TWI784039B - Ｃｍｐ拋光墊及其製造方法 - Google Patents

Ｃｍｐ拋光墊及其製造方法 Download PDF

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Publication number
TWI784039B
TWI784039B TW107128770A TW107128770A TWI784039B TW I784039 B TWI784039 B TW I784039B TW 107128770 A TW107128770 A TW 107128770A TW 107128770 A TW107128770 A TW 107128770A TW I784039 B TWI784039 B TW I784039B
Authority
TW
Taiwan
Prior art keywords
polishing
polishing layer
endpoint detection
layer
subpad
Prior art date
Application number
TW107128770A
Other languages
English (en)
Chinese (zh)
Other versions
TW201916146A (zh
Inventor
史帝芬Ｇ 皮斯萊克
傑弗瑞詹姆士 漢卓恩
Original Assignee
美商羅門哈斯電子材料Ｃｍｐ控股公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商羅門哈斯電子材料Ｃｍｐ控股公司 filed Critical 美商羅門哈斯電子材料Ｃｍｐ控股公司
Publication of TW201916146A publication Critical patent/TW201916146A/zh
Application granted granted Critical
Publication of TWI784039B publication Critical patent/TWI784039B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0072—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW107128770A 2017-09-15 2018-08-17 Ｃｍｐ拋光墊及其製造方法 TWI784039B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/705,561 2017-09-15
US15/705,561 US10569383B2 (en) 2017-09-15 2017-09-15 Flanged optical endpoint detection windows and CMP polishing pads containing them
US15/705561 2017-09-15

Publications (2)

Publication Number Publication Date
TW201916146A TW201916146A (zh) 2019-04-16
TWI784039B true TWI784039B (zh) 2022-11-21

Family

ID=65719742

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107128770A TWI784039B (zh) 2017-09-15 2018-08-17 Ｃｍｐ拋光墊及其製造方法

Country Status (5)

Country Link
US (1) US10569383B2 (https=)
JP (1) JP7338959B2 (https=)
KR (1) KR102604048B1 (https=)
CN (1) CN109500728A (https=)
TW (1) TWI784039B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102026250B1 (ko) * 2018-02-05 2019-09-27 에스케이실트론 주식회사 웨이퍼 연마 장치용 연마 패드 및 그의 제조방법
US20210299816A1 (en) * 2020-03-25 2021-09-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cmp polishing pad with protruding structures having engineered open void space
US11633830B2 (en) * 2020-06-24 2023-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad with uniform window
US20220226956A1 (en) * 2021-01-15 2022-07-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacture of polishing pads having two or more endpoint detection windows
KR102937575B1 (ko) 2021-03-03 2026-03-11 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마를 위한 음향 모니터링 및 센서들
JP7659172B2 (ja) * 2021-03-26 2025-04-09 富士紡ホールディングス株式会社 研磨パッド
JP7777993B2 (ja) * 2022-01-20 2025-12-01 株式会社クラレ 研磨パッド及びその製造方法

Citations (1)

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Publication number Priority date Publication date Assignee Title
US6524164B1 (en) * 1999-09-14 2003-02-25 Applied Materials, Inc. Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus

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US6676717B1 (en) * 1995-03-28 2004-01-13 Applied Materials Inc Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US5893796A (en) 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US6994607B2 (en) * 2001-12-28 2006-02-07 Applied Materials, Inc. Polishing pad with window
US6454630B1 (en) * 1999-09-14 2002-09-24 Applied Materials, Inc. Rotatable platen having a transparent window for a chemical mechanical polishing apparatus and method of making the same
US8485862B2 (en) 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
US6623331B2 (en) * 2001-02-16 2003-09-23 Cabot Microelectronics Corporation Polishing disk with end-point detection port
JP4570286B2 (ja) * 2001-07-03 2010-10-27 ニッタ・ハース株式会社 研磨パッド
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US7195539B2 (en) * 2003-09-19 2007-03-27 Cabot Microelectronics Coporation Polishing pad with recessed window
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JP4620501B2 (ja) * 2005-03-04 2011-01-26 ニッタ・ハース株式会社 研磨パッド
US7210980B2 (en) * 2005-08-26 2007-05-01 Applied Materials, Inc. Sealed polishing pad, system and methods
JP2007260827A (ja) * 2006-03-28 2007-10-11 Toyo Tire & Rubber Co Ltd 研磨パッドの製造方法
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JP2011125940A (ja) * 2009-12-16 2011-06-30 Toppan Printing Co Ltd 研磨装置
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US8920219B2 (en) * 2011-07-15 2014-12-30 Nexplanar Corporation Polishing pad with alignment aperture
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US9108290B2 (en) * 2013-03-07 2015-08-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad
US9186772B2 (en) * 2013-03-07 2015-11-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with broad spectrum, endpoint detection window and method of polishing therewith
US9446498B1 (en) * 2015-03-13 2016-09-20 rohm and Hass Electronic Materials CMP Holdings, Inc. Chemical mechanical polishing pad with window
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US6524164B1 (en) * 1999-09-14 2003-02-25 Applied Materials, Inc. Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus

Also Published As

Publication number Publication date
TW201916146A (zh) 2019-04-16
KR102604048B1 (ko) 2023-11-21
JP7338959B2 (ja) 2023-09-05
JP2019072835A (ja) 2019-05-16
CN109500728A (zh) 2019-03-22
KR20190031142A (ko) 2019-03-25
US10569383B2 (en) 2020-02-25
US20190084120A1 (en) 2019-03-21

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