DE112015004068A5 - Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements - Google Patents

Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements Download PDF

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Publication number
DE112015004068A5
DE112015004068A5 DE112015004068.4T DE112015004068T DE112015004068A5 DE 112015004068 A5 DE112015004068 A5 DE 112015004068A5 DE 112015004068 T DE112015004068 T DE 112015004068T DE 112015004068 A5 DE112015004068 A5 DE 112015004068A5
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DE
Germany
Prior art keywords
producing
semiconductor component
optoelectronic semiconductor
optoelectronic
component
Prior art date
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Granted
Application number
DE112015004068.4T
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English (en)
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DE112015004068B4 (de
Inventor
Isabel Otto
Ion Stoll
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
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Publication of DE112015004068A5 publication Critical patent/DE112015004068A5/de
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/02—Electrophoretic coating characterised by the process with inorganic material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/12—Electrophoretic coating characterised by the process characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Luminescent Compositions (AREA)
  • Light Receiving Elements (AREA)
  • Led Device Packages (AREA)
  • Optical Filters (AREA)
DE112015004068.4T 2014-09-04 2015-08-27 Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements Active DE112015004068B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014112769.2 2014-09-04
DE102014112769.2A DE102014112769A1 (de) 2014-09-04 2014-09-04 Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements
PCT/EP2015/069645 WO2016034489A1 (de) 2014-09-04 2015-08-27 Verfahren zur herstellung eines optoelektronischen halbleiterbauelements

Publications (2)

Publication Number Publication Date
DE112015004068A5 true DE112015004068A5 (de) 2017-06-29
DE112015004068B4 DE112015004068B4 (de) 2023-01-19

Family

ID=54007726

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102014112769.2A Withdrawn DE102014112769A1 (de) 2014-09-04 2014-09-04 Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements
DE112015004068.4T Active DE112015004068B4 (de) 2014-09-04 2015-08-27 Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102014112769.2A Withdrawn DE102014112769A1 (de) 2014-09-04 2014-09-04 Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements

Country Status (4)

Country Link
US (1) US9825208B2 (de)
JP (1) JP6333473B2 (de)
DE (2) DE102014112769A1 (de)
WO (1) WO2016034489A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016115533A1 (de) * 2016-08-22 2018-02-22 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip, Verfahren zur Herstellung eines optoelektronischen Halbleiterchips und Scheinwerfer mit einem optoelektronischen Halbleiterchip
US10923635B2 (en) 2016-12-30 2021-02-16 Lumileds Llc Phosphor deposition system for LEDs
DE102017107939A1 (de) 2017-04-12 2018-10-18 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Bauelements und optoelektronisches Bauelement
KR102421729B1 (ko) 2017-12-14 2022-07-15 삼성전자주식회사 발광소자 패키지 및 이를 이용한 디스플레이 장치
US20190198720A1 (en) * 2017-12-22 2019-06-27 Lumileds Llc Particle systems and patterning for monolithic led arrays
KR20200095090A (ko) * 2019-01-31 2020-08-10 삼성전자주식회사 표시 장치 및 표시 장치의 제조 방법
US11088302B2 (en) * 2019-07-08 2021-08-10 Osram Opto Semiconductors Gmbh Light-emitting device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05119209A (ja) * 1991-10-24 1993-05-18 Dainippon Printing Co Ltd カラーフイルタ製造方法およびカラーフイルタ製造用の電着基板
US5608568A (en) * 1994-04-11 1997-03-04 The Johns Hopkins University Thin film vanadium oxide spatial light modulators and methods
US7335551B2 (en) * 2005-01-13 2008-02-26 Intelleflex Corp. Method to fabricate a thin film non volatile memory device scalable to small sizes
DE102011111980A1 (de) * 2011-08-29 2013-02-28 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Leuchtdiode und Leuchtdiode
DE102012106859B4 (de) * 2012-07-27 2019-01-03 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines mehrfarbigen LED-Displays
DE102012108704A1 (de) * 2012-09-17 2014-03-20 Osram Opto Semiconductors Gmbh Verfahren zur Fixierung einer matrixfreien elektrophoretisch abgeschiedenen Schicht auf einem Halbleiterchip und strahlungsemittierendes Halbleiterbauelement
DE102012108996A1 (de) * 2012-09-24 2014-04-17 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Vielzahl strahlungsemittierender Bauelemente und strahlungsemittierendes Bauelement
DE102013109031B4 (de) 2013-08-21 2021-11-04 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines optoelektronischen Halbleiterchips

Also Published As

Publication number Publication date
DE102014112769A1 (de) 2016-03-10
JP2017535060A (ja) 2017-11-24
JP6333473B2 (ja) 2018-05-30
WO2016034489A1 (de) 2016-03-10
WO2016034489A9 (de) 2016-12-15
DE112015004068B4 (de) 2023-01-19
US20170250323A1 (en) 2017-08-31
US9825208B2 (en) 2017-11-21

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