JP2016523998A - 蛍光体の製造方法、蛍光体及びオプトエレクトロニクス素子 - Google Patents
蛍光体の製造方法、蛍光体及びオプトエレクトロニクス素子 Download PDFInfo
- Publication number
- JP2016523998A JP2016523998A JP2016513272A JP2016513272A JP2016523998A JP 2016523998 A JP2016523998 A JP 2016523998A JP 2016513272 A JP2016513272 A JP 2016513272A JP 2016513272 A JP2016513272 A JP 2016513272A JP 2016523998 A JP2016523998 A JP 2016523998A
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- phosphor
- component
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- proportion
- electromagnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77347—Silicon Nitrides or Silicon Oxynitrides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
- H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102013105056.5A DE102013105056A1 (de) | 2013-05-16 | 2013-05-16 | Verfahren zur Herstellung eines Leuchtstoffs, Leuchtstoff und optoelektronisches Bauelement |
| DE102013105056.5 | 2013-05-16 | ||
| PCT/EP2014/058882 WO2014184003A1 (de) | 2013-05-16 | 2014-04-30 | Verfahren zur herstellung eines leuchtstoffs, leuchtstoff und optoelektronisches bauelement |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2016523998A true JP2016523998A (ja) | 2016-08-12 |
| JP2016523998A5 JP2016523998A5 (enExample) | 2017-06-22 |
Family
ID=50733022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016513272A Pending JP2016523998A (ja) | 2013-05-16 | 2014-04-30 | 蛍光体の製造方法、蛍光体及びオプトエレクトロニクス素子 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10174245B2 (enExample) |
| JP (1) | JP2016523998A (enExample) |
| CN (1) | CN105209571A (enExample) |
| DE (2) | DE102013105056A1 (enExample) |
| WO (1) | WO2014184003A1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102019106546A1 (de) * | 2019-03-14 | 2020-09-17 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur herstellung von optoelektronischen halbleiterbauteilen und optoelektronisches halbleiterbauteil |
| TWI809087B (zh) * | 2019-04-11 | 2023-07-21 | 晶元光電股份有限公司 | 發光二極體封裝 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005226000A (ja) * | 2004-02-13 | 2005-08-25 | Shoei Chem Ind Co | 窒化物蛍光体、窒化物蛍光体の製造方法、白色発光素子及び顔料 |
| WO2006033418A1 (ja) * | 2004-09-22 | 2006-03-30 | National Institute For Materials Science | 蛍光体とその製造方法および発光器具 |
| JP2006206729A (ja) * | 2005-01-27 | 2006-08-10 | National Institute For Materials Science | 蛍光体とその製造方法および発光器具 |
| JP2008189700A (ja) * | 2007-01-31 | 2008-08-21 | Nichia Chem Ind Ltd | 窒化物系蛍光体、酸窒化物系蛍光体及びこれらを用いた発光装置 |
| JP2009519364A (ja) * | 2005-12-13 | 2009-05-14 | オスラム ゲゼルシャフト ミット ベシュレンクテル ハフツング | 赤色に放射する発光物質及びこの種の発光物質を有する光源 |
| US20120037938A1 (en) * | 2008-11-20 | 2012-02-16 | Daniel Becker | SR2S15N8 Luminous substance emitting red and light source comprising a luminous substance of said king and method for producing the luminous substance |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4165318B2 (ja) | 2003-07-16 | 2008-10-15 | 宇部興産株式会社 | サイアロン系蛍光体およびその製造方法 |
| JP3837588B2 (ja) | 2003-11-26 | 2006-10-25 | 独立行政法人物質・材料研究機構 | 蛍光体と蛍光体を用いた発光器具 |
| JP4511885B2 (ja) | 2004-07-09 | 2010-07-28 | Dowaエレクトロニクス株式会社 | 蛍光体及びled並びに光源 |
| US7671529B2 (en) | 2004-12-10 | 2010-03-02 | Philips Lumileds Lighting Company, Llc | Phosphor converted light emitting device |
| KR101060216B1 (ko) * | 2005-07-01 | 2011-08-29 | 도쿠리츠교세이호징 붓시쯔 자이료 겐큐키코 | 형광체와 그 제조 방법 및 조명 기구 |
