JP7338959B2 - フランジ付き光学的終了点検出窓及びそれを含むｃｍｐ用研磨パッド - Google Patents

フランジ付き光学的終了点検出窓及びそれを含むｃｍｐ用研磨パッド Download PDF

Info

Publication number
JP7338959B2
JP7338959B2 JP2018169469A JP2018169469A JP7338959B2 JP 7338959 B2 JP7338959 B2 JP 7338959B2 JP 2018169469 A JP2018169469 A JP 2018169469A JP 2018169469 A JP2018169469 A JP 2018169469A JP 7338959 B2 JP7338959 B2 JP 7338959B2
Authority
JP
Japan
Prior art keywords
polishing
pad
layer
endpoint detection
chemical mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018169469A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019072835A5 (https=
JP2019072835A (ja
Inventor
スティーブン・ジー・ピスクラック
ジェフリー・ジェームズ・ヘンドロン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
DuPont Electronic Materials Holding Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, DuPont Electronic Materials Holding Inc filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of JP2019072835A publication Critical patent/JP2019072835A/ja
Publication of JP2019072835A5 publication Critical patent/JP2019072835A5/ja
Application granted granted Critical
Publication of JP7338959B2 publication Critical patent/JP7338959B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0072—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2018169469A 2017-09-15 2018-09-11 フランジ付き光学的終了点検出窓及びそれを含むｃｍｐ用研磨パッド Active JP7338959B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/705,561 2017-09-15
US15/705,561 US10569383B2 (en) 2017-09-15 2017-09-15 Flanged optical endpoint detection windows and CMP polishing pads containing them

Publications (3)

Publication Number Publication Date
JP2019072835A JP2019072835A (ja) 2019-05-16
JP2019072835A5 JP2019072835A5 (https=) 2021-10-07
JP7338959B2 true JP7338959B2 (ja) 2023-09-05

Family

ID=65719742

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018169469A Active JP7338959B2 (ja) 2017-09-15 2018-09-11 フランジ付き光学的終了点検出窓及びそれを含むｃｍｐ用研磨パッド

Country Status (5)

Country Link
US (1) US10569383B2 (https=)
JP (1) JP7338959B2 (https=)
KR (1) KR102604048B1 (https=)
CN (1) CN109500728A (https=)
TW (1) TWI784039B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102026250B1 (ko) * 2018-02-05 2019-09-27 에스케이실트론 주식회사 웨이퍼 연마 장치용 연마 패드 및 그의 제조방법
US20210299816A1 (en) * 2020-03-25 2021-09-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cmp polishing pad with protruding structures having engineered open void space
US11633830B2 (en) * 2020-06-24 2023-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad with uniform window
US20220226956A1 (en) * 2021-01-15 2022-07-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacture of polishing pads having two or more endpoint detection windows
KR102937575B1 (ko) 2021-03-03 2026-03-11 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마를 위한 음향 모니터링 및 센서들
JP7659172B2 (ja) * 2021-03-26 2025-04-09 富士紡ホールディングス株式会社 研磨パッド
JP7777993B2 (ja) * 2022-01-20 2025-12-01 株式会社クラレ 研磨パッド及びその製造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004343090A (ja) 2003-04-22 2004-12-02 Jsr Corp 研磨パッドおよび半導体ウェハの研磨方法
JP2006239833A (ja) 2005-03-04 2006-09-14 Nitta Haas Inc 研磨パッド
JP2007044872A (ja) 1999-09-14 2007-02-22 Applied Materials Inc 窓漏れの少ない透明窓を有するケミカルメカニカルポリシング装置用ポリシングパッド
JP2007260827A (ja) 2006-03-28 2007-10-11 Toyo Tire & Rubber Co Ltd 研磨パッドの製造方法
US20080099443A1 (en) 2006-10-31 2008-05-01 Applied Materials, Inc. Peak-based endpointing for chemical mechanical polishing
JP2008226911A (ja) 2007-03-08 2008-09-25 Jsr Corp 化学機械研磨用パッド、化学機械研磨用積層体パッド、および化学機械研磨方法
JP2014172169A (ja) 2013-03-07 2014-09-22 Rohm & Haas Electronic Materials Cmp Holdings Inc 多層ケミカルメカニカル研磨パッド
JP2017052079A (ja) 2015-06-26 2017-03-16 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド ケミカルメカニカル研磨パッドのための複合研磨層の製造方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3431115B2 (ja) 1995-03-28 2003-07-28 アプライド マテリアルズ インコーポレイテッド ケミカルメカニカルポリシングの操作をインシチュウでモニタするための装置及び方法
US6676717B1 (en) * 1995-03-28 2004-01-13 Applied Materials Inc Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US5893796A (en) 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US6994607B2 (en) * 2001-12-28 2006-02-07 Applied Materials, Inc. Polishing pad with window
US6454630B1 (en) * 1999-09-14 2002-09-24 Applied Materials, Inc. Rotatable platen having a transparent window for a chemical mechanical polishing apparatus and method of making the same
US8485862B2 (en) 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
US6623331B2 (en) * 2001-02-16 2003-09-23 Cabot Microelectronics Corporation Polishing disk with end-point detection port
JP4570286B2 (ja) * 2001-07-03 2010-10-27 ニッタ・ハース株式会社 研磨パッド
JP2003188124A (ja) * 2001-12-14 2003-07-04 Rodel Nitta Co 研磨布
KR100541545B1 (ko) 2003-06-16 2006-01-11 삼성전자주식회사 화학기계적 연마 장비의 연마 테이블
US7195539B2 (en) * 2003-09-19 2007-03-27 Cabot Microelectronics Coporation Polishing pad with recessed window
US7264536B2 (en) 2003-09-23 2007-09-04 Applied Materials, Inc. Polishing pad with window
US7261625B2 (en) * 2005-02-07 2007-08-28 Inoac Corporation Polishing pad
US7210980B2 (en) * 2005-08-26 2007-05-01 Applied Materials, Inc. Sealed polishing pad, system and methods
JP2007307639A (ja) 2006-05-17 2007-11-29 Toyo Tire & Rubber Co Ltd 研磨パッド
JP2011125940A (ja) * 2009-12-16 2011-06-30 Toppan Printing Co Ltd 研磨装置
US8393940B2 (en) 2010-04-16 2013-03-12 Applied Materials, Inc. Molding windows in thin pads
US8920219B2 (en) * 2011-07-15 2014-12-30 Nexplanar Corporation Polishing pad with alignment aperture
US9669509B2 (en) 2012-09-28 2017-06-06 Thomas Engineering Solutions & Consulting, Llc Methods for external cleaning and inspection of tubulars
JP2014113644A (ja) 2012-12-06 2014-06-26 Toyo Tire & Rubber Co Ltd 研磨パッド
US9186772B2 (en) * 2013-03-07 2015-11-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with broad spectrum, endpoint detection window and method of polishing therewith
US9446498B1 (en) * 2015-03-13 2016-09-20 rohm and Hass Electronic Materials CMP Holdings, Inc. Chemical mechanical polishing pad with window

