03-04 Nec Corporation Semiconductor device, method of manufacturing same and method of repairing same
US20110154661A1 (en) * 2009-12-30 2011-06-30 Samsung Electronics Co., Ltd. Method of fabricating printed circuit board assembly

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DE1243746B (de) 1965-05-15 1967-07-06 Telefunken Patent Verfahren zur Herstellung einer gedruckten Schaltung auf einer Traegerplatte, deren Oberflaeche von einer Ebene abweicht
US4710419A (en) * 1984-07-16 1987-12-01 Gregory Vernon C In-mold process for fabrication of molded plastic printed circuit boards
ATE83883T1 (de) 1985-09-04 1993-01-15 Ufe Inc Herstellung von gedruckten schaltungen.
JP2747096B2 (ja) 1990-07-24 1998-05-06 北川工業株式会社 ３次元回路基板の製造方法
EP0477981A3 (en) 1990-09-27 1992-05-06 Toshiba Lighting & Technology Corporation Multi-layer circuit substrate having a non-planar shape, and a method for the manufacture thereof
JPH0927516A (ja) * 1995-07-12 1997-01-28 Nippondenso Co Ltd 電子部品の接続構造
JPH1197610A (ja) * 1997-09-25 1999-04-09 Hitachi Ltd 電子部品の実装方法および電子部品
DE19807202A1 (de) 1998-02-20 1999-08-26 Zeiss Carl Jena Gmbh Verfahren und Anordnung zum Kontaktieren von elektronischen Bauelementen
JP3351410B2 (ja) * 1999-12-20 2002-11-25 株式会社村田製作所 インバータ用コンデンサモジュール、インバータ及びコンデンサモジュール
US6909180B2 (en) * 2000-05-12 2005-06-21 Matsushita Electric Industrial Co., Ltd. Semiconductor device, mounting circuit board, method of producing the same, and method of producing mounting structure using the same
TW200821694A (en) * 2006-11-01 2008-05-16 Au Optronics Corp Reflective light source device and manufacture method thereof
US7874065B2 (en) * 2007-10-31 2011-01-25 Nguyen Vinh T Process for making a multilayer circuit board
JP2009129801A (ja) * 2007-11-27 2009-06-11 Denki Kagaku Kogyo Kk 金属ベース回路基板
CN101903485B (zh) * 2007-12-18 2012-12-05 3M创新有限公司 导电粘合剂前体及其使用方法和制品
TWM339879U (en) * 2008-02-12 2008-09-01 Hsien-Ching Chang LED solderless promptly assmble and connected structure
WO2010002156A2 (ko) 2008-06-30 2010-01-07 Park Chang Soo 다면다각형상 구현이 용이한 엘이디조명용 인쇄회로기판
DE102008042810A1 (de) 2008-10-14 2010-04-15 Robert Bosch Gmbh Verfahren zur Herstellung eines mit elektrischen Elementen versehenen Substrats
KR101138542B1 (ko) 2010-08-09 2012-04-25 삼성전기주식회사 다층 인쇄회로기판의 제조방법
US20120175667A1 (en) 2011-10-03 2012-07-12 Golle Aaron J Led light disposed on a flexible substrate and connected with a printed 3d conductor
EP3090609B1 (en) 2014-01-02 2017-06-28 Philips Lighting Holding B.V. Method for manufacturing a non-planar printed circuit board assembly

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6482289B1 (en) * 1995-10-06 2002-11-19 Motorola, Inc. Nonconductive laminate for coupling substrates and method therefor
US20100052163A1 (en) * 2007-04-27 2010-03-04 Nec Corporation Semiconductor device, method of manufacturing same and method of repairing same
US20110154661A1 (en) * 2009-12-30 2011-06-30 Samsung Electronics Co., Ltd. Method of fabricating printed circuit board assembly

Also Published As

Publication number Publication date
CN105379432A (zh) 2016-03-02
WO2015003929A1 (en) 2015-01-15
US20160150648A1 (en) 2016-05-26
EP3020258A1 (en) 2016-05-18
US10257935B2 (en) 2019-04-09
JP2016525792A (ja) 2016-08-25

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right

Effective date of registration: 20170315

Address after: The city of Eindhoven in Holland

Applicant after: KONINKL PHILIPS NV

Address before: The city of Eindhoven in Holland

Applicant before: Koninkl Philips Electronics NV

TA01 Transfer of patent application right
GR01 Patent grant
GR01 Patent grant
CP03 Change of name, title or address

Address after: Eindhoven

Patentee after: Signify Holdings Ltd.

Address before: The city of Eindhoven in Holland

Patentee before: PHILIPS LIGHTING HOLDING B.V.

CP03 Change of name, title or address
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20190607

Termination date: 20210627

CF01 Termination of patent right due to non-payment of annual fee