JP6231656B2 - 補助窓シール付き研磨パッド - Google Patents

補助窓シール付き研磨パッド Download PDF

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Publication number
JP6231656B2
JP6231656B2 JP2016502148A JP2016502148A JP6231656B2 JP 6231656 B2 JP6231656 B2 JP 6231656B2 JP 2016502148 A JP2016502148 A JP 2016502148A JP 2016502148 A JP2016502148 A JP 2016502148A JP 6231656 B2 JP6231656 B2 JP 6231656B2
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Japan
Prior art keywords
polishing
window
adhesive
opening
area
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JP2016502148A
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English (en)
Japanese (ja)
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JP2016512926A (ja
JP2016512926A5 (https=
Inventor
ラジクマール アラガルサミー
ラジクマール アラガルサミー
ヨンチ フー
ヨンチ フー
サイモン ヤヴェルバーグ
サイモン ヤヴェルバーグ
ペリヤ ゴパラン
ペリヤ ゴパラン
クリストファー アール マホン
クリストファー アール マホン
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Applied Materials Inc
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Applied Materials Inc
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Publication of JP2016512926A publication Critical patent/JP2016512926A/ja
Publication of JP2016512926A5 publication Critical patent/JP2016512926A5/ja
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Publication of JP6231656B2 publication Critical patent/JP6231656B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2016502148A 2013-03-15 2014-03-13 補助窓シール付き研磨パッド Active JP6231656B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/839,899 US8961266B2 (en) 2013-03-15 2013-03-15 Polishing pad with secondary window seal
US13/839,899 2013-03-15
PCT/US2014/026455 WO2014151791A1 (en) 2013-03-15 2014-03-13 Polishing pad with secondary window seal

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017202430A Division JP6435391B2 (ja) 2013-03-15 2017-10-19 補助窓シール付き研磨パッド

Publications (3)

Publication Number Publication Date
JP2016512926A JP2016512926A (ja) 2016-05-09
JP2016512926A5 JP2016512926A5 (https=) 2017-04-27
JP6231656B2 true JP6231656B2 (ja) 2017-11-15

Family

ID=51529190

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2016502148A Active JP6231656B2 (ja) 2013-03-15 2014-03-13 補助窓シール付き研磨パッド
JP2017202430A Active JP6435391B2 (ja) 2013-03-15 2017-10-19 補助窓シール付き研磨パッド

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2017202430A Active JP6435391B2 (ja) 2013-03-15 2017-10-19 補助窓シール付き研磨パッド

Country Status (6)

Country Link
US (5) US8961266B2 (https=)
JP (2) JP6231656B2 (https=)
KR (1) KR102137732B1 (https=)
CN (1) CN105144349B (https=)
TW (3) TWI587977B (https=)
WO (1) WO2014151791A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8961266B2 (en) * 2013-03-15 2015-02-24 Applied Materials, Inc. Polishing pad with secondary window seal
US9868185B2 (en) 2015-11-03 2018-01-16 Cabot Microelectronics Corporation Polishing pad with foundation layer and window attached thereto

