JP2016509374A - 輻射線検出用半導体素子及び輻射線検出用半導体素子の製造方法 - Google Patents
輻射線検出用半導体素子及び輻射線検出用半導体素子の製造方法 Download PDFInfo
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Abstract
Description
2 集積回路
3 輻射線感応部品
4 配線
5 基板貫通ビア
6 誘電体層
7 構造化フィルタ層
8 金属間層
9 パッシベーション層
10 裏面
11 主面
12 組込フィルタ層
13 パッシベーション層の開口
14 コーティング層
15 金属膜
16 接続領域
17 裏面配線
18 誘電体層
19 バンプ
20 パッシベーション層
21 第1作業用ウェーハ
22 第2作業用ウェーハ
23 第3作業用ウェーハ
24 熱酸化物
25 接合層
26 接合層
27 接続領域
28 構造化フィルタ層の第1層
29 構造化フィルタ層の第2層
d 距離
tn 厚み
Claims (11)
- 主面(11)を有した半導体基板(1)と、
半導体材料の少なくとも1種の化合物からなり、前記主面(11)の上または上方に配置されて、金属間層(8)を備える誘電体層(6)と、
前記半導体基板(1)の前記主面(11)または前記主面(11)の近傍に配置され、少なくとも1つの輻射線感応部品(3)を含む集積回路(2)と、
前記金属間層(8)に配置された前記集積回路(2)用の配線(4)と、
前記配線(4)に接続された導電性の基板貫通ビア(5)と、
前記輻射線感応部品(3)の上方の前記誘電体層(6)の直上に配置された光学フィルタ素子(7)とを備え、
前記誘電体層(6)は、前記基板貫通ビア(5)の少なくとも上方に、前記金属間層(8)とは異なる誘電体材料からなるパッシベーション層(9)を備えており、
前記配線(4)は、前記主面(11)と前記パッシベーション層(9)との間に配置される
ことを特徴とする輻射線検出用半導体素子。 - 前記パッシベーション層(9)は、前記金属間層(8)の中または上に配置されて、前記輻射線感応部品(3)の上方に開口(13)を備え、
前記金属間層(8)は、前記開口(13)の内側に前記パッシベーション層(9)を有しておらず、
前記光学フィルタ素子(7)は、前記パッシベーション層(9)の前記開口(13)の上方または内側の前記金属間層(8)の上に配置される
ことを特徴とする請求項1に記載の輻射線検出用半導体素子。 - 前記光学フィルタ素子(7)は、干渉フィルタを構成する第1構造化フィルタ層(28)と、RGBフィルタの少なくとも1つの色成分のフィルタを構成する第2構造化フィルタ層(29)とを備えることを特徴とする請求項1または2に記載の輻射線検出用半導体素子。
- 前記誘電体層(6)の中に配置され、前記光学フィルタ素子(7)から離間し、前記輻射線感応部品(3)と前記光学フィルタ素子(7)との間に位置する組込フィルタ層(12)を更に備えることを特徴とする請求項1〜3のいずれかに記載の輻射線検出用半導体素子。
- 前記誘電体層(6)は金属間層(8)を構成し、前記配線(4)の金属層と前記組込フィルタ層(12)とは、前記金属間層(8)の中に配置され、前記組込フィルタ層(12)は、前記金属間層(8)の中に配置された金属層に形成されることを特徴とする請求項1〜4のいずれかに記載の輻射線検出用半導体素子。
- 前記半導体基板(1)と前記誘電体層(6)とは、厚み(d)が合わせて250μm未満であることを特徴とする請求項1〜5のいずれかに記載の輻射線検出用半導体素子。
- 輻射線検出用半導体素子の製造方法であって、
主面(11)または主面(11)の近傍に少なくとも1つの輻射線感応部品(3)を含む集積回路(2)を有した半導体基板(1)を準備する工程と、
前記主面(11)の上または上方に、半導体材料の少なくとも1種の化合物からなる誘電体層(6)を配置する工程と、
前記誘電体層(6)の中に前記集積回路(2)用の配線(4)を配置する工程と、
前記主面(11)の裏側となる裏面(10)から前記配線(4)に接続される導電性の基板貫通ビア(5)を形成する工程と、
前記輻射線感応部品(3)の上方の前記誘電体層(6)の直上に光学フィルタ素子(7)を配置する工程とを備え、
前記誘電体層(6)は、金属間層(8)とパッシベーション層(9)とを備えて形成され、
前記パッシベーション層(9)は、前記輻射線感応部品(3)の上方に開口(13)が設けられ、
前記金属間層(8)は、前記開口(13)の内側に前記パッシベーション層(9)を有しておらず、
前記光学フィルタ素子(7)は、前記パッシベーション層(9)の前記開口(13)の内側の前記金属間層(8)の上に配置される
ことを特徴とする製造方法。 - 前記光学フィルタ素子(7)は、前記基板貫通ビア(5)を形成する前に、前記誘電体層(6)の上に配置されることを特徴とする請求項7に記載の製造方法。