| US7262439B2 (en) | 2005-11-22 | 2007-08-28 | Lumination Llc | Charge compensated nitride phosphors for use in lighting applications |
| JP5188687B2 (ja) | 2006-07-18 | 2013-04-24 | 昭和電工株式会社 | 蛍光体及びその製造法並びに発光装置 |
| DE102007033026A1 (de) | 2007-07-16 | 2009-01-22 | Osram Gesellschaft mit beschränkter Haftung | Leuchtstoffmischung für eine Entladungslampe und Entladungslampe, insbesondere Hg-Niederdruckentladungslampe |
| DE102009032711A1 (de) | 2009-07-11 | 2011-01-20 | Merck Patent Gmbh | Co-dotierte Silicooxynitride |
| WO2011028033A2 (ko) | 2009-09-02 | 2011-03-10 | 엘지이노텍주식회사 | 형광체, 형광체 제조방법 및 백색 발광 소자 |
| KR101565988B1 (ko) | 2009-10-23 | 2015-11-05 | 삼성전자주식회사 | 적색형광체, 그 제조방법, 이를 이용한 발광소자 패키지, 조명장치 |
| KR101164918B1 (ko) | 2010-05-27 | 2012-07-19 | 대덕지디에스 주식회사 | 태양전지모듈 및 그 제조방법 |
| KR101856534B1 (ko) | 2011-12-07 | 2018-05-14 | 삼성전자주식회사 | 산질화물계 형광체 및 이를 포함하는 발광장치 |
-
2013
- 2013-05-16 DE DE102013105056.5A patent/DE102013105056A1/de not_active Withdrawn
-
2014
- 2014-04-30 CN CN201480028408.8A patent/CN105209571A/zh active Pending
- 2014-04-30 US US14/891,596 patent/US10174245B2/en not_active Expired - Fee Related
- 2014-04-30 WO PCT/EP2014/058882 patent/WO2014184003A1/de not_active Ceased
- 2014-04-30 DE DE112014002412.0T patent/DE112014002412A5/de not_active Ceased
- 2014-04-30 JP JP2016513272A patent/JP2016523998A/ja active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005226000A (ja) * | 2004-02-13 | 2005-08-25 | Shoei Chem Ind Co | 窒化物蛍光体、窒化物蛍光体の製造方法、白色発光素子及び顔料 |
| WO2006033418A1 (ja) * | 2004-09-22 | 2006-03-30 | National Institute For Materials Science | 蛍光体とその製造方法および発光器具 |
| EP1806389A1 (en) * | 2004-09-22 | 2007-07-11 | National Institute for Materials Science | Phosphor, process for producing the same and luminescence apparatus |
| CN101044222A (zh) * | 2004-09-22 | 2007-09-26 | 独立行政法人物质·材料研究机构 | 荧光体及其制造方法和发光器具 |
| US20080143246A1 (en) * | 2004-09-22 | 2008-06-19 | National Institution For Materials Science | Phosphor, Production Method Thereof and Light Emitting Instrument |
| JP5105347B2 (ja) * | 2004-09-22 | 2012-12-26 | 独立行政法人物質・材料研究機構 | 蛍光体とその製造方法および発光器具 |
| JP2006206729A (ja) * | 2005-01-27 | 2006-08-10 | National Institute For Materials Science | 蛍光体とその製造方法および発光器具 |
| JP2009519364A (ja) * | 2005-12-13 | 2009-05-14 | オスラム ゲゼルシャフト ミット ベシュレンクテル ハフツング | 赤色に放射する発光物質及びこの種の発光物質を有する光源 |
| US20090212683A1 (en) * | 2005-12-13 | 2009-08-27 | Osram Gesellschaft mit beschränkter Haftung | Red-Emitting Luminescent Substance and Light Source Comprising Such a Luminescent Substance |
| JP2008189700A (ja) * | 2007-01-31 | 2008-08-21 | Nichia Chem Ind Ltd | 窒化物系蛍光体、酸窒化物系蛍光体及びこれらを用いた発光装置 |
| US20120037938A1 (en) * | 2008-11-20 | 2012-02-16 | Daniel Becker | SR2S15N8 Luminous substance emitting red and light source comprising a luminous substance of said king and method for producing the luminous substance |
| JP2012509373A (ja) * | 2008-11-20 | 2012-04-19 | オスラム アクチエンゲゼルシャフト | 赤色発光性のSr2Si5N8型の蛍光体及びかかる蛍光体を有する光源並びに前記蛍光体の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105209571A (zh) | 2015-12-30 |
| US20160122637A1 (en) | 2016-05-05 |
| DE112014002412A5 (de) | 2016-02-04 |
| DE102013105056A1 (de) | 2014-11-20 |
| US10174245B2 (en) | 2019-01-08 |
| WO2014184003A1 (de) | 2014-11-20 |
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