JP2019072835A5 - - Google Patents

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Publication number
JP2019072835A5
JP2019072835A5 JP2018169469A JP2018169469A JP2019072835A5 JP 2019072835 A5 JP2019072835 A5 JP 2019072835A5 JP 2018169469 A JP2018169469 A JP 2018169469A JP 2018169469 A JP2018169469 A JP 2018169469A JP 2019072835 A5 JP2019072835 A5 JP 2019072835A5
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JP
Japan
Prior art keywords
polishing
layer
pad
end point
cmp
Prior art date
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Application number
JP2018169469A
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English (en)
Japanese (ja)
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JP7338959B2 (ja
JP2019072835A (ja
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Priority claimed from US15/705,561 external-priority patent/US10569383B2/en
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Publication of JP2019072835A publication Critical patent/JP2019072835A/ja
Publication of JP2019072835A5 publication Critical patent/JP2019072835A5/ja
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Publication of JP7338959B2 publication Critical patent/JP7338959B2/ja
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JP2018169469A 2017-09-15 2018-09-11 フランジ付き光学的終了点検出窓及びそれを含むｃｍｐ用研磨パッド Active JP7338959B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/705,561 2017-09-15
US15/705,561 US10569383B2 (en) 2017-09-15 2017-09-15 Flanged optical endpoint detection windows and CMP polishing pads containing them

Publications (3)

Publication Number Publication Date
JP2019072835A JP2019072835A (ja) 2019-05-16
JP2019072835A5 true JP2019072835A5 (https=) 2021-10-07
JP7338959B2 JP7338959B2 (ja) 2023-09-05

Family

ID=65719742

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018169469A Active JP7338959B2 (ja) 2017-09-15 2018-09-11 フランジ付き光学的終了点検出窓及びそれを含むｃｍｐ用研磨パッド

Country Status (5)

Country Link
US (1) US10569383B2 (https=)
JP (1) JP7338959B2 (https=)
KR (1) KR102604048B1 (https=)
CN (1) CN109500728A (https=)
TW (1) TWI784039B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102026250B1 (ko) * 2018-02-05 2019-09-27 에스케이실트론 주식회사 웨이퍼 연마 장치용 연마 패드 및 그의 제조방법
US20210299816A1 (en) * 2020-03-25 2021-09-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cmp polishing pad with protruding structures having engineered open void space
US11633830B2 (en) * 2020-06-24 2023-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad with uniform window
US20220226956A1 (en) * 2021-01-15 2022-07-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacture of polishing pads having two or more endpoint detection windows
KR102937575B1 (ko) 2021-03-03 2026-03-11 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마를 위한 음향 모니터링 및 센서들
JP7659172B2 (ja) * 2021-03-26 2025-04-09 富士紡ホールディングス株式会社 研磨パッド
JP7777993B2 (ja) * 2022-01-20 2025-12-01 株式会社クラレ 研磨パッド及びその製造方法

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JP3431115B2 (ja) 1995-03-28 2003-07-28 アプライド マテリアルズ インコーポレイテッド ケミカルメカニカルポリシングの操作をインシチュウでモニタするための装置及び方法
US6676717B1 (en) * 1995-03-28 2004-01-13 Applied Materials Inc Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US5893796A (en) 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US6994607B2 (en) * 2001-12-28 2006-02-07 Applied Materials, Inc. Polishing pad with window
US6454630B1 (en) * 1999-09-14 2002-09-24 Applied Materials, Inc. Rotatable platen having a transparent window for a chemical mechanical polishing apparatus and method of making the same
US6524164B1 (en) * 1999-09-14 2003-02-25 Applied Materials, Inc. Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
US8485862B2 (en) 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
US6623331B2 (en) * 2001-02-16 2003-09-23 Cabot Microelectronics Corporation Polishing disk with end-point detection port
JP4570286B2 (ja) * 2001-07-03 2010-10-27 ニッタ・ハース株式会社 研磨パッド
JP2003188124A (ja) * 2001-12-14 2003-07-04 Rodel Nitta Co 研磨布
JP2004343090A (ja) * 2003-04-22 2004-12-02 Jsr Corp 研磨パッドおよび半導体ウェハの研磨方法
KR100541545B1 (ko) 2003-06-16 2006-01-11 삼성전자주식회사 화학기계적 연마 장비의 연마 테이블
US7195539B2 (en) * 2003-09-19 2007-03-27 Cabot Microelectronics Coporation Polishing pad with recessed window
US7264536B2 (en) 2003-09-23 2007-09-04 Applied Materials, Inc. Polishing pad with window
US7261625B2 (en) * 2005-02-07 2007-08-28 Inoac Corporation Polishing pad
JP4620501B2 (ja) * 2005-03-04 2011-01-26 ニッタ・ハース株式会社 研磨パッド
US7210980B2 (en) * 2005-08-26 2007-05-01 Applied Materials, Inc. Sealed polishing pad, system and methods
JP2007260827A (ja) * 2006-03-28 2007-10-11 Toyo Tire & Rubber Co Ltd 研磨パッドの製造方法
JP2007307639A (ja) 2006-05-17 2007-11-29 Toyo Tire & Rubber Co Ltd 研磨パッド
US7998358B2 (en) * 2006-10-31 2011-08-16 Applied Materials, Inc. Peak-based endpointing for chemical mechanical polishing
JP2008226911A (ja) * 2007-03-08 2008-09-25 Jsr Corp 化学機械研磨用パッド、化学機械研磨用積層体パッド、および化学機械研磨方法
JP2011125940A (ja) * 2009-12-16 2011-06-30 Toppan Printing Co Ltd 研磨装置
US8393940B2 (en) 2010-04-16 2013-03-12 Applied Materials, Inc. Molding windows in thin pads
US8920219B2 (en) * 2011-07-15 2014-12-30 Nexplanar Corporation Polishing pad with alignment aperture
US9669509B2 (en) 2012-09-28 2017-06-06 Thomas Engineering Solutions & Consulting, Llc Methods for external cleaning and inspection of tubulars
JP2014113644A (ja) 2012-12-06 2014-06-26 Toyo Tire & Rubber Co Ltd 研磨パッド
US9108290B2 (en) * 2013-03-07 2015-08-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad
US9186772B2 (en) * 2013-03-07 2015-11-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with broad spectrum, endpoint detection window and method of polishing therewith
US9446498B1 (en) * 2015-03-13 2016-09-20 rohm and Hass Electronic Materials CMP Holdings, Inc. Chemical mechanical polishing pad with window
US10092998B2 (en) * 2015-06-26 2018-10-09 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making composite polishing layer for chemical mechanical polishing pad

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