JP2016512926A5 - - Google Patents

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Publication number
JP2016512926A5
JP2016512926A5 JP2016502148A JP2016502148A JP2016512926A5 JP 2016512926 A5 JP2016512926 A5 JP 2016512926A5 JP 2016502148 A JP2016502148 A JP 2016502148A JP 2016502148 A JP2016502148 A JP 2016502148A JP 2016512926 A5 JP2016512926 A5 JP 2016512926A5
Authority
JP
Japan
Prior art keywords
adhesive
window
polishing
opening
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016502148A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016512926A (ja
JP6231656B2 (ja
Filing date
Publication date
Priority claimed from US13/839,899 external-priority patent/US8961266B2/en
Application filed filed Critical
Publication of JP2016512926A publication Critical patent/JP2016512926A/ja
Publication of JP2016512926A5 publication Critical patent/JP2016512926A5/ja
Application granted granted Critical
Publication of JP6231656B2 publication Critical patent/JP6231656B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2016502148A 2013-03-15 2014-03-13 補助窓シール付き研磨パッド Active JP6231656B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/839,899 US8961266B2 (en) 2013-03-15 2013-03-15 Polishing pad with secondary window seal
US13/839,899 2013-03-15
PCT/US2014/026455 WO2014151791A1 (en) 2013-03-15 2014-03-13 Polishing pad with secondary window seal

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017202430A Division JP6435391B2 (ja) 2013-03-15 2017-10-19 補助窓シール付き研磨パッド

Publications (3)

Publication Number Publication Date
JP2016512926A JP2016512926A (ja) 2016-05-09
JP2016512926A5 true JP2016512926A5 (https=) 2017-04-27
JP6231656B2 JP6231656B2 (ja) 2017-11-15

Family

ID=51529190

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2016502148A Active JP6231656B2 (ja) 2013-03-15 2014-03-13 補助窓シール付き研磨パッド
JP2017202430A Active JP6435391B2 (ja) 2013-03-15 2017-10-19 補助窓シール付き研磨パッド

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2017202430A Active JP6435391B2 (ja) 2013-03-15 2017-10-19 補助窓シール付き研磨パッド

Country Status (6)

Country Link
US (5) US8961266B2 (https=)
JP (2) JP6231656B2 (https=)
KR (1) KR102137732B1 (https=)
CN (1) CN105144349B (https=)
TW (3) TWI587977B (https=)
WO (1) WO2014151791A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8961266B2 (en) * 2013-03-15 2015-02-24 Applied Materials, Inc. Polishing pad with secondary window seal
US9868185B2 (en) 2015-11-03 2018-01-16 Cabot Microelectronics Corporation Polishing pad with foundation layer and window attached thereto

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5893796A (en) 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US20040082271A1 (en) * 1999-01-25 2004-04-29 Wiswesser Andreas Norbert Polishing pad with window
US6832950B2 (en) 2002-10-28 2004-12-21 Applied Materials, Inc. Polishing pad with window
US6524164B1 (en) 1999-09-14 2003-02-25 Applied Materials, Inc. Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
DE60011798T2 (de) * 1999-09-29 2005-11-10 Rohm and Haas Electronic Materials CMP Holdings, Inc., Wilmington Schleifkissen
US8485862B2 (en) 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
JP2003133270A (ja) * 2001-10-26 2003-05-09 Jsr Corp 化学機械研磨用窓材及び研磨パッド
US7175503B2 (en) 2002-02-04 2007-02-13 Kla-Tencor Technologies Corp. Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device
JP2004106174A (ja) 2002-08-30 2004-04-08 Toray Ind Inc 研磨パッド、定盤ホールカバー及び研磨装置並びに研磨方法及び半導体デバイスの製造方法
US20040224611A1 (en) 2003-04-22 2004-11-11 Jsr Corporation Polishing pad and method of polishing a semiconductor wafer
JP2004343090A (ja) 2003-04-22 2004-12-02 Jsr Corp 研磨パッドおよび半導体ウェハの研磨方法
KR100532440B1 (ko) * 2003-06-05 2005-11-30 삼성전자주식회사 윈도로의 유체의 침투를 막는 실링 장벽부를 가지는 화학기계적 연마 장비에 사용되는 연마 패드
US7871309B2 (en) 2004-12-10 2011-01-18 Toyo Tire & Rubber Co., Ltd. Polishing pad
JP2006190826A (ja) * 2005-01-06 2006-07-20 Toyo Tire & Rubber Co Ltd 研磨パッド及び半導体デバイスの製造方法
US20060159811A1 (en) * 2005-01-19 2006-07-20 United Technologies Corporation Convergent spray nozzle apparatus
JP2007260827A (ja) 2006-03-28 2007-10-11 Toyo Tire & Rubber Co Ltd 研磨パッドの製造方法
JP2007307639A (ja) * 2006-05-17 2007-11-29 Toyo Tire & Rubber Co Ltd 研磨パッド
US7942724B2 (en) 2006-07-03 2011-05-17 Applied Materials, Inc. Polishing pad with window having multiple portions
WO2008047631A1 (fr) * 2006-10-18 2008-04-24 Toyo Tire & Rubber Co., Ltd. Procédé pour produire un tampon à polir long
JP5274798B2 (ja) * 2007-08-20 2013-08-28 東洋ゴム工業株式会社 研磨パッド及びその製造方法
US8118641B2 (en) * 2009-03-04 2012-02-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having window with integral identification feature
WO2011008499A2 (en) 2009-06-30 2011-01-20 Applied Materials, Inc. Leak proof pad for cmp endpoint detection
US8393940B2 (en) * 2010-04-16 2013-03-12 Applied Materials, Inc. Molding windows in thin pads
US20110281510A1 (en) 2010-05-12 2011-11-17 Applied Materials, Inc. Pad Window Insert
JP5732354B2 (ja) * 2011-09-01 2015-06-10 東洋ゴム工業株式会社 研磨パッド
US8961266B2 (en) * 2013-03-15 2015-02-24 Applied Materials, Inc. Polishing pad with secondary window seal
JP6399956B2 (ja) 2015-03-31 2018-10-03 東ソー株式会社 ヘテロアセン誘導体、その製造方法、有機半導体層、及び有機薄膜トランジスタ
US9868185B2 (en) * 2015-11-03 2018-01-16 Cabot Microelectronics Corporation Polishing pad with foundation layer and window attached thereto
US10213894B2 (en) * 2016-02-26 2019-02-26 Applied Materials, Inc. Method of placing window in thin polishing pad
TWI650202B (zh) * 2017-08-22 2019-02-11 智勝科技股份有限公司 研磨墊、研磨墊的製造方法及研磨方法
CN109202693B (zh) * 2017-10-16 2021-10-12 Skc索密思株式会社 防泄漏抛光垫及其制造方法

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