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5893796A (en) 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US20040082271A1 (en) * 1999-01-25 2004-04-29 Wiswesser Andreas Norbert Polishing pad with window
US6832950B2 (en) 2002-10-28 2004-12-21 Applied Materials, Inc. Polishing pad with window
US6524164B1 (en) 1999-09-14 2003-02-25 Applied Materials, Inc. Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
DE60011798T2 (de) * 1999-09-29 2005-11-10 Rohm and Haas Electronic Materials CMP Holdings, Inc., Wilmington Schleifkissen
US8485862B2 (en) 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
JP2003133270A (ja) * 2001-10-26 2003-05-09 Jsr Corp 化学機械研磨用窓材及び研磨パッド
US7175503B2 (en) 2002-02-04 2007-02-13 Kla-Tencor Technologies Corp. Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device
JP2004106174A (ja) 2002-08-30 2004-04-08 Toray Ind Inc 研磨パッド、定盤ホールカバー及び研磨装置並びに研磨方法及び半導体デバイスの製造方法
US20040224611A1 (en) 2003-04-22 2004-11-11 Jsr Corporation Polishing pad and method of polishing a semiconductor wafer
JP2004343090A (ja) 2003-04-22 2004-12-02 Jsr Corp 研磨パッドおよび半導体ウェハの研磨方法
KR100532440B1 (ko) * 2003-06-05 2005-11-30 삼성전자주식회사 윈도로의 유체의 침투를 막는 실링 장벽부를 가지는 화학기계적 연마 장비에 사용되는 연마 패드
US7871309B2 (en) 2004-12-10 2011-01-18 Toyo Tire & Rubber Co., Ltd. Polishing pad
JP2006190826A (ja) * 2005-01-06 2006-07-20 Toyo Tire & Rubber Co Ltd 研磨パッド及び半導体デバイスの製造方法
US20060159811A1 (en) * 2005-01-19 2006-07-20 United Technologies Corporation Convergent spray nozzle apparatus
JP2007260827A (ja) 2006-03-28 2007-10-11 Toyo Tire & Rubber Co Ltd 研磨パッドの製造方法
JP2007307639A (ja) * 2006-05-17 2007-11-29 Toyo Tire & Rubber Co Ltd 研磨パッド
US7942724B2 (en) 2006-07-03 2011-05-17 Applied Materials, Inc. Polishing pad with window having multiple portions
WO2008047631A1 (fr) * 2006-10-18 2008-04-24 Toyo Tire & Rubber Co., Ltd. Procédé pour produire un tampon à polir long
JP5274798B2 (ja) * 2007-08-20 2013-08-28 東洋ゴム工業株式会社 研磨パッド及びその製造方法
US8118641B2 (en) * 2009-03-04 2012-02-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having window with integral identification feature
WO2011008499A2 (en) 2009-06-30 2011-01-20 Applied Materials, Inc. Leak proof pad for cmp endpoint detection
US8393940B2 (en) * 2010-04-16 2013-03-12 Applied Materials, Inc. Molding windows in thin pads
US20110281510A1 (en) 2010-05-12 2011-11-17 Applied Materials, Inc. Pad Window Insert
JP5732354B2 (ja) * 2011-09-01 2015-06-10 東洋ゴム工業株式会社 研磨パッド
US8961266B2 (en) * 2013-03-15 2015-02-24 Applied Materials, Inc. Polishing pad with secondary window seal
JP6399956B2 (ja) 2015-03-31 2018-10-03 東ソー株式会社 ヘテロアセン誘導体、その製造方法、有機半導体層、及び有機薄膜トランジスタ
US9868185B2 (en) * 2015-11-03 2018-01-16 Cabot Microelectronics Corporation Polishing pad with foundation layer and window attached thereto
US10213894B2 (en) * 2016-02-26 2019-02-26 Applied Materials, Inc. Method of placing window in thin polishing pad
TWI650202B (zh) * 2017-08-22 2019-02-11 智勝科技股份有限公司 研磨墊、研磨墊的製造方法及研磨方法
CN109202693B (zh) * 2017-10-16 2021-10-12 Skc索密思株式会社 防泄漏抛光垫及其制造方法

Also Published As

Publication number Publication date
JP2016512926A (ja) 2016-05-09
US20150126100A1 (en) 2015-05-07
WO2014151791A1 (en) 2014-09-25
US11618124B2 (en) 2023-04-04
KR20150132844A (ko) 2015-11-26
TW201446412A (zh) 2014-12-16
US20180065227A1 (en) 2018-03-08
JP6435391B2 (ja) 2018-12-05
US20230278158A1 (en) 2023-09-07
TWI615241B (zh) 2018-02-21
JP2018026588A (ja) 2018-02-15
KR102137732B1 (ko) 2020-07-24
US12330260B2 (en) 2025-06-17
US10744618B2 (en) 2020-08-18
TWI587977B (zh) 2017-06-21
TW201805110A (zh) 2018-02-16
US20200361054A1 (en) 2020-11-19
US20140273762A1 (en) 2014-09-18
CN105144349A (zh) 2015-12-09
US8961266B2 (en) 2015-02-24
CN105144349B (zh) 2017-06-16
TWI639487B (zh) 2018-11-01
US9731397B2 (en) 2017-08-15
TW201628784A (zh) 2016-08-16

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