CN109500728A - 凸缘光学端点检测窗口和含有其的cmp抛光垫 - Google Patents

凸缘光学端点检测窗口和含有其的cmp抛光垫 Download PDF

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Publication number
CN109500728A
CN109500728A CN201810947639.9A CN201810947639A CN109500728A CN 109500728 A CN109500728 A CN 109500728A CN 201810947639 A CN201810947639 A CN 201810947639A CN 109500728 A CN109500728 A CN 109500728A
Authority
CN
China
Prior art keywords
polishing layer
polishing
subpad
cmp
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810947639.9A
Other languages
English (en)
Chinese (zh)
Inventor
S·G·皮斯克拉克
J·J·亨德伦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ROHM AND HAAS ELECTRONIC MATER
Original Assignee
ROHM AND HAAS ELECTRONIC MATER
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ROHM AND HAAS ELECTRONIC MATER filed Critical ROHM AND HAAS ELECTRONIC MATER
Publication of CN109500728A publication Critical patent/CN109500728A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0072—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CN201810947639.9A 2017-09-15 2018-08-20 凸缘光学端点检测窗口和含有其的cmp抛光垫 Pending CN109500728A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/705,561 US10569383B2 (en) 2017-09-15 2017-09-15 Flanged optical endpoint detection windows and CMP polishing pads containing them
US15/705561 2017-09-15

Publications (1)

Publication Number Publication Date
CN109500728A true CN109500728A (zh) 2019-03-22

Family

ID=65719742

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810947639.9A Pending CN109500728A (zh) 2017-09-15 2018-08-20 凸缘光学端点检测窗口和含有其的cmp抛光垫

Country Status (5)

Country Link
US (1) US10569383B2 (https=)
JP (1) JP7338959B2 (https=)
KR (1) KR102604048B1 (https=)
CN (1) CN109500728A (https=)
TW (1) TWI784039B (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113829232A (zh) * 2020-06-24 2021-12-24 罗门哈斯电子材料Cmp控股股份有限公司 具有均匀窗口的cmp抛光垫
CN114762960A (zh) * 2021-01-15 2022-07-19 罗门哈斯电子材料Cmp控股股份有限公司 制造具有两个或更多个终点检测窗口的抛光垫的方法
CN116887947A (zh) * 2021-03-26 2023-10-13 富士纺控股株式会社 研磨垫

Families Citing this family (4)

* Cited by examiner, † Cited by third party
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KR102026250B1 (ko) * 2018-02-05 2019-09-27 에스케이실트론 주식회사 웨이퍼 연마 장치용 연마 패드 및 그의 제조방법
US20210299816A1 (en) * 2020-03-25 2021-09-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cmp polishing pad with protruding structures having engineered open void space
KR102937575B1 (ko) 2021-03-03 2026-03-11 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마를 위한 음향 모니터링 및 센서들
JP7777993B2 (ja) * 2022-01-20 2025-12-01 株式会社クラレ 研磨パッド及びその製造方法

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JP2001291686A (ja) * 1999-09-14 2001-10-19 Applied Materials Inc 窓漏れの少ない透明窓を有するケミカルメカニカルポリシング装置用ポリシングパッド
JP2003188124A (ja) * 2001-12-14 2003-07-04 Rodel Nitta Co 研磨布
JP2011125940A (ja) * 2009-12-16 2011-06-30 Toppan Printing Co Ltd 研磨装置
CN103796797A (zh) * 2011-07-15 2014-05-14 内克斯普拉纳公司 具有孔口的抛光垫
JP2014172168A (ja) * 2013-03-07 2014-09-22 Rohm & Haas Electronic Materials Cmp Holdings Inc 広スペクトル終点検出ウィンドウを有するケミカルメカニカル研磨パッド及びそれを用いる研磨方法
CN105965382A (zh) * 2015-03-13 2016-09-28 罗门哈斯电子材料Cmp控股股份有限公司 具有窗口的化学机械抛光垫

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US6676717B1 (en) * 1995-03-28 2004-01-13 Applied Materials Inc Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US5893796A (en) 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US6994607B2 (en) * 2001-12-28 2006-02-07 Applied Materials, Inc. Polishing pad with window
US6454630B1 (en) * 1999-09-14 2002-09-24 Applied Materials, Inc. Rotatable platen having a transparent window for a chemical mechanical polishing apparatus and method of making the same
US8485862B2 (en) 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
US6623331B2 (en) * 2001-02-16 2003-09-23 Cabot Microelectronics Corporation Polishing disk with end-point detection port
JP4570286B2 (ja) * 2001-07-03 2010-10-27 ニッタ・ハース株式会社 研磨パッド
JP2004343090A (ja) * 2003-04-22 2004-12-02 Jsr Corp 研磨パッドおよび半導体ウェハの研磨方法
KR100541545B1 (ko) 2003-06-16 2006-01-11 삼성전자주식회사 화학기계적 연마 장비의 연마 테이블
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JP2014113644A (ja) 2012-12-06 2014-06-26 Toyo Tire & Rubber Co Ltd 研磨パッド
US9108290B2 (en) * 2013-03-07 2015-08-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad
US10092998B2 (en) * 2015-06-26 2018-10-09 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making composite polishing layer for chemical mechanical polishing pad

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001291686A (ja) * 1999-09-14 2001-10-19 Applied Materials Inc 窓漏れの少ない透明窓を有するケミカルメカニカルポリシング装置用ポリシングパッド
JP2003188124A (ja) * 2001-12-14 2003-07-04 Rodel Nitta Co 研磨布
JP2011125940A (ja) * 2009-12-16 2011-06-30 Toppan Printing Co Ltd 研磨装置
CN103796797A (zh) * 2011-07-15 2014-05-14 内克斯普拉纳公司 具有孔口的抛光垫
JP2014172168A (ja) * 2013-03-07 2014-09-22 Rohm & Haas Electronic Materials Cmp Holdings Inc 広スペクトル終点検出ウィンドウを有するケミカルメカニカル研磨パッド及びそれを用いる研磨方法
CN105965382A (zh) * 2015-03-13 2016-09-28 罗门哈斯电子材料Cmp控股股份有限公司 具有窗口的化学机械抛光垫

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113829232A (zh) * 2020-06-24 2021-12-24 罗门哈斯电子材料Cmp控股股份有限公司 具有均匀窗口的cmp抛光垫
CN113829232B (zh) * 2020-06-24 2024-07-12 罗门哈斯电子材料Cmp控股股份有限公司 具有均匀窗口的cmp抛光垫
CN114762960A (zh) * 2021-01-15 2022-07-19 罗门哈斯电子材料Cmp控股股份有限公司 制造具有两个或更多个终点检测窗口的抛光垫的方法
CN116887947A (zh) * 2021-03-26 2023-10-13 富士纺控股株式会社 研磨垫

Also Published As

Publication number Publication date
TWI784039B (zh) 2022-11-21
TW201916146A (zh) 2019-04-16
KR102604048B1 (ko) 2023-11-21
JP7338959B2 (ja) 2023-09-05
JP2019072835A (ja) 2019-05-16
KR20190031142A (ko) 2019-03-25
US10569383B2 (en) 2020-02-25
US20190084120A1 (en) 2019-03-21

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Application publication date: 20190322