DE112014002412A5 - Verfahren zur Herstellung eines Leuchtstoffs, Leuchtstoff und optoelektronisches Bauelement - Google Patents

Verfahren zur Herstellung eines Leuchtstoffs, Leuchtstoff und optoelektronisches Bauelement Download PDF

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Publication number
DE112014002412A5
DE112014002412A5 DE112014002412.0T DE112014002412T DE112014002412A5 DE 112014002412 A5 DE112014002412 A5 DE 112014002412A5 DE 112014002412 T DE112014002412 T DE 112014002412T DE 112014002412 A5 DE112014002412 A5 DE 112014002412A5
Authority
DE
Germany
Prior art keywords
phosphor
preparation
optoelectronic component
optoelectronic
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE112014002412.0T
Other languages
English (en)
Inventor
Bianca Pohl-Klein
Daniel Bichler
Raquel de la Peña Alonso
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of DE112014002412A5 publication Critical patent/DE112014002412A5/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77347—Silicon Nitrides or Silicon Oxynitrides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
DE112014002412.0T 2013-05-16 2014-04-30 Verfahren zur Herstellung eines Leuchtstoffs, Leuchtstoff und optoelektronisches Bauelement Ceased DE112014002412A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013105056.5A DE102013105056A1 (de) 2013-05-16 2013-05-16 Verfahren zur Herstellung eines Leuchtstoffs, Leuchtstoff und optoelektronisches Bauelement
DE102013105056.5 2013-05-16
PCT/EP2014/058882 WO2014184003A1 (de) 2013-05-16 2014-04-30 Verfahren zur herstellung eines leuchtstoffs, leuchtstoff und optoelektronisches bauelement

Publications (1)

Publication Number Publication Date
DE112014002412A5 true DE112014002412A5 (de) 2016-02-04

Family

ID=50733022

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102013105056.5A Withdrawn DE102013105056A1 (de) 2013-05-16 2013-05-16 Verfahren zur Herstellung eines Leuchtstoffs, Leuchtstoff und optoelektronisches Bauelement
DE112014002412.0T Ceased DE112014002412A5 (de) 2013-05-16 2014-04-30 Verfahren zur Herstellung eines Leuchtstoffs, Leuchtstoff und optoelektronisches Bauelement

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102013105056.5A Withdrawn DE102013105056A1 (de) 2013-05-16 2013-05-16 Verfahren zur Herstellung eines Leuchtstoffs, Leuchtstoff und optoelektronisches Bauelement

Country Status (5)

Country Link
US (1) US10174245B2 (de)
JP (1) JP2016523998A (de)
CN (1) CN105209571A (de)
DE (2) DE102013105056A1 (de)
WO (1) WO2014184003A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019106546A1 (de) * 2019-03-14 2020-09-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung von optoelektronischen halbleiterbauteilen und optoelektronisches halbleiterbauteil
TWI809087B (zh) * 2019-04-11 2023-07-21 晶元光電股份有限公司 發光二極體封裝

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4165318B2 (ja) * 2003-07-16 2008-10-15 宇部興産株式会社 サイアロン系蛍光体およびその製造方法
JP3837588B2 (ja) 2003-11-26 2006-10-25 独立行政法人物質・材料研究機構 蛍光体と蛍光体を用いた発光器具
JP4165412B2 (ja) 2004-02-13 2008-10-15 昭栄化学工業株式会社 窒化物蛍光体、窒化物蛍光体の製造方法、白色発光素子及び顔料
JP4511885B2 (ja) 2004-07-09 2010-07-28 Ｄｏｗａエレクトロニクス株式会社 蛍光体及びｌｅｄ並びに光源
JP5105347B2 (ja) * 2004-09-22 2012-12-26 独立行政法人物質・材料研究機構 蛍光体とその製造方法および発光器具
US7671529B2 (en) 2004-12-10 2010-03-02 Philips Lumileds Lighting Company, Llc Phosphor converted light emitting device
JP4756261B2 (ja) 2005-01-27 2011-08-24 独立行政法人物質・材料研究機構 蛍光体とその製造方法および発光器具
DE112006001722B4 (de) * 2005-07-01 2021-05-06 National Institute For Materials Science Leuchtstoff und Verfahren zu dessen Herstellung sowie Verwendung des Leuchtstoffs
US7262439B2 (en) 2005-11-22 2007-08-28 Lumination Llc Charge compensated nitride phosphors for use in lighting applications
DE102005059521A1 (de) 2005-12-13 2007-06-14 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Rot emittierender Leuchtstoff und Lichtquelle mit einem derartigen Leuchtstoff
JP5188687B2 (ja) * 2006-07-18 2013-04-24 昭和電工株式会社 蛍光体及びその製造法並びに発光装置
KR100761865B1 (ko) * 2006-09-19 2007-09-28 황유신 온수기의 히터장치
JP5412710B2 (ja) 2007-01-31 2014-02-12 日亜化学工業株式会社 窒化物系蛍光体又は酸窒化物系蛍光体
DE102007033026A1 (de) 2007-07-16 2009-01-22 Osram Gesellschaft mit beschränkter Haftung Leuchtstoffmischung für eine Entladungslampe und Entladungslampe, insbesondere Hg-Niederdruckentladungslampe
DE102008058295A1 (de) 2008-11-20 2010-05-27 Osram Gesellschaft mit beschränkter Haftung Rot emittierender Leuchtstoff aus der Klasse der Nitridosilikate und Lichtquelle mit derartigem Leuchtstoff sowie Verfahren zur Herstellung des Leuchtstoffs
DE102009032711A1 (de) * 2009-07-11 2011-01-20 Merck Patent Gmbh Co-dotierte Silicooxynitride
WO2011028033A2 (ko) 2009-09-02 2011-03-10 엘지이노텍주식회사 형광체, 형광체 제조방법 및 백색 발광 소자
KR101565988B1 (ko) 2009-10-23 2015-11-05 삼성전자주식회사 적색형광체, 그 제조방법, 이를 이용한 발광소자 패키지, 조명장치
KR101164918B1 (ko) 2010-05-27 2012-07-19 대덕지디에스 주식회사 태양전지모듈 및 그 제조방법
KR101856534B1 (ko) 2011-12-07 2018-05-14 삼성전자주식회사 산질화물계 형광체 및 이를 포함하는 발광장치

Also Published As

Publication number Publication date
US20160122637A1 (en) 2016-05-05
CN105209571A (zh) 2015-12-30
JP2016523998A (ja) 2016-08-12
WO2014184003A1 (de) 2014-11-20
DE102013105056A1 (de) 2014-11-20
US10174245B2 (en) 2019-01-08

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