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007044872A (ja) 1999-09-14 2007-02-22 Applied Materials Inc 窓漏れの少ない透明窓を有するケミカルメカニカルポリシング装置用ポリシングパッド
JP2004343090A (ja) 2003-04-22 2004-12-02 Jsr Corp 研磨パッドおよび半導体ウェハの研磨方法
JP2006239833A (ja) 2005-03-04 2006-09-14 Nitta Haas Inc 研磨パッド
JP2007260827A (ja) 2006-03-28 2007-10-11 Toyo Tire & Rubber Co Ltd 研磨パッドの製造方法
US20080099443A1 (en) 2006-10-31 2008-05-01 Applied Materials, Inc. Peak-based endpointing for chemical mechanical polishing
JP2008226911A (ja) 2007-03-08 2008-09-25 Jsr Corp 化学機械研磨用パッド、化学機械研磨用積層体パッド、および化学機械研磨方法
JP2014172169A (ja) 2013-03-07 2014-09-22 Rohm & Haas Electronic Materials Cmp Holdings Inc 多層ケミカルメカニカル研磨パッド
JP2017052079A (ja) 2015-06-26 2017-03-16 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド ケミカルメカニカル研磨パッドのための複合研磨層の製造方法

Also Published As

Publication number Publication date
TWI784039B (zh) 2022-11-21
TW201916146A (zh) 2019-04-16
KR102604048B1 (ko) 2023-11-21
JP2019072835A (ja) 2019-05-16
CN109500728A (zh) 2019-03-22
KR20190031142A (ko) 2019-03-25
US10569383B2 (en) 2020-02-25
US20190084120A1 (en) 2019-03-21

Similar Documents

Publication Publication Date Title
JP7338959B2 (ja) フランジ付き光学的終了点検出窓及びそれを含むｃｍｐ用研磨パッド
EP2523777B1 (en) Cmp pad with local area transparency
US9597769B2 (en) Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
TWI616277B (zh) 具終點偵測窗之化學機械硏磨墊
KR102590761B1 (ko) 화학적 기계적 연마 패드
JP7207963B2 (ja) Ｃｍｐ研磨パッドのための高いｕｖ透過率を有する脂肪族ｕｖ硬化ポリウレタン光学的終点検出窓
TW201607677A (zh) 具有硏磨層及窗之化學機械硏磨墊
KR20210158808A (ko) 균일 윈도우를 갖는 cmp 폴리싱 패드
KR102528904B1 (ko) 지방족 폴리우레탄 광학 종점 검출창 및 이들을 함유하는 cmp 연마 패드
CN105729326B (zh) 制造化学机械抛光垫的方法
US20220023991A1 (en) Polishing pads and systems and methods of making and using the same
JP4744087B2 (ja) 研磨パッド及び半導体デバイスの製造方法
CN105842255B (zh) 抛光层分析器和方法
CN105729296B (zh) 化学机械抛光垫、抛光层分析器和方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210827

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210827

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20220628

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220726

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20221024

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230314

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230405

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20230801

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20230824

R150 Certificate of patent or registration of utility model

Ref document number: 7338959

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350