- 前記光学フィルタ素子(7)は、前記基板貫通ビア(5)を形成した後に、前記誘電体層(6)の上に配置されることを特徴とする請求項7に記載の製造方法。
- ナノオプティクスフィルタとして形成された組込フィルタ層(12)を、前記誘電体層(6)の中に配置する工程を更に備えることを特徴とする請求項7〜9のいずれかに記載の製造方法。
- 前記組込フィルタ層(12)は、前記基板貫通ビア(5)を形成する前に形成されることを特徴とする請求項10に記載の製造方法。
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EP13157432.9A EP2772939B1 (en) | 2013-03-01 | 2013-03-01 | Semiconductor device for detection of radiation and method of producing a semiconductor device for detection of radiation |
EP13157432.9 | 2013-03-01 | ||
PCT/EP2014/053551 WO2014131731A1 (en) | 2013-03-01 | 2014-02-24 | Semiconductor device for detection of radiation and method of producing a semiconductor device for detection of radiation |
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US (1) | US11107848B2 (ja) |
EP (1) | EP2772939B1 (ja) |
JP (1) | JP2016509374A (ja) |
KR (1) | KR101791765B1 (ja) |
CN (1) | CN105074929B (ja) |
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JP2022543543A (ja) * | 2019-08-12 | 2022-10-13 | エイエムエス-オスラム アーゲー | オプトエレクトロニクスデバイスおよびオプトエレクトロニクスデバイスを製造する方法 |
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KR20150061074A (ko) * | 2013-11-25 | 2015-06-04 | 에스케이하이닉스 주식회사 | 이미지 센서 및 그 제조방법 |
EP2889901B1 (en) * | 2013-12-27 | 2021-02-03 | ams AG | Semiconductor device with through-substrate via and corresponding method |
TWI581325B (zh) * | 2014-11-12 | 2017-05-01 | 精材科技股份有限公司 | 晶片封裝體及其製造方法 |
EP3024029B1 (en) * | 2014-11-19 | 2020-04-22 | ams AG | Method of producing a semiconductor device comprising an aperture array |
EP3032583B1 (en) * | 2014-12-08 | 2020-03-04 | ams AG | Integrated optical sensor and method of producing an integrated optical sensor |
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CN105074929B (zh) | 2018-06-05 |
KR20150122751A (ko) | 2015-11-02 |
US20160020238A1 (en) | 2016-01-21 |
WO2014131731A1 (en) | 2014-09-04 |
KR101791765B1 (ko) | 2017-10-30 |
US11107848B2 (en) | 2021-08-31 |
EP2772939B1 (en) | 2016-10-19 |
CN105074929A (zh) | 2015-11-18 |
EP2772939A1 (en) | 2014-09-03 |
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