CN105209571A - 用于制备发光材料的方法、发光材料和光电子器件 - Google Patents

用于制备发光材料的方法、发光材料和光电子器件 Download PDF

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Publication number
CN105209571A
CN105209571A CN201480028408.8A CN201480028408A CN105209571A CN 105209571 A CN105209571 A CN 105209571A CN 201480028408 A CN201480028408 A CN 201480028408A CN 105209571 A CN105209571 A CN 105209571A
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CN
China
Prior art keywords
luminescent material
equal
component
phosphor
electromagnetic radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201480028408.8A
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English (en)
Chinese (zh)
Inventor
比安卡·波尔-克莱因
丹尼尔·比希勒
拉克尔·德拉培尼亚阿隆索
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of CN105209571A publication Critical patent/CN105209571A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77347—Silicon Nitrides or Silicon Oxynitrides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
CN201480028408.8A 2013-05-16 2014-04-30 用于制备发光材料的方法、发光材料和光电子器件 Pending CN105209571A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013105056.5A DE102013105056A1 (de) 2013-05-16 2013-05-16 Verfahren zur Herstellung eines Leuchtstoffs, Leuchtstoff und optoelektronisches Bauelement
DE102013105056.5 2013-05-16
PCT/EP2014/058882 WO2014184003A1 (de) 2013-05-16 2014-04-30 Verfahren zur herstellung eines leuchtstoffs, leuchtstoff und optoelektronisches bauelement

Publications (1)

Publication Number Publication Date
CN105209571A true CN105209571A (zh) 2015-12-30

Family

ID=50733022

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480028408.8A Pending CN105209571A (zh) 2013-05-16 2014-04-30 用于制备发光材料的方法、发光材料和光电子器件

Country Status (5)

Country Link
US (1) US10174245B2 (enExample)
JP (1) JP2016523998A (enExample)
CN (1) CN105209571A (enExample)
DE (2) DE102013105056A1 (enExample)
WO (1) WO2014184003A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019106546A1 (de) * 2019-03-14 2020-09-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung von optoelektronischen halbleiterbauteilen und optoelektronisches halbleiterbauteil
TWI809087B (zh) * 2019-04-11 2023-07-21 晶元光電股份有限公司 發光二極體封裝

Citations (5)

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CN101044222A (zh) * 2004-09-22 2007-09-26 独立行政法人物质·材料研究机构 荧光体及其制造方法和发光器具
WO2011028033A2 (ko) * 2009-09-02 2011-03-10 엘지이노텍주식회사 형광체, 형광체 제조방법 및 백색 발광 소자
CN102041002A (zh) * 2009-10-23 2011-05-04 三星Led株式会社 磷光体及其制备方法、发光装置封装件、表面光源设备
CN102471681A (zh) * 2009-07-11 2012-05-23 默克专利有限公司 共掺杂的硅氧氮化物
CN103146378A (zh) * 2011-12-07 2013-06-12 三星电子株式会社 氧氮化物基磷光体、包含其的发光装置及其制备方法

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JP4165318B2 (ja) 2003-07-16 2008-10-15 宇部興産株式会社 サイアロン系蛍光体およびその製造方法
JP3837588B2 (ja) 2003-11-26 2006-10-25 独立行政法人物質・材料研究機構 蛍光体と蛍光体を用いた発光器具
JP4165412B2 (ja) 2004-02-13 2008-10-15 昭栄化学工業株式会社 窒化物蛍光体、窒化物蛍光体の製造方法、白色発光素子及び顔料
JP4511885B2 (ja) 2004-07-09 2010-07-28 Ｄｏｗａエレクトロニクス株式会社 蛍光体及びｌｅｄ並びに光源
US7671529B2 (en) 2004-12-10 2010-03-02 Philips Lumileds Lighting Company, Llc Phosphor converted light emitting device
JP4756261B2 (ja) 2005-01-27 2011-08-24 独立行政法人物質・材料研究機構 蛍光体とその製造方法および発光器具
KR101060216B1 (ko) * 2005-07-01 2011-08-29 도쿠리츠교세이호징 붓시쯔 자이료 겐큐키코 형광체와 그 제조 방법 및 조명 기구
US7262439B2 (en) 2005-11-22 2007-08-28 Lumination Llc Charge compensated nitride phosphors for use in lighting applications
DE102005059521A1 (de) * 2005-12-13 2007-06-14 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Rot emittierender Leuchtstoff und Lichtquelle mit einem derartigen Leuchtstoff
JP5188687B2 (ja) 2006-07-18 2013-04-24 昭和電工株式会社 蛍光体及びその製造法並びに発光装置
JP5412710B2 (ja) * 2007-01-31 2014-02-12 日亜化学工業株式会社 窒化物系蛍光体又は酸窒化物系蛍光体
DE102007033026A1 (de) 2007-07-16 2009-01-22 Osram Gesellschaft mit beschränkter Haftung Leuchtstoffmischung für eine Entladungslampe und Entladungslampe, insbesondere Hg-Niederdruckentladungslampe
DE102008058295A1 (de) 2008-11-20 2010-05-27 Osram Gesellschaft mit beschränkter Haftung Rot emittierender Leuchtstoff aus der Klasse der Nitridosilikate und Lichtquelle mit derartigem Leuchtstoff sowie Verfahren zur Herstellung des Leuchtstoffs
KR101164918B1 (ko) 2010-05-27 2012-07-19 대덕지디에스 주식회사 태양전지모듈 및 그 제조방법

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CN101044222A (zh) * 2004-09-22 2007-09-26 独立行政法人物质·材料研究机构 荧光体及其制造方法和发光器具
CN102471681A (zh) * 2009-07-11 2012-05-23 默克专利有限公司 共掺杂的硅氧氮化物
WO2011028033A2 (ko) * 2009-09-02 2011-03-10 엘지이노텍주식회사 형광체, 형광체 제조방법 및 백색 발광 소자
CN102041002A (zh) * 2009-10-23 2011-05-04 三星Led株式会社 磷光体及其制备方法、发光装置封装件、表面光源设备
CN103146378A (zh) * 2011-12-07 2013-06-12 三星电子株式会社 氧氮化物基磷光体、包含其的发光装置及其制备方法

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WOON BAE PARK等: "Eu2+ luminescence from 5 different crystallographic sites in a novel red phosphor, Ca15Si20O10N30:Eu2+", 《J. MATER. CHEM.》 *

Also Published As

Publication number Publication date
US20160122637A1 (en) 2016-05-05
DE112014002412A5 (de) 2016-02-04
JP2016523998A (ja) 2016-08-12
DE102013105056A1 (de) 2014-11-20
US10174245B2 (en) 2019-01-08
WO2014184003A1 (de) 2014-11-20

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Application publication date: 20151230

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